JPH07325046A - Appearance inspection method and appearance inspection apparatus - Google Patents

Abstract

PURPOSE:To make no need of a sample with good quality for determination of the quality at the time of appearance inspection of a printed circuit board and shorten the inspection time by specifying the inspection contents at the time of re-inspection of products which are found as products with defects. CONSTITUTION:Color components and brightness information of three primary colors (red, blue, green) are given to the image forming data for a mask film used to produce a printed circuit board 20 for which appearance inspection is to be carried out in a data adding part 11 and a bit map (reference data) for comparison to judge the quality is computed and processed and then stored in a judgement part 14. An image of the object to be inspected is taken by a color image taking apparatus 4, divided into brightness information for each color component of three primary colors, computed and processed to produce a bit map based on the inspection result data, compared with the reference data in the judgement part 14 to determine the quality. Further, if necessary, a bit map with specified inspection range or inspection elements is produced to carry out the inspection efficiently by restricting the inspection content to the minimum limit.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a visual inspection method and a visual inspection apparatus, and more particularly to a visual inspection method and its apparatus used for automatically discriminating a defect of a surface pattern of an object to be inspected or quality of a position.

[0002]

2. Description of the Related Art In a conventional appearance inspection apparatus, a color photoelectric converter divides a color of a chip component into three primary colors of red, green, and blue, and converts them into an electric signal according to a ratio of each primary color. The image processing apparatus has a function of comparing the electric signal with a reference value. FIG. 11 showing a block diagram of Japanese Patent Laid-Open No. 4-125454 showing this type of configuration.
Etc., the appearance inspection apparatus 110 for this chip component
The table 112 is composed of an X-axis table 112a and a Y-axis table 112b. The X-axis table 112a is moved by a motor 142a in a fixed left and right direction parallel to the paper surface, and the Y-axis table 112b is moved by the motor 142b to an X-axis table 112a. It is formed so as to be able to reciprocate in the directions orthogonal to each other. Above the table 112 is a color television camera 11 as a color photoelectric converter.
6 is attached. This color TV camera 11
6 projects light from the light source 134 to the chip component 140, converts the light reflected here into an electric signal and outputs it. The output electric signal is input to the image processing apparatus 118. The image processing device 118 includes an A / D converter 120, a comparison operation device 122, a matrix circuit 124, and a memory 12.
6, I / O port 128, etc., and processes signals input from the color television camera 116. Further, the visual inspection apparatus 110 also includes a system control unit 130 for recognizing the position of the defective product found by the image processing apparatus 118, a table control unit 132 for controlling the table 112, and a light source 134 for projecting light onto the chip parts. On the table 112, the chip components 140 exist in a state of being aligned at equal intervals by an alignment plate 142.

In this appearance inspection apparatus 110, first, the appearance color of a non-defective chip component 140 is measured with the brightness of the light source 134 kept constant, and the red component, green component, and blue component of the image output at the coordinates x and y are measured. A / D converter 12
A / D conversion is performed at 0, and the density value at each coordinate is Rb.
It is calculated as (i, j), Gd (i, j), and Bd (i, j). Here, Rd is red, Gd is green, Bd is the density value of the blue component, and i and j are the coordinates when the image output is A / D converted. This is M (Rd, Gd, Bd)
, And the value is sent to the table F (i, j), it is defined by the following equation.

[0004]

In this case, the origin of color space is black,
Three-dimensional vector M (R ₄ , G ₄ ) with red (R ₄ ), green (G ₄ ) and blue (B ₄ ) as axes , B ₄ ). Every color is divided into these three primary colors. Then, in the color measurement of the chip component 140, for example, the screen configuration is set to 512 × 512 pixels, and the density value is divided into 0 to 64. Therefore, for example, the density value at the coordinates of i = 10, j = 228 is R ₄ = 45, G ₄ = 10, B ₄
= 64, these numbers are M (R ₄ , G ₄ , B
₄ ) is substituted. When the value is sent to the table F (i, j), it becomes as follows. F (10,228) =
M (45, 10, 64) In this way, the density value at each coordinate i, j is measured. Then, reference numerals are given to the electrode portion, the element body portion, and other portions of the non-defective product which is the comparison reference. For example, if it is an electrode, the value of M (Rd, Gd, Bd) is 1,
The element field is 2, and the other parts are 0, and this M (Rd, G
The value of d, Bd) is used as the extraction table. These values are stored in the pass / fail judgment RAM as F (i, j).

