JPH06120281A - Mold die and mold apparatus using thereof - Google Patents

Abstract

PURPOSE:To perform various kinds of marking simultaneously with mold without exchanging dies. CONSTITUTION:A pair of mold dies for forming the package of a semiconductor device by resin-molding are provided, in the upper die 1 out of the mold dies, with a marking part 3 equipped with many mark pins 3a, which are caused to protrude or retreat in the manner of corresponding to the contents of indication such as name, date of manufacture, etc., so that the stamp of a protruding or groove-shaped character, etc., can be formed simultaneously with mold.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molding technique, and more particularly to a technique effective for resin molding by disposing a semiconductor device in a pair of upper and lower molds.

[0002]

2. Description of the Related Art Conventionally, in the manufacture of semiconductor devices, a product in which leads and semiconductor chips are connected is molded with plastic and then transferred to a marking step where printing or laser engraving is performed. The product name, manufacturing date, trademark, and other markings are marked by.

By the way, if the molding step and the marking step are provided separately, one extra step is required, manufacturing efficiency is poor, and a dedicated person and a dedicated machine are required for the marking step, resulting in an increase in cost. In addition to the above, there are marks such as chipping and unclearness due to dust adhesion and dirt on the package surface.

For this reason, a technique has been proposed in which marking is simultaneously performed in the molding process. For example, in the technique disclosed in Japanese Patent Application Laid-Open No. 1-24874, a relief for desired print content is formed on a mold for molding, and a recessed groove corresponding to the print content is formed on the surface of the package for marking. Is going.

[0005]

According to the study by the present inventor, the conventional marking technique for forming a recessed groove in a mold according to the marking content is based on the product name, manufacturing date, and other display contents. When there is a change, the mold itself must be replaced, and since the marking work is performed after the cleaning treatment, there is a problem that the cost is increased and the workability and the productivity are poor. In addition, for the marking process, a dedicated person must be assigned to perform management and work, which requires an installation space for equipment and causes an operating cost.

[0006] That is, an object of the present invention is to provide a molding technique capable of performing all markings at the same time as the molding without replacing the mold.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0008]

Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows.

That is, a pair of molding dies for forming a package of a semiconductor device by resin molding, at least one of which has a surface of the package as a reference corresponding to display contents such as a product name and a manufacturing date. A marking portion having a mark pin capable of projecting or retracting is provided on the.

[0010]

According to the above-mentioned means, the pin-shaped body of the marking portion provided in the mold is set so as to project or recede from the other surface in correspondence with each dot of the print content, and the concave portion or It is inscribed as protruding characters and symbols. As a result, marking can be performed at the same time in the molding process, and it is possible to reduce costs and improve productivity.

[0011]

Embodiment 1 FIG. 1 is a front sectional view showing a molding die according to the present invention.

The mold is composed of an upper mold 1 and a lower mold 2 having a cavity 4 formed inside, and a marking portion 3 for projecting and retracting in accordance with the content of the inscription is formed on a part of the upper mold 1. It is provided. The marking portion 3 is made of a material having the same thermal expansion coefficient as that of the main material of the mold so that the problem due to the temperature difference does not occur.

Further, the marking unit 3 has a mechanism similar to that of the marking unit of the dot printer, and for example, 5 × 7 dots represent one character and one dot corresponds to one mark pin 3a.
(Pin-shaped body) is in charge. Therefore, 40 pins are assigned to one character, and if the mark is made with 10 characters, 400 mark pins are required. In FIG. 1, only 7 dots in the vertical direction for one character are shown.

In the case where the marking formed on the surface of the package is a recess, as shown in FIG. 2, the mark pin 3a of the corresponding dot (its diameter is, for example, 0. Only about 1 to 0.12 mm) protrudes from other mark pins 3a (for example, several μ to several tens of μ)
You can do it. FIG. 2 shows an example in which the mark pins 3a corresponding to the letters "H" and "N" (here, the case where the marking portion is a quadrangle is shown) are projected.

In this way, the marking portion 3 is set in advance according to the product name, the manufacturing date, and other display contents, and the semiconductor chip having leads connected to the cavities 4 of the upper mold 1 and the lower mold 2 is formed. When the upper mold 1 and the lower mold 2 are installed and the resin is pressed into the cavity 4, the marking of the character content set by the marking unit 3 can be obtained.

The drive (projection / retraction) of the mark pin 3a is
A mechanism for moving one by one by hydraulic pressure or air pressure, or a mechanism for electrically driving can be adopted.

When electrically performed, a driving means (only one mark pin is shown) having a structure as shown in FIG. 3 can be used. A stopper 3 is provided at the driving side end of the mark pin 3a.
b is provided, and the spring 5 is externally fitted inside the stopper 3b.

The spring 5 is arranged between the stopper 3b and the stopper plate 6 and always biases the mark pin 3a to the left in the drawing.

One end of the drive lever 7 is disposed so as to face the stopper 3b, and the other end is rotatably supported by a fulcrum 8. A magnetic pole end of a core 9 having a "U" -shaped cross section is arranged facing the drive lever 7 near the fulcrum 8, and a coil 10 for forming an electromagnet is wound around the core 9.

