JPS6122237A - Apparatus for inspecting appearance of object - Google Patents

Apparatus for inspecting appearance of object

Info

Publication number
JPS6122237A
JPS6122237A JP60103739A JP10373985A JPS6122237A JP S6122237 A JPS6122237 A JP S6122237A JP 60103739 A JP60103739 A JP 60103739A JP 10373985 A JP10373985 A JP 10373985A JP S6122237 A JPS6122237 A JP S6122237A
Authority
JP
Japan
Prior art keywords
pattern
signal
flaw
mask pattern
inspected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60103739A
Other languages
Japanese (ja)
Inventor
Kiyoshi Nakagawa
清 中川
Joichiro Kageyama
景山 條一郎
Kazuhiko Eguchi
江口 一彦
Shigeaki Nakajima
中嶋 重明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP60103739A priority Critical patent/JPS6122237A/en
Publication of JPS6122237A publication Critical patent/JPS6122237A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N21/95607Inspecting patterns on the surface of objects using a comparative method

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To enhance the reliability of inspection while making it possible to perform high speed inspection, by comparing pattern information, which formed the basis of the fabrication of a mask pattern, with the mask pattern. CONSTITUTION:The reference pattern from a magnetic tape 18 storing an information signal showing a pattern to be baked to a photomask is two-dimensionally regenerated in memory 9 while converted to a binary signal and, at the same time, a mask pattern to be inspected is regenerated in memory 8 and both signals are compared in a comparing circuit. If the mask pattern to be inspected has a flaw 19, the contents of the memories 8, 9 come to non-coincidence at the part corresponding to the position where the flaw is present to generate a non-coincident signal. Whereupon, a measuring machine detects the coordinates where said flaw is present and the coordinates signal is processed by CPU to be displayed on a recording display part as data. By this method, the confirmation of the flaw existence can be performed rapidly.

Description

【発明の詳細な説明】 本発明は物体の外観検査装置例えば写真蝕刻技術に使用
するフォトマスクの外観検査装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an apparatus for inspecting the appearance of an object, such as an apparatus for inspecting the appearance of a photomask used in photolithography.

フォトマスクの一つの検査方式として、投影器によりフ
ォトマスク表面を拡大し、目視により欠陥の有無を検査
する方式が一般的に採用されている。
As one inspection method for photomasks, a method is generally adopted in which the surface of the photomask is magnified using a projector and the presence or absence of defects is visually inspected.

ところでこの目視による検査においては、欠陥を見落す
ことが少なくなく、検査に非常に時間がかかり、また、
個人により欠陥の判断基準が異なるという問題が生じる
However, in this visual inspection, defects are often overlooked, the inspection takes a very long time, and
A problem arises in that the criteria for determining a defect differs depending on the individual.

そのため、予め標準パターンをテレビジョンカメラによ
って撮影し、各画素毎の明暗を2値化信号に変換し、こ
れを例えば磁気テープに記憶しておき、一方杖検査パタ
ーンをテレビジョンカメラで撮影し、各画素毎の明・暗
を2値化信号に変換し、これを−ヒ記磁気テープに記憶
された信号と比較して不一致があれば欠陥ありと判断す
る検査方式も考えられている。
Therefore, a standard pattern is photographed in advance with a television camera, the brightness and darkness of each pixel is converted into a binary signal, and this is stored on, for example, a magnetic tape.On the other hand, a cane test pattern is photographed with a television camera, An inspection method is also being considered in which the brightness and darkness of each pixel is converted into a binary signal, and this is compared with the signal stored on the magnetic tape described in (b), and if there is a discrepancy, it is determined that there is a defect.

ところで、かかる方式においては、標準パターンそのも
のに欠陥がある場合があり、検査結果に対する信頼度が
低いという問題がある。
However, in this method, there are cases where the standard pattern itself has defects, and there is a problem in that the reliability of the inspection results is low.