Next, when the appearance inspection of the chip component 40 is performed, the color of the chip component 140 is changed to the color television camera 116.
Measured by The image output from the color television camera 116 is A / D converted by the A / D converter 120. The A / D converted data is sent to the RAM. Here, the extraction table has already been created by the method described above. Then, the measured chip component 14
The data of 0 and the data of the extraction table are good or bad RA
The quality of the chip component 140 is determined by comparison with M.

In this case, F (i, j) is measured by scanning the chip component 140 in parallel. And in the background part, F (i, j) becomes 0,
F (i, j) is 1 in the electrode part and F (i, j) in the element part
(I, j) becomes 2. Here, for example, if there is a scratch or discolored portion in the element body portion, F (i, j) of that portion becomes 0. In this case, since 0 is included in the portion where F (i, j) should be 2, this chip component 140 is determined to be a defective product. Chip component 140 determined to be defective
Are excluded by the system control unit 130. Further, the table control unit 132 moves the X-axis table 112a and the Y-axis table 112b, and the appearance inspection of the chip components 140 is performed one after another.

[0008]

However, in such a conventional appearance inspection method, a non-defective sample is always required to obtain the reference value (extraction table), and the non-defective sample is visually inspected by a human. Since they were selected, the reference value itself contained an error due to human sensory factors, and in some cases, a defective product was set as a good product as the reference value. In addition, even if a large number of chips such as chip parts are inspected, it is possible to efficiently inspect them after selecting a good sample once even if it takes time, but for small-volume production, select a good product. It becomes complicated and inefficient, and it is difficult to efficiently carry out the inspection using the appearance inspection device. Further, when the inspection is performed once, and the defective portion is repaired at the defective portion and then inspected again, it is necessary to completely inspect from the beginning.

Further, referring to Japanese Unexamined Patent Publication No. 1-100677, a standard value setting method is a method obtained by selecting a mark considered to be appropriate in a semiconductor device and shooting this mark with a color TV camera. However, this also has the same problem as the above publication.

Therefore, it is a primary object of the present invention to provide a visual inspection method and an apparatus thereof, which eliminates the conventional defects and does not require a good sample and can inspect only a specified range or element. .

[0011]

According to a first aspect of the appearance inspection method of the present invention, the information obtained from the drawing data of the mask film used when creating the inspection object is used as reference data and It is characterized by comparing the information obtained by performing image processing on the object to be inspected and determining the quality.

In the second aspect of the appearance inspection method of the present invention, the information obtained from the drawing data of the mask film used when creating the inspection object is used as reference data, and this and the inspection object are image-processed. As a result of comparison with the information obtained by recording the inspection data of the inspected object in which a defective portion is detected, only the defective portion or defective element of the inspection data is recorded when performing the visual inspection again. The feature is that the inspection is performed using the extracted data.

The structure of the appearance inspection apparatus of the present invention comprises: a data input section for taking in drawing data of a mask film of an object to be inspected; a data adding section for adding predetermined color information and luminance information to the drawing data; A synthesis unit that synthesizes each drawing data to which the color information and the luminance information are added by the data addition unit and processes / converts the luminance for each predetermined coordinate; and the data output from the synthesis unit is displayed and stored. Means, a color image pickup device for picking up a color image of the object to be inspected, and a composite video signal picked up by the color image pickup device is separated into a color signal and a luminance signal for each designated color, The object to be inspected by comparing a video processing unit for converting and processing into a digital signal for each predetermined coordinate with data processed by the video processing unit using the data synthesized and converted by the synthesizing unit as reference data. Goodness of Characterized by comprising a determination unit that determines for.

[0014]

1 is a block diagram showing a first embodiment of the present invention. In FIG. 1, the configuration of the appearance inspection apparatus according to this embodiment includes a data input unit 10 for taking in drawing data of a mask film (pattern, solder resist, characters) on which a printed wiring board 20 as an inspection object is created, and the drawing data. A data adding unit 1 for adding predetermined color information and luminance information to the
1, a synthesizing unit 12 for synthesizing each drawing data to which the color information and the luminance information are added by the data adding unit, and processing / converting the luminance for each predetermined coordinate, and a printed wiring board 20 which is an inspection object.
Color image pickup device 4 for picking up the color image and the color image picked up by the color image pickup device 4 is an electric signal in which the luminance of each component of the three primary colors (red, green, blue) A video processing unit 5 that outputs the composite video signal (hereinafter abbreviated as a composite video signal), separates the composite video signal into a color signal and a luminance signal for each designated color, and converts and processes the digital signal for each predetermined coordinate; The data synthesizing / processing / converting by the synthesizing unit 12 is used as reference data to compare with the data processed by the video processing unit 5 to determine whether the data is good or bad.