In the configuration of FIG. 3, when the coil 10 is energized, the core 9 is excited and the drive lever 7 is attracted,
The drive lever 7 is rotated clockwise in the drawing. When the drive lever 7 rotates, the tip of the drive lever 7 stops at the stopper 3b.
The mark pin 3a and the spring 5
Move to the right in the figure against. This movement amount corresponds to the protrusion amount shown in FIG.

FIG. 4 is a plan view of a semiconductor device showing the result of marking according to the present invention.

A package 1 of a semiconductor device 11 (here, a dual in-line package is shown as an example, a state after a lead is bent) is provided with a package 12 formed by resin molding in the molding process.
The mark pin 3 set as shown in FIG.
The product name “HN62321BPC” according to the shape of a is formed as the marking 13.

Although the display is formed in the concave portion on the surface of the package 12 in the above embodiment, the display may be formed in the convex portion. In this case, the mark pin 3a related to marking may be retracted (retracted) from the other mark pin 3a.

[0024]

Second Embodiment FIG. 5 is a sectional view showing an example of marking according to the present invention. Note that, in FIG. 5, the same reference numerals are used for the same components as those shown in FIG. 1, and thus duplicated description will be omitted here.

While the marking portion is provided only on the upper surface of the package in the above-described embodiment, in this embodiment, the marking portion 3 provided on the upper mold 1 and the lower portion are provided so that the marking can be simultaneously performed on the lower surface of the package. The mold 2 is also characterized in that the marking portion 14 is provided. The configuration of the marking unit 14 is exactly the same as that of the marking unit 3, and the required number of character mark pins are prepared.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, the mark pin driving mechanism is not limited to the structure shown in FIG. 3, and may have any structure as long as only the necessary mark pins can be driven individually.

The cross-sectional shape of the tip end surface of each mark pin 3 is not limited to the quadrangle as shown in FIGS.
It may be circular as shown in FIG. 6 or 6 as shown in FIG.
It may be a polygon such as a prism or an octagon (which is one of preferable shapes because burrs are less likely to occur than the circle in FIG. 7). The shape of the mark pin from the front may be a shape such as an acute angle (Fig. A) or a semicircular convex surface or concave surface (Figs. B and c) as shown in each drawing of Fig. 9. Note that FIG.
In each of the figures, mark pins having a circular cross section are shown.

Further, in the above embodiment, one character is formed by assembling a plurality of mark pins 3a.
As shown in FIG. 10, one pin has a letter (or a number or a symbol) with an inscription (the surface of which is mirror-finished). The type member 15 (its thickness is the same as the bundle of several mark pins 3a). It becomes).

Further, in each of the above embodiments, if all the mark pins 3a of the marking portion 3 have the same height, they can be used as a normal mold.

In the above description, the case where the invention made by the present inventor is mainly applied to the semiconductor device which is the field of application of the invention has been described. However, the invention is not limited to this, and may be applied to a plastic product, for example. Also, it can be applied to the case where the product numbers are serially assigned.

[0032]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.
It is as follows.

That is, a pair of molding dies for forming a package of a semiconductor device by resin molding, at least one of which corresponds to the display contents such as the product name and the date of manufacture, and the surface of the package is used as a reference. Since a marking part with a mark pin that can be projected or retracted is provided on the bottom, cost reduction (reduction of capital investment, operational management cost, reduction of work personnel, etc.) and productivity improvement can be achieved. It becomes possible to plan.

[Brief description of drawings]

FIG. 1 is a front sectional view showing a molding die according to the present invention.

FIG. 2 is a perspective view showing an operating state of a mark pin according to the present invention.

FIG. 3 is a cross-sectional view showing details of a mark pin drive mechanism.

FIG. 4 is a plan view of a semiconductor device showing a result of marking according to the present invention.

FIG. 5 is a sectional view showing an example of marking according to the present invention.

FIG. 6 is a plan view showing a first example of a marking section according to the present invention.

FIG. 7 is a plan view showing a second example of the marking section according to the present invention.

FIG. 8 is a plan view showing a third example of the marking portion according to the present invention.

FIG. 9 is a front view showing an example of the shape of the tip of a mark pin.

FIG. 10 is a perspective view showing a type member that can be used instead of the mark pin.

[Explanation of symbols]

 1 Upper mold 2 Lower mold 3 Marking part 3a Mark pin 3b Stopper 4 Cavity 5 Spring 6 Stopper plate 7 Drive lever 8 Support point 9 Core 10 Coil 11 Semiconductor device 12 Package 13 Marking 14 Marking part 15 Type member

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Claims (5)

[Claims] 1. A pair of molding dies for forming a package of a semiconductor device by resin molding, wherein at least one of the mold dies is associated with display contents such as a product name and a manufacturing date as a reference of the surface of the package. A molding die, comprising a marking portion provided with a pin-shaped body capable of projecting or retracting. 2. The pin-shaped body has a cross-sectional shape of a quadrangle, a circle or a polygon.
Mold mold described. 3. The pin-shaped body has an acute tip end shape,
The molding die according to claim 1, wherein the molding die has a concave or convex curved surface. 4. The type member having characters or the like engraved on the end surface is used in place of the pin-shaped body.
Mold mold described. 5. The molding apparatus according to claim 1, further comprising driving means for transmitting a driving force from a driving source to each of the pin-shaped bodies.