JP3180521B2 - Displaying method for electronic parts using printing relief printing - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION This invention, electrodeposition was arranging a plurality
Use a letterpress printing plate on each surface of the
The present invention relates to a method of giving a display to an electronic component by giving a display by printing .

[0002]

2. Description of the Related Art FIG. 5 schematically shows a conventional printing process for giving appropriate indications to a plurality of electronic components.

Referring to FIG. 5, a plurality of electronic components 1 to be displayed are held by a holder 2 in a state of being arranged in a matrix. On the other hand, an elevating head 3 that can move up and down is positioned above the holder 2, and a printing relief plate 5 is mounted on a lower surface of the elevating head 3 via a holding plate 4. The printing relief plate 5 forms a plurality of convex stamped surfaces 6 arranged in a matrix corresponding to each of the electronic components 1. A convex surface corresponding to a display to be given to each of the electronic components 1 is formed on each stamp surface 6.

[0004] In recent years, ultraviolet curable resin is often used for the printing relief plate 5 described above, and the printing relief plate 5 made of such a material is in the form of a soft sheet as a whole. Therefore, the printing relief plate 5 is stuck on the holding plate 4 with a double-sided pressure-sensitive adhesive sheet to supplement its rigidity.

When printing is to be performed on the electronic component 1, after the ink is applied to the stamp surface 6, the lifting head 3 is lowered and the stamp surface 6 comes into contact with the corresponding electronic component 1. As a result, the ink on the stamp surface 6 is transferred onto the electronic component 1. After finishing printing in this way, the lifting head 3 is raised. At this time, a cover mask provided with an opening corresponding to each of the electronic components 1 may be arranged to cover the electronic components 1 in order to prevent the electronic components 1 from adhering to the stamp surface 6.

[0006]

In the above-described printing process, it is impossible to give a display at an appropriate position on the electronic component 1 unless the positioning accuracy of the printing relief plate 5 with respect to the electronic component 1 is high. In particular, the smaller the electronic component 1 is, the higher the positioning accuracy of the printing relief plate 5 is required.

Conventionally, after the printing relief plate 5 is attached to the holding plate 4, the holding plate 4 is attached to the elevating head 3, so that the positioning accuracy of the holding plate 4 with respect to the elevating head 3 becomes a problem. This positioning is performed with the stamp face 6 in a state where the above-described cover mask is arranged so as to cover the electronic component 1.
Is positioned in the opening of the cover mask.
Then, the holding plate 4 is arranged, and then the lifting head 3 is lowered, and in this state, the holding plate 4 is attached to the lifting head 3.

However, in the above-described method, it is difficult to obtain high positioning accuracy of the printing relief plate 5, and when the electronic component 1 is very small, it may not be possible to give a display by printing.

Therefore, an object of the present invention is to provide a display on an electronic component using a printing relief plate, which can solve the above-mentioned problems.
The purpose is to provide an application method.

[0010]

SUMMARY OF THE INVENTION A printing relief plate according to the present invention
Display method of applying to an electronic component using, in order to solve the technical problems described above, it of electronic components plurality arranged
For each, a predetermined display by printing using a letterpress printing
A method of arranging and storing a plurality of electronic components.
Process for each electronic component
To correspond to the arrangement of multiple electronic components
Printing having a plurality of convex stamping surfaces arranged to
A print head that can move letterpress to multiple electronic components
And the process of positioning and mounting
Move toward the electronic component and
Is brought into contact with each corresponding electronic component,
Providing a predetermined display to the component. Printing letterpress
Is a cured UV curable resin that gives multiple stamped surfaces
A plate material comprising a base plate having a plurality of positioning holes, and made of a rigid material,
The base plate protrudes from the surface on which the plate material is provided.
It was, and a pin for a plurality of positioning, has a predetermined positional relationship between a plurality of alignment pins are several positioning holes double and pin several alignment double But
By having a predetermined positional relationship with the convex seal face, resulting in a convex seal face and several positioning holes double it has become a predetermined positional relationship, the printing letterpress the print head
In the process of positioning and mounting, multiple positioning
Holes into the pins provided on the print head.
More particularly, the base plate is aligned with the print head .

