JPS61222154A - Electronic circuit parts - Google Patents
Electronic circuit partsInfo
- Publication number
- JPS61222154A JPS61222154A JP6261785A JP6261785A JPS61222154A JP S61222154 A JPS61222154 A JP S61222154A JP 6261785 A JP6261785 A JP 6261785A JP 6261785 A JP6261785 A JP 6261785A JP S61222154 A JPS61222154 A JP S61222154A
- Authority
- JP
- Japan
- Prior art keywords
- frame
- thickness
- plate
- chip
- supporting part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、パワートランジスタやパワーＩＣのような大
電力用電子回路部品、詳しくは該電子回路部品に一体に
組み込まれる金属製のフレームに関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a high-power electronic circuit component such as a power transistor or a power IC, and more particularly to a metal frame that is integrated into the electronic circuit component.
〈従来の技術〉
従来の大電力用電子回路部品、たとえばパワートランジ
スタには、第２図の側面図に示すように、チップ支持部
２０とリード端子部３０とからなるフレーム１６が細入
−入すわ丁松ｈ−肢７レーム１０のチップ支持部２ｏに
は半導体チップ４０が取り付けられ、リード端子部釦は
コレクタ端子として樹脂モールド部５０の外部に突出す
るようになっている。しかして前記フレームｌＯにおけ
るチップ支持部２ｏの厚さｉｔｏは、リード端子部３０
の厚さｔ、。に比べ厚くなっている。これは、半導体チ
ップ４０での発生熱が効率よく放熱するよう、チップ支
持部２ｏの熱容量を大にするためである。<Prior Art> As shown in the side view of FIG. 2, in a conventional high-power electronic circuit component, such as a power transistor, a frame 16 consisting of a chip support portion 20 and a lead terminal portion 30 is inserted into the frame 16. A semiconductor chip 40 is attached to the chip support part 2o of the pine h-limb 7 frame 10, and the lead terminal part buttons protrude to the outside of the resin mold part 50 as collector terminals. Therefore, the thickness ito of the chip support portion 2o in the frame IO is equal to the thickness ito of the lead terminal portion 30.
Thickness t,. It is thicker than . This is to increase the heat capacity of the chip support portion 2o so that the heat generated by the semiconductor chip 40 can be efficiently dissipated.
〈発明が解決しようとする問題点〉
ところで、従来は、このようなフレーム１ｏを銅のよう
な単一の材料で一体的に成形しているが、該フレーム１
ｏは、チップ支持部２ｏとリード端子部３０とで厚さが
異なる特殊な形状であるため、その材料費がかさみ、こ
れがパワートランジスタ等の電子回路部品のコストアッ
プを招く一因となっていた。<Problems to be Solved by the Invention> Conventionally, such a frame 1o is integrally molded from a single material such as copper;
o has a special shape in which the thickness of the chip support part 2o and the lead terminal part 30 are different, which increases the cost of materials, which is one of the causes of an increase in the cost of electronic circuit components such as power transistors. .
本発明は、上述の問題点に鑑みてなされたものであって
、フレームを安価に製造しうるようにして、パワートラ
ンジスタ等の電子回路部品のコストの低減化を図ること
を目的とする。The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to reduce the cost of electronic circuit components such as power transistors by making it possible to manufacture a frame at low cost.
〈問題点を解決するための手段〉
本発明は、上記の目的を達成するために、各部一定厚さ
の板材でフレームを形成し、そのフレームのチップ支持
部に金属製の積層板を接合して該チップ支持部全体の厚
さをリード端子部より大にしたものである。<Means for Solving the Problems> In order to achieve the above-mentioned object, the present invention forms a frame using plate materials each having a constant thickness, and a metal laminate is bonded to the chip supporting portion of the frame. Therefore, the thickness of the entire chip support portion is made larger than that of the lead terminal portion.
〈実施例〉
以下、本発明を図面に示す実施例に基づいて詳細に説明
する。第１図は本発明にかかるパワートランジスタに用
いるフレームの側面図で、該フレームｌは、チップ支持
部２とリード端子部３とからなる。前記チップ支持部２
の一面には半導体チップ４が取り付られる。リード端子
部３は外部に突出してコレクタ端子となる。このリード
端子部３には、ベース端子とエミッタ端子（いずれも図
示せず）とが並列して設けられ、これらベース端子およ
びエミッタ端子がそれぞれ半導体チップ４と接続された
のち、チップ支持部２と半導体チップ４とは樹脂モール
ドされる。５はその樹脂モールド部である。<Example> Hereinafter, the present invention will be described in detail based on an example shown in the drawings. FIG. 1 is a side view of a frame used in a power transistor according to the present invention, and the frame 1 consists of a chip support part 2 and a lead terminal part 3. The chip support section 2
A semiconductor chip 4 is attached to one surface of the . The lead terminal portion 3 protrudes to the outside and becomes a collector terminal. This lead terminal section 3 is provided with a base terminal and an emitter terminal (both not shown) in parallel, and after these base terminals and emitter terminals are respectively connected to the semiconductor chip 4, they are connected to the chip support section 2. The semiconductor chip 4 is molded with resin. 5 is the resin molded part.
