JPS61226731A - Manufacture of thin film transistor liquid crystal display - Google Patents
Manufacture of thin film transistor liquid crystal displayInfo
- Publication number
- JPS61226731A JPS61226731A JP60068245A JP6824585A JPS61226731A JP S61226731 A JPS61226731 A JP S61226731A JP 60068245 A JP60068245 A JP 60068245A JP 6824585 A JP6824585 A JP 6824585A JP S61226731 A JPS61226731 A JP S61226731A
- Authority
- JP
- Japan
- Prior art keywords
- film
- electrode
- cvd
- transparent conductive
- liquid crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
【発明の詳細な説明】
〔概要〕
本発明は、薄膜トランジスタ液晶ディスプレイの製造工
程中のP−CVD(プラズマ−ケミカルベーパデポジシ
ョン)膜成膜時−二おける下地透明導電膜の影響(二よ
るP−CVD膜の白濁、膜質の劣化を防止するためのも
ので、透明導電膜を保護膜でカバーした後C二P−CV
D膜の成膜を行うよう6二して問題の解決を図っている
。DETAILED DESCRIPTION OF THE INVENTION [Summary] The present invention relates to the effects of the underlying transparent conductive film on the formation of P-CVD (plasma-chemical vapor deposition) films during the manufacturing process of thin film transistor liquid crystal displays. - This is to prevent clouding of the CVD film and deterioration of film quality, and after covering the transparent conductive film with a protective film, C2P-CV
We are trying to solve the problem by forming a D film.
本発明は薄膜トランジスタ液晶ディスプレイの製造方法
に関するものである。The present invention relates to a method of manufacturing a thin film transistor liquid crystal display.
液晶ディスプレイには、薄膜トランジスタをスイッチン
グ素子とし゛〔用い、表示電極として透明導電膜を用い
るアクティブマトリックス型のものがある。Some liquid crystal displays are of an active matrix type that use thin film transistors as switching elements and transparent conductive films as display electrodes.
この種の従来の薄膜トランジスタ液晶ディスプレイの製
造工程を第2図に示す。本図は薄膜トランジスタを備え
た一方の基板の1画素分を示したもので、液晶ディスプ
レイの製造に際しては、まず第2図(a)に示すように
、ガラス基板1上にCrのゲート電極2と透明電極(表
示電極に相当する透明導1lic膜)3を形成する。次
響二、この上I:第2図(b)に示すよう4二、グロー
放電装置でP−CVD膜の窒化シリコン(SIN)膜(
絶縁体層)4.アモルファスシリコン(a−81)膜(
半導体層)5を連続成膜する。その後、第2図(e)に
示すよう番;、ソース電極6.ドレイン電極7を形成し
て素子分離を行ない、透明電極5上のSIN 5% v
a−+3i膜をエツチングC;より除去する。その後
、この基板と、表面に透明導電膜、絶縁膜、配向膜が形
成された他方の基板との間迄二液晶を挾持させて液晶デ
ィスプレイが構成される。The manufacturing process of this type of conventional thin film transistor liquid crystal display is shown in FIG. This figure shows one pixel of one substrate equipped with a thin film transistor.When manufacturing a liquid crystal display, first a Cr gate electrode 2 is placed on a glass substrate 1, as shown in FIG. 2(a). A transparent electrode (a transparent conductive 1LIC film corresponding to a display electrode) 3 is formed. Next, I: As shown in Figure 2(b), 42, the silicon nitride (SIN) film of the P-CVD film (
Insulator layer)4. Amorphous silicon (a-81) film (
Semiconductor layer) 5 is continuously formed. Thereafter, as shown in FIG. 2(e), the source electrode 6. A drain electrode 7 is formed to perform element isolation, and the SIN on the transparent electrode 5 is 5% v.
The a-+3i film is removed by etching C;. Thereafter, a liquid crystal display is constructed by sandwiching two liquid crystals between this substrate and the other substrate on which a transparent conductive film, an insulating film, and an alignment film are formed.
このように、従来は透明導電膜上C二じか(二P−CV
D膜を成膜しているので、透明導電膜ζ;含まれている
インシジクム、錫等の不純物が成膜の特:二初期段階に
おいて悪影響を及ぼし、P−CVD膜が白濁し膜質が劣
化してしまう。In this way, conventionally, two P-CV (two P-CV)
Since the D film is formed, impurities such as incidium and tin contained in the transparent conductive film ζ have an adverse effect on the initial stage of film formation, causing the P-CVD film to become cloudy and the film quality to deteriorate. I end up.
