JPS6122257U

JPS6122257U - Electronic component soldering equipment

Info

Publication number: JPS6122257U
Application number: JP10737684U
Authority: JP
Inventors: 富美雄門馬; 安宍戸; 三雄豊田
Original assignee: アルプス電気株式会社
Priority date: 1984-07-16
Filing date: 1984-07-16
Publication date: 1986-02-08

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図は本考案の電子部品の半田付け装置の実施例を示
す概念的側面図、第２図は半田掻き取り装置の具体例を
示す分解斜視図、第３図は半田付けを要する電子部品の
半田付け前の様子を示す斜視図、第４図はデイツピング
によってシールド板に付着する有害半田の様子を模式的
に示す縦断面図、第５図は従来の半田吸取作業の様子を
示す縦断面図である。１１・・・外枠、１２・・・電子部品、１３・・・プリ
ント基板、１３ｄ・・・半田付け面、１４・・・シール
ド板、１４ｂ・・・開口、１５・・・有害半田、２０・
・・搬送ライン、２１・・・溶融半田槽、２２・・・デ
ィッピングエ程、２３・・・有害半田除去工程、２４・
・・半田噴流口、２５・・・有害半田除去装置、２６・
・・掻き取りブロック、２７・・・掻き取り板、３０・
・・保持台、３１・・・取付板部、３２・・・保持部。Fig. 1 is a conceptual side view showing an embodiment of an electronic component soldering device of the present invention, Fig. 2 is an exploded perspective view showing a specific example of a solder scraping device, and Fig. 3 is an electronic component that requires soldering. Fig. 4 is a vertical cross-sectional view schematically showing the state of harmful solder adhering to the shield plate by dipping, and Fig. 5 is a vertical cross-sectional view showing the state of conventional solder blotting work. It is a diagram. DESCRIPTION OF SYMBOLS 11... Outer frame, 12... Electronic component, 13... Printed circuit board, 13d... Soldering surface, 14... Shield plate, 14b... Opening, 15... Harmful solder, 20・
... Conveyance line, 21... Melting solder tank, 22... Dipping process, 23... Harmful solder removal process, 24...
...Solder jet port, 25...Harmful solder removal device, 26.
・・Scraping block, 27 ・・Scraping board, 30・
... Holding base, 31... Mounting plate section, 32... Holding section.

Claims

[Scope of utility model registration request]

(1) A soldering device that dips a lead terminal of an electronic component and a board into which the lead terminal is inserted and temporarily fixed on a molten solder bath, the board having a soldering surface facing downward. In the soldering apparatus for electronic components, which is transported onto the molten solder tank with a shield plate having an entry opening for molten solder arranged on the lower side of the molten solder tank, on the post-process side of the dipping process on the molten solder tank, An apparatus for soldering electronic components, comprising a harmful solder removal device having a solder scraping plate that makes elastic contact with the shield plate.

(2) Utility Model Registration Scope of Claims In paragraph 1, the harmful solder removal device comprises a scraping block holding a solder scraping plate, and a holding stand that holds the scraping block and is supported by a molten solder tank. An electronic component soldering device consisting of:

(3) Scope of Utility Model Registration The device for soldering electronic components according to claim 1 or 2, wherein the solder scraping plate is made of a rubber material such as fluorine rubber.