JPS61213680A - Ic testing device - Google Patents

Ic testing device

Info

Publication number
JPS61213680A
JPS61213680A JP5485385A JP5485385A JPS61213680A JP S61213680 A JPS61213680 A JP S61213680A JP 5485385 A JP5485385 A JP 5485385A JP 5485385 A JP5485385 A JP 5485385A JP S61213680 A JPS61213680 A JP S61213680A
Authority
JP
Japan
Prior art keywords
test head
test
head
cooling
duct
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5485385A
Other languages
Japanese (ja)
Other versions
JPH0578791B2 (en
Inventor
Yoshikazu Soda
曽田　吉一
Katsumi Takami
高見　勝己
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi Electronics Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Electronics Engineering Co Ltd filed Critical Hitachi Electronics Engineering Co Ltd
Priority to JP5485385A priority Critical patent/JPS61213680A/en
Publication of JPS61213680A publication Critical patent/JPS61213680A/en
Publication of JPH0578791B2 publication Critical patent/JPH0578791B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To improve cooling effect of a test heat by providing a cooling device to the main body, and providing a duct that introduces cooling air from the device to the test head to enter the test head from the vicinity of supported position of the test head. CONSTITUTION:The device 10 consists of a main body 12 and a test head 14. The head 14 is supported rotatably by a support 18. When the device 10 is used for hand sorting of IC, the head 14 i set to horizontal position. When the device 10 is used for automatic testing of IC in combination with an IC handler, the head is rotated clockwise by 90 deg.. When making test of an IC wafer, a probe card is attached on the upper face of the head 14, and the head 14 is rotated clockwise by 180 deg. from horizontal position. On the other hand, a cooling device is provided in the main body 12, and an end of a duct 22 is connected to a discharge port of cooling air, and the duct 22 is pulled out to outside from an pulling out section 24 on the side of the main body 12.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、ＩＣテスト装置に関し、特にＩＣテスト装
置のテストヘッド内部の冷却に係わる改良に関ずろ。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an IC test device, and more particularly to improvements related to cooling inside a test head of an IC test device.

〔従来技術〕[Prior art]

ＩＣテスト装置のテストヘッド内には多数の回路基板が
実装されており、その搭載部品による発熱量は相当に大
きい。そこで従来は、テストヘッドの内部にファンを設
け、テストヘッドの底面に設けられた開口よ秒外気を吸
い込み、テストヘッド内部を通過させてテストヘッドの
側面から排出さ、せろことにより、回路基板を冷却する
ようにしている。A large number of circuit boards are mounted in the test head of an IC test device, and the amount of heat generated by the mounted components is considerably large. Conventionally, a fan was installed inside the test head to suck in outside air through an opening on the bottom of the test head, let it pass through the inside of the test head, and exhaust it from the side of the test head. I'm trying to cool it down.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

しかし、テスト対象のＩＣの高Ｓ積化に伴い、テストヘ
ッド内に実装される回路基板の枚数が増加し、また、そ
の実装密度も高くなってきたため、前記のような従来の
冷却構造では十分な冷却効果を達成することが困難にな
りつつある。However, as the number of circuit boards mounted in the test head has increased as ICs to be tested have increased in S density, the number of circuit boards mounted within the test head has also increased, and the conventional cooling structure described above is insufficient. It is becoming difficult to achieve a good cooling effect.

〔発明の目的〕[Purpose of the invention]

したがって、この発明の主たる目的は、冷却構造を改良
し、テストヘッドの冷却効果の向上を図ったＩＣテスト
装置を提供することにある。Therefore, a main object of the present invention is to provide an IC test device with an improved cooling structure and an improved cooling effect for the test head.

ここで、ＩＣテスト装置は、しばしば移動させろ必要が
あり、固定的に据え付けられる機器のように、外部の冷
却装置からダクトなどを介して冷却空気をテストヘッド
に供給する方法を採用し難い。Here, IC test equipment often needs to be moved, and unlike fixedly installed equipment, it is difficult to adopt a method of supplying cooling air to the test head from an external cooling device through a duct or the like.