検査されるフォトマスクのパターン焼付けは第5図に示
すようなバリアプルアパーチャーを使用して行われ、そ
のバリアプルアパーチャーのXY移動をさせるための制
御用メモリ(一般に磁気テ−プ)には焼付けるべきパタ
ーンを示す情報信号が記憶されている。したがって、こ
のパターン情報信号をレチクルパターンの欠陥検出にあ
たっての基準信号として用いればパターン作成の基礎と
なったパターン情報と検査されるフォトマスクのパター
ンとを比較することができ、判断の誤りをなくてことが
できる筈である。本発明はかかる着想の下になされたも
ので、その一つの目的は絶対的に正しいものを基準とし
てマスク等の物体の外観を検査し、検査の信頼度を高め
ることができる物体の外観検査装置を提供することにあ
り、さらに他の目的は検査を高速に行うことができる物
体の外観検査装置を提供することにある。
Pattern printing on the photomask to be inspected is performed using a barrier pull aperture as shown in Figure 5, and the control memory (generally magnetic tape) for moving the barrier pull aperture in the XY direction is An information signal indicating the pattern to be applied is stored. Therefore, if this pattern information signal is used as a reference signal for detecting defects in reticle patterns, it is possible to compare the pattern information that served as the basis for pattern creation with the pattern of the photomask being inspected, thereby eliminating errors in judgment. It should be possible. The present invention was made based on such an idea, and one of its purposes is an object appearance inspection device capable of inspecting the appearance of an object such as a mask using an absolutely correct reference, thereby increasing the reliability of the inspection. Another object of the present invention is to provide an apparatus for inspecting the appearance of objects that can perform inspections at high speed.

以下本発明を実施例により説明する。The present invention will be explained below with reference to Examples.

第1図は外観検査装置の被検査マスクを載置するX−Y
ステージ部を示す斜視図である。
Figure 1 shows the X-Y on which the mask to be inspected is placed on the visual inspection device.
It is a perspective view showing a stage part.

1は超高圧水釧灯(250W)で、被検査マスタ−レチ
クル3下面より光を照射するための光源となる。2はレ
チクル3を走査方向に一定速度で精度よく送るためのX
−Yステージ、4は走査のためのモータ、5はXY座標
位首を測定するための測長器、6はパターンの明暗を空
気信号に変換するためのフォトダイオードプレイである
Reference numeral 1 denotes an ultra-high pressure water lamp (250 W), which serves as a light source for irradiating light from the lower surface of the master reticle 3 to be inspected. 2 is an X for accurately sending the reticle 3 at a constant speed in the scanning direction.
-Y stage, 4 is a motor for scanning, 5 is a length measuring device for measuring the XY coordinate position, and 6 is a photodiode play for converting the brightness of the pattern into an air signal.

第2図は本装置のシステム構成を示すものである。FIG. 2 shows the system configuration of this device.

2はXYステージ、5は測長器、6はフォトダイオード
アレイ、7はフォトダイオードアレイの出力を量子化し
、”1 ” ” O”の2値信号に変換する回路、8は
被検査マスクの外観を2値化した信号を記憶するメモリ
A、9は基準パターンを示す信号を記憶するメモリB、
10はメモリA8に記憶された信号とメモIJ B 9
に記憶された信号との特徴とから欠陥を認識するための
ものであり。
2 is an XY stage, 5 is a length measuring device, 6 is a photodiode array, 7 is a circuit that quantizes the output of the photodiode array and converts it into a binary signal of "1" and "O", and 8 is the appearance of the mask to be inspected. 9 is a memory A that stores a signal obtained by binarizing , a memory B that stores a signal indicating a reference pattern,
10 is the signal stored in memory A8 and memo IJ B 9
The purpose is to recognize defects from the signals and features stored in the system.

12はエラー出力回路で、比較回路10又は認識部11
からのエラー信号があればCPUに割込指令信号を発す
る。13は、14CPUからの基準パターンを示す信号
を一時的に記憶するためのバッファで、CPUからの基
準パターン信号を一方のバッファ信号に送出している間
に、他方のバッファで前に記憶しておいた信号をメモリ
B9に送出するという具合に使用する。15はCPU(
中央処理装置)、16は操作卓、17は記録51表示部
、18は焼付けを行うパターンゼネレーターのバリアプ
ルアパーチャー制御用の信号を基準パターンの輪郭をベ
クトルに分解した信号を記憶した磁気テープである。具
体例によって説明すると。
12 is an error output circuit, which is a comparison circuit 10 or a recognition unit 11;
If there is an error signal from the CPU, an interrupt command signal is issued to the CPU. 13 is a buffer for temporarily storing a signal indicating a reference pattern from the CPU; while the reference pattern signal from the CPU is being sent to one buffer signal, it is previously stored in the other buffer; The stored signal is sent to the memory B9. 15 is the CPU (
16 is an operation console, 17 is a recording unit 51, and 18 is a magnetic tape that stores signals obtained by decomposing the outline of the reference pattern into vectors for controlling the barrier aperture of the pattern generator for printing. be. Let me explain with a specific example.