Further, this printed wiring board appearance inspection apparatus 1
Is a table 2 on which a printed wiring board 20 as an inspection object is placed.
A light source 3 such as a halogen lamp is installed above the table 2 for projecting light, and the color of the inspected object projected by the light projected from the light source 3 is also above the table 2. A color television camera, which is the color image capturing device 4 installed in, captures a color image of the inspection object. The color image captured here is output as a composite video signal. This composite video signal is processed by the video processing unit 5
Entered in. The video processing unit 5 includes an A / D converter 6, an arithmetic processing circuit 7, a memory 8, an I / O port 9, and the like, performs A / D conversion on the input composite video signal, and red components for each predetermined portion. , The blue component and the green component are processed as luminance information.

Further, the appearance inspection apparatus 1 includes a pattern, a solder resist, and a pattern on which the printed wiring board 20 to be inspected is created.
A data input unit 10 for taking in drawing data when drawing each mask film of characters by a photo plotter, a data adding unit 11 for giving color component information and luminance information to each inputted drawing data, and each added drawing A synthesizing unit 12 that synthesizes the data into one and calculates and processes the brightness of each of the red component, green component, and blue component of the synthesized data, and this synthesizing unit 1.
Display 13 that displays the data output from 2
And the data output from the image processing unit 5 and the data output from the synthesizing unit 12 to determine whether the data is good or bad.
4 and. Then, if the defective product is recognized, the data of the defective part is displayed from the determination unit 14 on the display 1.
3 is output and displayed on the screen 3, and is rejected as a defective product by a transport device (not shown).

In this appearance inspection apparatus 1, first, each drawing data used when drawing a mask film of a pattern, a solder resist, and a character used when the printed wiring board 20 to be inspected is created by a photoplotter. Is input from the data input unit 10 using, for example, MT (magnetic tape). For example, the input drawing data such as the PT data 30 in FIG. 2 remains as a copper foil when the printed wiring board is created at the coordinates x and y in the data addition unit 11 at certain coordinates x. If it is a portion, the luminance of the red component, the blue component, and the green component are respectively set to Rt.
(X, y), Bt (x, y), Gt (x, y), and if there is no remaining portion, Rt0 (x, y), Bt0
(X, y) and Gt0 (x, y) are given.

Regarding the solder resist data 31, the brightness of each color component is represented by Rs (x, y), Bs in the portion where the solder register remains when the printed wiring board 20 is created.
It is given as (x, y), Gs (x, y), and the remaining portion is Rs0 (x, y), Bs0 (x, y), Gs0.
Give (x, y).

Similarly for the character data 33, the remaining portions are Rm (x, y), Bm (x, y), Gm (x,
y) and the remaining part is Rm0 (x, y),
Bm0 (x, y) and Gm0 (x, y) are given.

The respective drawing data to which the luminance information of the respective color components of red, blue and green is added by the data adding section 11 is inputted to the combining section 12 and combined into one as shown in FIG.
At this time, the luminance information of the composite data 34 is calculated for each color component of each coordinate x, y, and the calculation result is the table f (x, y).
And is defined by the following equation.

F (x, y) = D (R (x, y), B (x, y), G (x, y)) = Tα (Rα (x, y), Bα (x, y), Gα (x, y)) + Sβ (Rβ (x, y), Bβ (x, y), Gβ (x, y)) + Mγ (Rγ (X, y), Bγ (x, y), Gγ (x, y)) where R (x, y), B (x, y), and G (x, y) are
The luminance information of the red component, the blue component, and the green component after the calculation result in the synthesizing unit 12 at the respective coordinates x and y is shown. Further, Tα represents the brightness information of the pattern data 30, and α =
t, t0, Sβ represents the brightness information of the solder resist data 31, β = s, s0, Mγ represents the brightness information of the character data 33, and γ = m, m0. Then, for example, for a two-layer board, the flow shown in FIG.
The actual arithmetic expression at each coordinate is derived.

Since the part where the character remains on the printed wiring board can only see the color of the character in appearance, other elements are ignored. Therefore, when γ = m in the processing step 40, the following equation is obtained.