また、テストヘッドは、ＩＣの手選別の場合には水平位
置にセットし、ＩＣハンドラと組合わせて使用する場合
は９０’回転させて直立させ、プローバ（プローブ・カ
ード）を取す付けてｔＣつ・エバのテストを行う場合は
、１８０°回転させ、裏返した状態で使用するため、こ
のようなテストヘッドの回動を妨げないような冷却構造
が要求される。In addition, when manually sorting ICs, the test head is set in a horizontal position, and when used in combination with an IC handler, it is rotated 90' to stand upright, and a prober (probe card) is installed. When performing a double-evaporation test, the test head is rotated 180 degrees and used upside down, so a cooling structure that does not impede such rotation of the test head is required.

さらに、テストヘッドにプローバ（プローブ・カード）
をセットしてＩＣＣウニのテストを行う場合、テストヘ
ッドの中央開口を介して、ＩＣウェハ而面顕ｆｊａ鏡ｗ
ｉｇするため、その中央開口の部分に冷却用ダクトなど
を設けるのは好ましくない。In addition, a prober (probe card) is attached to the test head.
When testing an ICC wafer by setting the
ig, it is not preferable to provide a cooling duct or the like in the central opening.

したがって、この発明の他の目的は、そのような装置全
体の移動、テストヘッドの回動、およびテストヘッド中
央開口を介しての顕微１！１１１測を妨げない冷却構造
を持つＩＣテスト装置を提供することにある。Therefore, another object of the present invention is to provide an IC test device having a cooling structure that does not impede movement of the entire device, rotation of the test head, and microscopic measurements through the central opening of the test head. It's about doing.

〔問題点を解決するための手段〕 この目的を達成するために、この発明によれば、１Ｇテ
スト装置の本体に冷却装置が設けられるとともに、この
冷却装置から冷却空気をテストヘッドに導（ダクトが、
テストヘッドの支持位置の近傍よりテストヘッドに侵入
するように設けられる。[Means for solving the problem] In order to achieve this object, according to the present invention, a cooling device is provided in the main body of the 1G test device, and cooling air is guided (ducted) from the cooling device to the test head. but,
It is provided so as to enter the test head from near the support position of the test head.

〔作用〕[Effect]

冷却装置により冷却された空気をテストヘッドに供給す
るから、従来より高い冷却効果を得られ、また冷却装置
はＩＣテスト装置本体に設けられるから、ＩＣテスト装
置の移動が妨げられることはない。Since air cooled by the cooling device is supplied to the test head, a higher cooling effect than before can be obtained, and since the cooling device is provided in the main body of the IC testing device, movement of the IC testing device is not hindered.

また、冷却空気をテストヘッドに導くためのダクトがテ
ストヘッドに侵入する位置は、テストヘッドの回動によ
る本体との距離変動が少ない位置である。したがって、
格別特殊なダクトを用いなくても、テストヘッドを回動
可能にできる。さらに、テストヘッドの中央開口を横切
らないようなダクト配置が容易である。Further, the position where the duct for guiding cooling air to the test head enters the test head is a position where the distance from the main body due to rotation of the test head is less likely to change. therefore,
The test head can be made rotatable without using any special duct. Furthermore, it is easy to arrange the duct so that it does not cross the central opening of the test head.

〔実施例〕〔Example〕

以下、この発明の一実施例について図面を参照して詳細
に説明する。Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings.

第１図は、この発明を適用したＩＣテスト装置の一例を
示す概略正面図である。この図に示すＩＣテスト装置１
０は、冷却に関連した構造以外は従来と同様であり、本
体１２とテストヘッド１４から構成されている。本体１
２は、テストヘッド１４内の回路用の電源などを収容し
ているものであり、レベリングボルト１６によって床上
に移動可能に設置される。FIG. 1 is a schematic front view showing an example of an IC test device to which the present invention is applied. IC test equipment 1 shown in this figure
0 is the same as the conventional one except for the structure related to cooling, and is composed of a main body 12 and a test head 14. Main body 1
Reference numeral 2 houses a power supply for the circuit within the test head 14, and is movably installed on the floor using leveling bolts 16.