[0011]

[0012]

According to the present invention, there is provided a method for providing display of an electronic component according to the present invention.
The printing relief plate obtained is provided with rigidity by the base plate and can be positioned using a plurality of positioning holes provided in the base plate.

[0013]

[0014]

Therefore, the electronic component according to the present invention has
According to the display providing method, the plurality of positioning holes provided in the base plate are inserted into the pins provided in the print head.
Each of the plate materials held on the rigid base plate
The stamp surface can be positioned with high accuracy with respect to each corresponding electronic component . Therefore, even if the plurality of electronic components on which the display is printed using the printing relief plate is extremely small, the display can be appropriately given.

Further, since the printing plate provided in the printing letterpress is held by the base plate, the printing letterpress can be made sufficiently rigid. Therefore, handling such as attachment and removal of the printing letterpress can be performed. It will be easier.

[0016]

[0017]

FIG. 1 shows several steps involved in a method for producing a printing relief plate 11 according to an embodiment of the present invention. In carrying out the process shown in FIG. 1, the base plate 12 shown in FIG. 2 and the original plate 13 shown in FIG. 3 are prepared in advance.

Referring to FIG. 2, base plate 12 is made of a rigid material such as aluminum. The base plate 12 has, for example, a rectangular shape.
A plurality of, for example, two positioning pins 14 are provided to protrude along one side thereof. A plurality of, for example, four positioning holes 15 having a predetermined positional relationship with the positioning pins 14 are provided near four corners of the base plate 12.

Referring to FIG. 3, master 13 is made of, for example, polyethylene terephthalate, has a film shape, and has a square shape as a whole. The original 13 has a position corresponding to the position of the positioning pin 14 described above.
For example, two alignment marks 16 are formed.
The form of the alignment mark 16 is arbitrary. Further, the negative image 18 corresponding to the convex stamp surface 17 formed on the printing relief plate 11 to be obtained (see FIG. 1 (4)) is given to the original plate 13 with a predetermined positional relationship with the alignment mark 16. Can be In the drawings, the stamp face 17 and the negative image 18 represent the letter "A", but this is only for simplification of the drawing, and the indications of the stamp face 17 and the negative image 18 are optional. Yes, and may be further complicated. The negative images 18 are arranged in a matrix on the master 13.

The original 13 is provided with a positioning hole 19 at the position of the positioning mark 16 as shown in FIG. These positioning holes 19 have the same or substantially the same diameter as the positioning pins 14 provided on the base plate 12, and are formed, for example, by a puncher with an image sensor. Note that one of the two positioning holes 19 may be an oval instead of a circle.

Each step shown in FIG. 1 is performed using the base plate 12 and the original plate 13 thus prepared.

First, as shown in FIG. 1A, a resin plate 20 made of an uncured UV-curable resin is fixed on the surface of the base plate 12 on which the positioning pins 14 are provided. This fixation is achieved, for example, by sticking the resin plate 20 on the base plate 12 with a double-sided adhesive sheet.

Next, as shown in FIG.
The original 13 is placed on the “0”. At this time, the positioning pins 14 of the base plate 12 are inserted into the respective positioning holes 19 of the original 13, whereby the base plate 12 and the original 1 are aligned.
3 is aligned.

In the state shown in FIG. 1B, the original 13 is irradiated with ultraviolet light, and
The resin plate 20 is exposed. As a result, the resin plate 20 is cured in a region corresponding to the negative image 18.
FIG. 1C shows a state where the original 13 has been removed. As shown in FIG. 1C, the resin plate 20 has a cured region 21 corresponding to the negative image 18 and an uncured portion 22 other than the cured region 21.

Next, the uncured portion 22 is made of, for example, water,
Washed and removed by a liquid such as alcohol. FIG. 1 shows a state in which the removal of the uncured portion 22 is completed.
This is shown in (4). FIG. 1 (4) shows a printing relief plate 11 to be obtained. A printing plate 23 for providing a convex stamped surface 17 made of a cured ultraviolet-curable resin is provided on a base plate 12. In this printing relief plate 11,
The stamp faces 17 are arranged in a matrix. In addition,
In FIG. 1 (4), the illustration of the double-sided PSA sheet is omitted. Also, in FIG. 1 (4), all the uncured portions 22 of the ultraviolet curable resin other than the plate material 23 are removed, but the base plate 1 in the thickness direction of the resin is removed.
Alternatively, a thin region near 2 may be left.