本発明は上述の問題点を解決するためのもので、第1図
6二例示したように、透明導電膜を保護膜でカバーした
後その上−二プラズマCVD膜の連続成膜を行って中間
層を形成するととも薯;、透明導電膜上のプラズマCV
D膜除去後6二該保護膜な除去する工程を採用している
。保護膜は、透明導電膜と選択エツチング性のある材料
、例えばCr、Ta、Mo等で形成する。またa−8i
膜、 810.等の絶縁膜により保映膜を形成し−〔も
良い。The present invention is intended to solve the above-mentioned problems, and as shown in FIG. When forming a layer, plasma CV on a transparent conductive film
After removing the D film, a step of removing the protective film is adopted. The protective film is made of a material that is selectively etched with the transparent conductive film, such as Cr, Ta, Mo, or the like. Also a-8i
membrane, 810. It is also possible to form a reflection film using an insulating film such as.
プラズマCVD膜の成膜が保護膜上6二行われ、成腰時
砿;透明導電膜がプラズマ砿;さらされないため、成膜
されたプラズマCVD膜の白濁、膜質劣化を防止するこ
とができる。The plasma CVD film is formed on the protective film 62 times, and the transparent conductive film is not exposed to the plasma during the formation period, so that cloudiness and film quality deterioration of the formed plasma CVD film can be prevented.
次(二、第1図(二関連して本発明の詳細な説明する。 The present invention will now be described in detail with reference to FIG.
第1図は本発明の薄膜トランジスタ液晶ディスプレイの
製造工程図(1画素分を示す)である。FIG. 1 is a manufacturing process diagram (showing one pixel) of the thin film transistor liquid crystal display of the present invention.
薄膜トランジスタ液晶ディスプレイの製造儂=際し−C
#工、まず第1図(a)lニー示すよう6二、ガラス基
板11上にCrのゲート電極(上部電極)12と透明電
極(表示電極に相当するITOの透明導電膜)13とを
形成する。Manufacture of thin film transistor liquid crystal display
First, as shown in FIG. 1(a), a Cr gate electrode (upper electrode) 12 and a transparent electrode (ITO transparent conductive film corresponding to a display electrode) 13 are formed on a glass substrate 11. do.
次に、第1図(b)ζ二示すようC二、透明電極16を
カバーするCr薄膜の保護膜14を形成する。Next, as shown in FIG. 1(b) ζ2, a protective film 14 of a thin Cr film covering the transparent electrode 16 is formed.
次C二、′M1図(e)≦二示すように、これらの表面
区ニゲ四−放電装置でP−CVD膜のSiN膜(絶縁体
層)15 、 a−8l膜(半導体層)16を連続成膜
して中間層を形成する。Next, as shown in Figure (e)≦2, the P-CVD film SiN film (insulator layer) 15 and A-8L film (semiconductor layer) 16 are formed using these surface area discharge devices. The intermediate layer is formed by continuous film formation.
次ζ;、第1図(d)(二示すよう1;、この上(=ゲ
ート電+lA121=対応する上部電極であるソース電
417゜ドレイン電極18を形成して素子分離を行い、
透明電極上のa−8116、SIN膜1膜上5ツチング
1二より除去する。Next ζ;, FIG. 1(d) (2) As shown in 1;, on top of this (= gate electrode + lA121 = corresponding upper electrode source electrode 417° drain electrode 18 is formed to perform element isolation,
It is removed from a-8116 on the transparent electrode, 5 on the SIN film 1 and 12 on the SIN film.
その後、第1図(・)に示すようC二、透明電極13上
の保護膜14をエッチングにより除去する。Thereafter, as shown in FIG. 1(-), C2, the protective film 14 on the transparent electrode 13 is removed by etching.
このよう爲、本発明では、透明電極16を保護1114
でカバーした状態でP−CVD膜の成膜が行われるため
、成膜時に透明電極13がプラズマ6:さらされること
はない。従って、従来問題となっていたP−CVD膜の
白濁、膜質劣化を防止することができ、良質膜の成膜が
可能ζ二なる。Thus, in the present invention, the transparent electrode 16 is protected by the protection 1114.
Since the P-CVD film is formed while being covered with the plasma 6, the transparent electrode 13 is not exposed to the plasma 6 during film formation. Therefore, clouding of the P-CVD film and deterioration of film quality, which have been problems in the past, can be prevented, and a high quality film can be formed.
上述の説明ではCr薄膜を保護膜として用いる例C;つ
いて述べたが、この他に透明導電膜(透明電極)と選択
エツチング性のあるTa、Mo等を保護膜として用いる
ことができる。In the above description, Example C is described in which a Cr thin film is used as the protective film, but in addition to this, a transparent conductive film (transparent electrode) and a selectively etchingable material such as Ta, Mo, etc. can be used as the protective film.