しかして、前記フレーム１は各部一定厚さの板材で形成
され、そのチップ支持部２の厚さｔｌとリード端子部３
の厚さｔ、とは互いに等しくなっているＱ＋＝ｔｔ）。The frame 1 is formed of a plate material having a constant thickness at each part, and has a thickness tl of the chip support part 2 and a thickness tl of the lead terminal part 3.
The thicknesses t, and Q+=tt are equal to each other.
このチップ支持部２において、半導体チップ４が取り付
られる面部とは反対の面部には、銅のような熱伝導性、
導電性に優れた金属からなる積層板６が重合され、溶接
もしくは接着剤での接着により接合されている。これに
よってチップ支持部２全体の厚さがリード端子部３の厚
さｔ２より大となっている。In this chip support portion 2, a surface portion opposite to the surface portion on which the semiconductor chip 4 is attached has a thermally conductive material such as copper,
Laminated plates 6 made of metal with excellent conductivity are polymerized and joined by welding or adhesive bonding. As a result, the overall thickness of the chip support portion 2 is greater than the thickness t2 of the lead terminal portion 3.
上記構成において、フレーム１のチップ支持部２は全体
として板厚が大となっているから、熱容量が大きく、そ
のため、半導体チップ４で発生する熱が効率よく放熱さ
れる。In the above configuration, the chip support portion 2 of the frame 1 has a large plate thickness as a whole, and therefore has a large heat capacity, so that the heat generated in the semiconductor chip 4 is efficiently dissipated.
なお、上記実施例には本発明をパワートランジスタに実
施した例を示したが、本発明は音響用パワーＩＣ等のＩ
Ｃにも実施しうろことはいうまでもない。In addition, although the above embodiment shows an example in which the present invention is implemented in a power transistor, the present invention can also be applied to an IC such as an acoustic power IC.
It goes without saying that this should also be implemented for C.
なおまた、上記実施例においては、フレームｌのチップ
支持ｌ１Ｂ２に直接的に半導体チップ４を取り付けたが
、積層板６に半導体チップ４を取り付けてもよい。また
フレームｌのチップ支持部２もしくは積層板６のいずれ
か一方、あるいはその両者２，６をリード端子部２とは
反対側に長く延長してその延長端を樹脂モールド部５の
外部に突出させ、その突出部を放熱器への取付タブとす
ることもできる。Furthermore, in the above embodiment, the semiconductor chip 4 was attached directly to the chip support l1B2 of the frame l, but the semiconductor chip 4 may be attached to the laminated plate 6. In addition, either one of the chip support part 2 or the laminated plate 6 of the frame l, or both 2 and 6, is extended long on the side opposite to the lead terminal part 2, and the extended end thereof is extended to the outside of the resin mold part 5. , the protrusion can also be used as a mounting tab for the heat sink.
〈発明の効果〉
以上のように、本発明によれば、フレームを各部一定厚
さの板材で形成し、該フレームのチップ支持部に別部材
である積層板を接合し、これによってチップ支持部全体
の厚さを大にしているから、フレームも、これに接合す
る積層板も、いずれも一定厚さの板材から造ることがで
き、従来のように特殊な形状の材料を用いる必要がなく
、フレームを安価に製作することができ、電子回路部品
のコストの低減化が可能となる。<Effects of the Invention> As described above, according to the present invention, each part of the frame is formed of a plate material having a constant thickness, and a laminate plate, which is a separate member, is bonded to the chip support part of the frame, whereby the chip support part Because the overall thickness is large, both the frame and the laminates attached to it can be made from board materials of a constant thickness, eliminating the need to use materials with special shapes as in the past. The frame can be manufactured at low cost, and the cost of electronic circuit components can be reduced.
第１図は本−発明の一実施例に用いるフレームの図であ
る。
ｌ・・・フレーム、２・・・チップ支持部、３・・・リ
ード端子部、４・・・半導体チップ、５・・・樹脂モー
ルド部、６・・・積層板。FIG. 1 is a diagram of a frame used in one embodiment of the present invention. 1...Frame, 2...Chip support part, 3...Lead terminal part, 4...Semiconductor chip, 5...Resin mold part, 6...Laminated board.
Claims (1)
を備えた電子回路部品において、前記フレームを各部一
定厚さの板材で形成し、チップ支持部の一面には金属製
の積層板を接合したことを特徴とする電子回路部品。(1) In an electronic circuit component including a frame consisting of a chip support part and a lead terminal part, each part of the frame is formed of a plate material with a constant thickness, and a metal laminate plate is bonded to one surface of the chip support part. An electronic circuit component characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6261785A JPS61222154A (en) | 1985-03-27 | 1985-03-27 | Electronic circuit parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6261785A JPS61222154A (en) | 1985-03-27 | 1985-03-27 | Electronic circuit parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61222154A true JPS61222154A (en) | 1986-10-02 |
Family
ID=13205454
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6261785A Pending JPS61222154A (en) | 1985-03-27 | 1985-03-27 | Electronic circuit parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61222154A (en) |
-
1985
- 1985-03-27 JP JP6261785A patent/JPS61222154A/en active Pending
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