F (x, y) = (Rm (x, y), Bm
(X, y), Gm (x, y) In the part where the character does not remain on the printed wiring board and the part where the solder resist does not remain, the copper foil or the base material part is finally exposed. When γ = m0 and β = s0, when α = t (YES in processing step 42), f (x,
y) = (Rt (x, y), Bt (x, y), Gt (x,
y)) When α = t0 (NO in process step 42), f (x, y)
= (Rt0 (x, y), Bt0 (x, y), Gt0
(X, y)).

In the area where characters do not remain on the printed wiring board,
When the green solder resist is applied in a thickness of 35 μm, the part where the solder resist remains is finally translucent in appearance, and when there is a copper foil in the lower layer, it is the base material. It becomes even thinner than
When 0 and β = s, they are not simply added but can be expressed as follows, for example.

When α = t (YES in processing step 43),
f (x, y) = 0.41 (Rs (x, y), Bs (x,
y), Gs (x, y)) + 0.39 (Rt (x, y),
Bt (x, y) Gt (x, y)) When α = t0 (NO in process step 43), f (x, y)
= 0.59 (Rs (x, y), Bs (x, y), Gs
(X, y) +0.61 (Rt0 (x, y), Bt0
(X, y), Gt0 (x, y)) Then, the calculated result is output to the display 13 and D (R (x, y), B (x, y), G
A code is given to (x, y), and a bitmap A as shown in FIG. 5 is created and output to the determination unit 14. Data output to the determination unit 14 (bitmap A)
Is recorded in the RAM 15 in the discrimination unit 14 as reference data. In FIG. 4, Ψ represents each color component of R, G, B.

Next, when the appearance inspection of the printed wiring board 20 to be inspected is performed, first, while checking the screen displayed on the display 13 in the table 2, printing is performed so that the x and y coordinates match the reference data. The wiring board 20 is placed. Then, the color of the printed wiring board 20 projected by the light projected from the light source 3 is captured by a color television camera as the color image capturing device 4 to capture a color image as shown in FIG. At this time, the light amount of the light source 3 is adjusted in advance so that the captured color image can correspond to the brightness of the reference data. The captured color image is output as a composite video signal from the color television camera. This composite video signal is input to the video processing unit 5, and the composite video signal is processed and A / D converted into the brightness of each of the red, blue, and green components for each portion corresponding to the x and y coordinates of the reference data. Then, a code is given to the processed and converted data, and the bit map B as shown in FIG.
Is generated and output to the determination unit 14. The determination unit 14 compares the bitmap A serving as the reference data with the bitmap B serving as the measurement data to determine whether there is a difference, and determines the quality. For example, in the printed wiring board 20 as shown in FIG. 6, a part of the character is missing and the position of the portion where the solder resist is not originally left is displaced as compared with FIG. Therefore, a difference occurs between the bitmap A shown in FIG. 5 and the bitmap B shown in FIG. 7, and the determination unit 14 determines that the product is defective. Then, the data of the defective portion is output to the display 13, the display 13 displays the defective portion on the screen, and the printed wiring board 20 is removed by another stage not shown. As described above, when the appearance inspection apparatus 1 is used, it is not necessary to visually select a non-defective sample by human eyes, and all inspections are performed while being digitized. Therefore, more reliable inspection can be performed without human error. Is possible.

The bitmaps in FIGS. 5 and 7 are 7 × 7.
Although it is created with the number of bit units of, even if the number of bit units is increased as needed, even minute defects can be detected.

As described above, according to this embodiment, a composite video signal obtained by reading a predetermined number of pixels on a printed board to be inspected by a color image pickup device is converted into a color signal R (red) by a separation circuit. ), B (blue), G (green) and the luminance signal D are separated, and converted into a digital signal with a preset parameter in the conversion circuit to create a bit map. Next, in the data addition circuit, the PT, SR, and character data 30, 31, and 33 of the drawing data (data created by theoretical values) in the database of the film on which the printed circuit board to be inspected has been set in advance by the information addition circuit. Color information and luminance information (for example, S
The R data 31 is given a green color (G), a brightness of 100, etc.) and is combined by a combining circuit. Create a bitmap that corresponds to the bitmap. The bit map obtained from both of these is compared in the data comparison unit to obtain the difference. Whether or not this value is within a predetermined allowable value is determined by a determination circuit to determine whether it is good or bad.

In addition to the first embodiment, the following embodiment can be adopted.

(1) The number of the light sources 3 is not limited to one, but if a large number of light sources 3 are arranged around the color image pickup device 4, the illuminance is constant and the shadow is eliminated.