また、保護膜としては、金属薄膜だけでなく、透明導電
膜と選択エツチング性のあるα−8t膜、 810゜絶
縁膜等を用いることもできる。Further, as the protective film, not only a metal thin film but also an α-8t film, an 810° insulating film, etc., which has selective etching properties with a transparent conductive film, can be used.
以上述べたようζ;、本発明(;よれば、透明導電膜の
影蕃によるP −CVD膜の白濁、膜質劣化を防止する
ことができるため、良質のP−CVD膜を成膜すること
が可能となり、裂造歩留まりが大幅−二面上する。As described above, according to the present invention, it is possible to prevent clouding of the P-CVD film and deterioration of the film quality due to the influence of the transparent conductive film, so it is possible to form a high-quality P-CVD film. This makes it possible to significantly increase the fabrication yield by two orders of magnitude.
第1図(&)〜(6)は本発明の実施例を示す薄膜トラ
ンジスタ液晶ディスプレイの製造工程図、第2図ta)
〜(c)は従来の薄膜トランジスタ液晶ディスプレイの
製造工程図で、
図中、
11はガラス基板、
12はゲートIIE極(下部電極)、
13は透明電極(表示電極である透明導電膜)、14は
保護層、
15はSIN膜(絶縁体層)、
16はSIN膜とともζ二中間層を形成するa−81膜
(半導体層)、
17はソース電極(上部電極)、
1日はドレイン電極(上部電極)である。
本発明の厚原トランジスタ液鳥ディスプレイの裂造工!
I図第1図Figures 1 (&) to (6) are manufacturing process diagrams of a thin film transistor liquid crystal display showing an embodiment of the present invention, and Figure 2 (ta)
~(c) is a manufacturing process diagram of a conventional thin film transistor liquid crystal display, in which 11 is a glass substrate, 12 is a gate IIE electrode (lower electrode), 13 is a transparent electrode (transparent conductive film that is a display electrode), and 14 is a Protective layer, 15 is a SIN film (insulator layer), 16 is an a-81 film (semiconductor layer) that forms a ζ2 intermediate layer with the SIN film, 17 is a source electrode (upper electrode), 1 is a drain electrode ( upper electrode). Craftsmanship of the Atsuhara transistor liquid bird display of the present invention!
I-Figure 1
Claims (1)
もに表示電極として透明導電膜を用い、前記薄膜トラン
ジスタの上部、下部電極の間にプラズマCVD膜の連続
成膜、エッチングにより形成された中間層を備えたアク
ティブマトリックス液晶ディスプレイの製造工程におい
て、 前記透明導電膜を該透明導電膜と選択エッチング性のあ
る保護膜でカバーし、該透明導電膜がプラズマにさらさ
れないようにして前記中間層を形成するとともに、その
後前記保護膜を除去する工程を含むことを特徴とする薄
膜トランジスタ液晶ディスプレイの製造方法。[Claims] A thin film transistor is used as a switching element, a transparent conductive film is used as a display electrode, and an intermediate layer formed by continuous deposition and etching of a plasma CVD film is provided between the upper and lower electrodes of the thin film transistor. In the manufacturing process of an active matrix liquid crystal display, the intermediate layer is formed by covering the transparent conductive film with a protective film that is selectively etched to prevent the transparent conductive film from being exposed to plasma; A method for manufacturing a thin film transistor liquid crystal display, comprising the step of subsequently removing the protective film.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60068245A JPS61226731A (en) | 1985-03-30 | 1985-03-30 | Manufacture of thin film transistor liquid crystal display |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60068245A JPS61226731A (en) | 1985-03-30 | 1985-03-30 | Manufacture of thin film transistor liquid crystal display |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61226731A true JPS61226731A (en) | 1986-10-08 |
Family
ID=13368185
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60068245A Pending JPS61226731A (en) | 1985-03-30 | 1985-03-30 | Manufacture of thin film transistor liquid crystal display |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61226731A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7632694B2 (en) * | 2004-06-15 | 2009-12-15 | Taiwan Tft Lcd Association | Manufacturing method for a TFT electrode for preventing metal layer diffusion |
-
1985
- 1985-03-30 JP JP60068245A patent/JPS61226731A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7632694B2 (en) * | 2004-06-15 | 2009-12-15 | Taiwan Tft Lcd Association | Manufacturing method for a TFT electrode for preventing metal layer diffusion |
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