Using the printing relief plate 11 thus obtained, a printing process as shown in FIG. 4 is performed.

Referring to FIG. 4, a plurality of electronic components 1 to be displayed are held by holder 2 in a state of being arranged in a matrix, as in the case shown in FIG. On the other hand, a vertically movable head 24 is arranged above the electronic component 1, and the above-described printing relief 11 is mounted on the lower surface thereof. The printing relief plate 11 includes a lifting head 24.
By receiving the positioning pins 25 provided in the base plate 12 into the positioning holes 15 provided in the base plate 12, the positioning with respect to the elevating head 24 is performed with high accuracy. The printing relief plate 11 may be positioned with reference to the outer periphery of the base plate 12.

As described above, the printing relief plate 11 is moved up and down the head 2
The display corresponding to the stamp face 17 is given on each electronic component 1 by lowering and raising the lifting head 24 in a state where the electronic component 1 is mounted on the electronic component 1.

In the printing process described above, the positioning pins 14 provided on the base plate 12 are not used. Therefore, the positioning pins 14 may be removed after obtaining the desired printing relief plate 11.

The overall shape of the printing relief plate 11 is not limited to a rectangular shape as shown, but may be any shape such as a circle.

Further, the printing relief plate according to the present invention can be widely applied to printing in other fields, not limited to the case where a display is given to an electronic component as in the above-described embodiment.

[Brief description of the drawings]

FIG. 1 is a perspective view showing some steps included in a method for manufacturing a printing relief plate 11 according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a base plate 12 prepared for obtaining the printing relief plate 11 shown in FIG. 1 alone.

FIG. 3 is a perspective view showing an original plate 13 prepared for obtaining the printing relief plate 11 shown in FIG. 1 alone;

4 is a printing relief plate 11 obtained by the method shown in FIG.
FIG. 4 is a cross-sectional view schematically showing a printing step performed using the method.

FIG. 5 is a cross-sectional view schematically showing a printing process performed using a conventional printing relief plate 5;

[Explanation of symbols]

 REFERENCE SIGNS LIST 11 printing relief plate 12 base plate 13 original plate 14 positioning pin 15 positioning hole 17 stamped surface 18 negative image 19 positioning hole 20 resin plate 21 cured region 22 uncured portion 23 plate material 24 elevating head 25 positioning pin

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-59-42548 (JP, A) JP-A-2-301479 (JP, A) JP-A-61-108556 (JP, A) JP-A-62 56967 (JP, A) Japanese Utility Model Application Hei 2-117139 (JP, U) Japanese Utility Model Application Showa 60-70845 (JP, U) Japanese Utility Model Application Showa 57-29361 (JP, U) (58) Fields surveyed (Int. ⁷ , DB name) B41F 17/36 G03F 7/00 502 G03F 9/00

Claims (1)

(57) [Claims] 1. Each of a plurality of arranged electronic components
On the other hand, given a predetermined display by printing using a printing relief plate
With a method, the steps of holding by arranging a plurality of electronic components, the display predetermined for each of the plurality of electronic components
In order to provide, it corresponds to the arrangement of the plurality of electronic components.
Printing relief plate having a plurality of convex stamp faces arranged in
Print head movable with respect to the plurality of electronic components
Positioning and mounting, and moving the print head toward the plurality of electronic components.
By moving each of the plurality of stamp faces
By contacting the electronic components,
Providing a constant display, wherein the printing relief plate is a cured ultraviolet-curing resin that provides the plurality of stamped surfaces.
A plate material is provided , and has a plurality of positioning holes, and is made of a rigid material, and a base plate, of the base plate , protruding on a surface on which the plate material is provided.
And a plurality of positioning pins provided, wherein the plurality of positioning pins have a predetermined positional relationship with the plurality of positioning holes, and the plurality of positioning pins are provided. As a result, the convex pin and the plurality of positioning holes have a predetermined positional relationship, and the printing pin has a predetermined positional relationship with respect to the convex stamp. Position the letterpress in the print head and attach it
In the step, the plurality of positioning holes are
By inserting the pins into the print head,
A method for giving a display to an electronic component using a printing relief plate, wherein the base plate is aligned with a print head .