(2) In addition to the printed wiring board, semiconductor wafers and semiconductor chips can be cited as the objects to be inspected. In this case, the pattern or the like used for forming the layers constituting the main surface of the semiconductor wafer, the semiconductor chip, or the like is input to the data input unit 10, and the image pickup device 4 uses the lens system such that an enlarged image of the main surface can be obtained. Is used. In this case, when the color tone of the surface layer is different from that of the base layer, the pattern of the base layer is also input to the input unit 10.

(3) Since the material of the printed wiring board is translucent, especially when the material is phenol resin, the position of the light source 3 is set so that the transmitted light, not the reflected light of the light source 3, strikes the image pickup device 4. The table 2 is changed and a transparent one is used. In this case, the state of the back surface of the printed wiring board and the state of the inner layer wiring inside can also be the object of inspection.

(4) The printed wiring board, the semiconductor chip, and the like can be properly inspected not only as an inspection target for a completed product but also for an incomplete product, that is, a product in the process of manufacturing. Since it is difficult to electrically inspect those in the middle of this process, it is possible to carry out visual inspection instead of this and isolate defects.

(5) The movement of the relative position between the table 2 and the image pickup device 4 may be performed manually or by a control system based on a program.

(6) In order to evaluate the reliability of the appearance inspection apparatus 1 itself, it is only necessary to inspect various objects to be inspected a number of times and obtain a constant inspection result. You can do it.

Among the above embodiments (1) to (6),
Any number can be used as appropriate. The above embodiments (1) to (6) can be applied to the second embodiment below.

FIG. 8 is a block diagram showing a visual inspection apparatus according to the second embodiment of the present invention. The visual inspection apparatus 51 of this embodiment includes a drive portion including a table 52, a ball screw screw 53, a motor 54, and a system control unit 55. The table 52 reciprocates in a fixed direction parallel to the traveling direction of the ball screw screw 53. The motor 54 rotates the ball screw 53, and the amount of movement is controlled by the system controller 55. Further, the color television camera can be moved and reciprocated by a motor 57 along a rail 56 running in a direction orthogonal to the moving direction of the table 52, and the motor 57 is also controlled by the system control unit 55. . Further, the console 59 has a mode changeover switch for designating what kind of inspection is to be performed on the visual inspection device 51, so that a portion or an element to be inspected can be designated and inspected. Then, using this function, the visual inspection apparatus 51 stores the inspection data in the recording unit 58 for the printed wiring board in which the visual inspection is performed and the defective portion is detected by the determination unit 14, and the defective portion is stored. When the visual inspection is performed again after repairing the
Using the data recorded in, only the defective part or element is extracted and inspected. In FIG. 8, the same parts as those of the first embodiment are indicated by common reference numerals, and the description thereof will be omitted.

Although the defective portion may be repaired before the above appearance inspection is performed again, the inspection is performed again for confirming the defective portion or for inspecting the appearance inspection apparatus itself without performing such repair. Sometimes.

In the appearance inspection apparatus 51, a bitmap A (for example, similar to that in FIG. 5) is first created from the drawing data of each mask film on which the printed wiring board 20 to be inspected is created as in the first embodiment. It is stored in the RAM 15 in the discriminating unit 14 as reference data. Then, the appearance inspection of the printed wiring board 20 to be inspected is performed, the bitmap B is created, and the bitmap B is output to the determination unit 14. The discriminating unit 14 compares and confirms whether there is a difference between the bitmap A as the reference data and the bitmap B as the measurement data, and determines the pass / fail. Then, for example, if there is a defective portion as shown in FIG. 6, a difference occurs between the bitmap A and the bitmap B, and the determination unit 14 determines that the defective product is defective. Then, the data of the defective portion is output to the display 13, the defective portion is displayed on the screen, and the printed wiring board 20 is excluded as a defective product.

Here, in the appearance inspection apparatus 51 of this embodiment, if the defective portion of the defective product is within 10 places, for example,
Data such as that shown in FIG. 9 in which only defective portions are left in the bitmap A are automatically output from the RAM 15 in the determination unit 14 to the recording unit 58 and recorded. And the printed wiring board 2
When a visual inspection is performed again after repairing the defective portion of 0, a blank portion (a portion that does not remain as a character) is given a reference numeral 9, and a bitmap C as shown in FIG. 10 is created. The data is output to the display 13 and the determination unit 14. Then, the appearance inspection of the printed wiring board 20 to be inspected is performed, and the video processing unit 5 extracts and processes only the portion having the luminance of reference numeral 4 from the input composite video signal. Then, the processed data is output to the discriminating unit 14, and the discriminating unit 14 compares the bitmap C as the reference data with the data output from the video processing unit 5 to check whether there is a difference, The quality is judged. That is, the pattern processing and the solder resist portion which have already been determined as non-defective products are excluded from the inspection target to shorten the data processing time (about 1/10 of the time of the first embodiment), thereby enabling efficient inspection. Become.