第3図に(a)に示すようなパターンはX方向のベクト
ルa * b 、cに分解し、各ベクトルは下表に示す
ようにそのY座標と、スタート点のX座標Xsおよびエ
ンド点Xeとで表現し、それを磁気テープ18に同図(
b) K示すように順次記憶しである。
The pattern shown in Figure 3 (a) is decomposed into vectors a * b and c in the X direction, and each vector has its Y coordinate, the X coordinate of the start point Xs, and the end point Xe as shown in the table below. , and write it on the magnetic tape 18 (
b) Stored sequentially as shown in K.

この磁気テープ18に記憶された信号をCPUを通じて
バッファメモリ13に転送し、それと同時に前にCPU
からの信号を記憶していたバッファメモリ14の記憶内
容な′1”60”信号に変換しメモリB9にパターンを
2次元的に再現する。
The signals stored on the magnetic tape 18 are transferred to the buffer memory 13 through the CPU, and at the same time,
The signal from the buffer memory 14 is converted into a '1"60 signal corresponding to the stored content of the buffer memory 14, and the pattern is two-dimensionally reproduced in the memory B9.

そして、第4図に示すように、基準パターンをメモ月B
)に2値信号に変換して再現するとともに、被検査マス
クパターンをメモリA8に再現し、その両方の信号を比
較回路10において比較する。
Then, as shown in Figure 4, the reference pattern is memorized for month B.
) is converted into a binary signal and reproduced, and the mask pattern to be inspected is also reproduced in the memory A8, and both signals are compared in the comparison circuit 10.

被検査マスクパターンに欠陥19があれば、メモリAと
Bの内容がその欠陥の存在する位置に和尚する部分にお
いて不一致となるから、不一致信号が生じ、割込指令が
エラー出力回路12からCPUK発せられる。すると、
測長器5によって当該欠陥の存在する座標を検出し、そ
の座標信号をCPUで信号処理し、記録・表示部17に
データアウトする。これKより、欠陥のg識を迅速にす
ることができる。
If there is a defect 19 in the mask pattern to be inspected, the contents of memories A and B do not match in the portion corresponding to the position where the defect exists, so a mismatch signal is generated and an interrupt command is issued from the error output circuit 12 to CPUK. It will be done. Then,
The length measuring device 5 detects the coordinates where the defect exists, the CPU processes the coordinate signals, and outputs the data to the recording/display section 17. This allows faster identification of defects.

ところで1本発明によればマスクパターン作成1’) 
基トナったパターン情報とマスクパターンとを比較する
ので、′fなわち絶対的に正しいパターンを信号化した
ものを記憶し、それと被検査マスクパターンとを比較す
るので、誤判定をなく丁ことができる。
By the way, according to the present invention, mask pattern creation 1')
Since the base pattern information and the mask pattern are compared, the absolute correct pattern is memorized as a signal, and the mask pattern to be inspected is compared with it. This eliminates false judgments. I can do it.

本発明は特にフォトエツチング用のフォトマスク例えば
1ベレツトに相当する部分を10倍に拡大したマスター
レチクルの外観検査に有効である。
The present invention is particularly effective for visual inspection of a photomask for photoetching, for example, a master reticle in which a portion corresponding to one beret is enlarged ten times.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明において使用する外観検査装置の被検査
マスクを載置するX−Yステージ部の一例を示す斜視図
である。 第2図は本装置のシステム構成を示すブロック線図であ
る。第3図(alは基準パターンの一例を、(blは磁
気テープにかかる態様をもって表現されたベクトルを順
次記憶することを示す説明図である。 第4図は基準パターンと被検査マスクパターンとを比較
し欠陥を検出するだめの説明図である。 第5図は被検査マスクパターン焼付用のバリアプルアパ
ーチャーを示jN視図である。 1・・・超高圧水銀灯、2・・・X−Yステージ、3・
・・被検査マスターレチクル、4・・・走査用モータ、
5・・・座標検出用測長器、6・・・フォトダイオード
アレイ、7・・・量子化回路、8・・・メモリA、9・
・・メモリB、10・・・比較回路、11・・・認識部
、12・・・エラー出力回路% 13.14・・・バン
ファレジスタ、15・・・CPU、16・・・操作卓、
17・・・記録9表示部、18・磁気テープ、19・・
・欠陥、20・・・基準マスクパターン。 (oc″−
FIG. 1 is a perspective view showing an example of an XY stage section on which a mask to be inspected is placed in a visual inspection apparatus used in the present invention. FIG. 2 is a block diagram showing the system configuration of this device. FIG. 3 is an explanatory diagram showing an example of the reference pattern (al is an example of the reference pattern, and bl is an explanatory diagram showing that vectors expressed in a manner similar to the magnetic tape are sequentially stored. FIG. 4 is an explanatory diagram showing the reference pattern and the mask pattern to be inspected. It is an explanatory diagram of a device for comparing and detecting defects. Fig. 5 is a JN view showing a barrier pull aperture for printing a mask pattern to be inspected. 1... Ultra-high pressure mercury lamp, 2... X-Y Stage, 3・
... Master reticle to be inspected, 4... Scanning motor,
5... Length measuring device for coordinate detection, 6... Photodiode array, 7... Quantization circuit, 8... Memory A, 9...
...Memory B, 10... Comparison circuit, 11... Recognition section, 12... Error output circuit % 13.14... Bumper register, 15... CPU, 16... Operation console,
17...recording 9 display section, 18.magnetic tape, 19...
- Defect, 20...Reference mask pattern. (oc″-

Claims (1)

【特許請求の範囲】[Claims] 1、XY方向に移動可能なXYテーブルと、前記XYテ
ーブルに載置した物体に形成されたパターンに対応する
第1情報を作成する回路と、前記物体に一定形状のパタ
ーンを形成する際に使用するパターン形成用情報を前記
第1情報と比較しうる第2情報として作成する回路と、
前記第1情報と前記第2情報とを比較する比較回路とを
有し、前記比較回路からの出力信号にもとづき前記物体
の外観を検査することを特徴とする物体の外観検査装置
1. An XY table movable in the XY directions, a circuit for creating first information corresponding to a pattern formed on an object placed on the XY table, and used to form a pattern of a fixed shape on the object. a circuit for creating pattern forming information to be used as second information that can be compared with the first information;
An apparatus for inspecting the appearance of an object, comprising a comparison circuit for comparing the first information and the second information, and inspecting the appearance of the object based on an output signal from the comparison circuit.
JP60103739A 1985-05-17 1985-05-17 Apparatus for inspecting appearance of object Pending JPS6122237A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60103739A JPS6122237A (en) 1985-05-17 1985-05-17 Apparatus for inspecting appearance of object

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60103739A JPS6122237A (en) 1985-05-17 1985-05-17 Apparatus for inspecting appearance of object

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP11770775A Division JPS5242790A (en) 1975-10-01 1975-10-01 Method of inspecting appearance of objects

Publications (1)

Publication Number Publication Date
JPS6122237A true JPS6122237A (en) 1986-01-30

Family

ID=14361987

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60103739A Pending JPS6122237A (en) 1985-05-17 1985-05-17 Apparatus for inspecting appearance of object

Country Status (1)

Country Link
JP (1) JPS6122237A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6317523A (en) * 1986-07-09 1988-01-25 Toshiba Mach Co Ltd Electron-beam lithography equipment
JP2003043663A (en) * 2001-08-01 2003-02-13 Toppan Printing Co Ltd Automatic shape measuring method for photomask pattern, its measuring instrument and program, photomask manufacturing method as well as manufacturing method for semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5051263A (en) * 1973-09-06 1975-05-08

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5051263A (en) * 1973-09-06 1975-05-08

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6317523A (en) * 1986-07-09 1988-01-25 Toshiba Mach Co Ltd Electron-beam lithography equipment
JP2003043663A (en) * 2001-08-01 2003-02-13 Toppan Printing Co Ltd Automatic shape measuring method for photomask pattern, its measuring instrument and program, photomask manufacturing method as well as manufacturing method for semiconductor device
JP4710191B2 (en) * 2001-08-01 2011-06-29 凸版印刷株式会社 Photomask pattern shape automatic measurement method and apparatus, program therefor, photomask manufacturing method and semiconductor device manufacturing method

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