[0041]

As described above, according to the present invention,
Especially, by using the reference data for the quality judgment of the appearance inspection of the printed wiring board, the drawing data of the mask film used to create the printed wiring board to be inspected , The inspection time using the appearance inspection device [3 minutes / 1 time] eliminates the time [30 minutes / 1 piece] for humans to select good products by visual inspection, which tends to be complicated and inefficient. It is possible to efficiently carry out the inspection using the appearance inspection device, and it is possible to completely eliminate the outflow of defective products to the next process due to defective reference data. By making it possible to specify the re-inspection content for a defective product, the inspection time can be shortened to about one tenth of that in the case of completely inspecting the defective product after the repair. Effect There is. Further, according to the present invention, there is also an effect that it is possible to determine a deviation of the positional accuracy from the theoretical value, a defect, a fog, or the like.

[Brief description of drawings]

FIG. 1 is a block diagram showing a first embodiment of the present invention.

FIG. 2 is a plan view showing an example of drawing data input to the appearance inspection apparatus of FIG.

FIG. 3 is a plan view after processing / combining input drawing data.

FIG. 4 is a flowchart showing a calculation flow in a combining unit in FIG.

FIG. 5 is a plan view showing a bitmap as reference data after the brightness information of the combined data is calculated / processed and a code is given.

FIG. 6 is a plan view of a color image obtained by imaging the printed wiring board having the defect of FIG.

7 is a plan view showing a bitmap as a measurement result obtained by performing data processing on the captured color image of FIG.

FIG. 8 is a block diagram showing a second embodiment of the present invention.

9 is a plan view showing a bitmap in which only defective portions are extracted from the inspection result data after the pass / fail determination in FIG.

FIG. 10 is a plan view showing a bitmap in which only inspection elements are extracted.

FIG. 11 is a block diagram showing a visual inspection apparatus according to a conventional technique.

[Explanation of symbols]

 1,51 Appearance inspection device 2 Table on which printed wiring board is placed 3 Light source 4 Color image pickup device 5 Video processing unit 6 A / D converter 7 Arithmetic processing circuit 8 Memory 9 I / O port 10 Data input unit 11 Data addition unit 12 Compositing Section 13 Display 14 Discrimination Section 15 RAM (Random Access Memory) 20 Printed Wiring Board 52 Table 53 Ball Screw Screws 54, 57 Motor 55 System Control Section 56 Rail 58 Storage Section 59 Console

Claims (6)

[Claims] 1. The information obtained from the drawing data of the mask film used when creating the inspection object is used as reference data, and this is compared with the information obtained by image-processing the inspection object. A visual inspection method characterized by determining pass / fail. 2. The result obtained by comparing the information obtained from the image data of the mask film used when creating the inspection object as reference data with the information obtained by image-processing the inspection object. In addition, the inspection data of the inspection object in which the defective portion is detected is recorded, and the inspection is performed using the data obtained by extracting only the defective portion or the defective element from the inspection data when performing the appearance inspection again. Appearance inspection method. 3. The appearance inspection method according to claim 1, wherein a printed wiring board is used as the inspection object. 4. A data input unit for taking in drawing data of a mask film of an object to be inspected, a data adding unit for adding predetermined color information and luminance information to the drawing data, and color information in the data adding unit. A synthesizing unit for synthesizing each drawing data to which the luminance information is added and processing and converting the luminance for each predetermined coordinate, a unit for displaying and storing the data output from the synthesizing unit, and the inspection object. Color image pickup device for picking up a color image, and a composite video signal picked up by the color image pickup device is separated into a color signal and a luminance signal for each designated color, and converted into digital signals for each predetermined coordinate. An image processing unit for converting and processing, and a determining unit for comparing the data processed by the image processing unit with the data synthesized and converted by the synthesizing unit as reference data and determining the quality of the inspected object. Having prepared Appearance inspection device. 5. The appearance inspection apparatus according to claim 4, wherein the determination unit has a function of determining only an inspection range or a portion in which an element is designated. 6. The data input unit for taking in the drawing data is a data input unit for taking in drawing data of a mask film having a printed wiring board as an inspection object.
Appearance inspection device described.