テストヘッド１４は、支持部１Ｂによって、少なくとも
回動可能に支持されている。ＩＣテスト装置！１０をＩ
Ｃの手選別に使用する場合、テストヘッド１４は図示の
水平位置にセットされる。ＩＣテスト装置［１０をＩＣ
ハンドラと組合わせ、ＩＣの自動テストに使用する場合
、テストヘッド１４は時計回転方向に９０°回転させら
れて直立位置にセットされ、テストヘッド１４の上面側
に設けられたソケット２０とＩＣハンドラの接続ビンと
が結合される。ＩＣウェハのテストを行う場合、テスト
ヘッド１４の上面側にプローブ・カード（ブローバ）が
取り付けられ、テストヘッド１４は水平位置から時計回
転方向に１８０°回転させられ、裏返しの状態で使用さ
れる。The test head 14 is at least rotatably supported by the support portion 1B. IC test equipment! 10 to I
When used for manual sorting of C, the test head 14 is set in the horizontal position shown. IC test equipment [10 IC
When used in combination with a handler for automatic IC testing, the test head 14 is rotated 90 degrees clockwise and set in an upright position, and the socket 20 provided on the top side of the test head 14 and the IC handler are connected. The connection bin is combined. When testing an IC wafer, a probe card (blow bar) is attached to the upper surface of the test head 14, and the test head 14 is rotated 180° clockwise from a horizontal position and used upside down.

なお、本体１２とテストヘッド１４との間の信号ケーブ
ルや、冷却構造に直接関係しない前記以外の部分は、図
中省略されている。Note that the signal cable between the main body 12 and the test head 14 and other parts not directly related to the cooling structure are omitted in the figure.

次に、この発明に直接関係する冷却構造について説明す
る。本体１２の内部に冷却装置が設けられている。この
冷却構ｗ２０の冷却空気吐き出し口にはダクト２２の一
方の端が接続され、このダクト２２は本体１２の側面の
引き出し部２４より外部に引き出されている。ダクト２
２は、蛇腹状のチニーブまたはフレキシブルなチューブ
から構成されている。Next, a cooling structure directly related to the present invention will be explained. A cooling device is provided inside the main body 12. One end of a duct 22 is connected to the cooling air outlet of the cooling structure w20, and the duct 22 is drawn out from a drawer portion 24 on the side surface of the main body 12. Duct 2
2 is composed of a bellows-shaped tinib or a flexible tube.

ここで、第２図を参照する。この図は、テストヘッド１
４のｎ−ｎ’ｌｌｌ！略断面図であ外、テストヘッド１
４の冷却に直接関連しない部分は省略または簡略化さｈ
ている。Reference is now made to FIG. This diagram shows test head 1
4 n-n'llll! Schematic cross-sectional view showing test head 1
4. Parts not directly related to cooling are omitted or simplified.
ing.

この図において、２６はテストヘッド１４の底面に形成
された中央開口であり、２８はテストヘッド１４内部に
、中央開口２６を取り囲むように放射状配列された回路
基板である。回路基板２８の外側には、ファン３０が図
示のように配列されている。In this figure, 26 is a central opening formed on the bottom surface of the test head 14, and 28 is a circuit board arranged radially inside the test head 14 so as to surround the central opening 26. Fans 30 are arranged outside the circuit board 28 as shown.

底面の中心部には、中央開口２６より径の太き、な中空
の冷却空気吹き出し環３２が取付けられている。この冷
却空気吹き出し環３２の側面には、複数の吹き出し口３
２ｍが形成されている。この吹き出し環３２から延出す
るダクト部３２ｂの先端は、テストヘッド１４の側面の
支持部１８に接近した位置に設けられた連結Ｎ３４によ
り、冷却装置！２０からのダクト２２の他方の端と接続
されている。また、テストヘッド１４の側面には、第１
図に示されるように、網窓３６が設けられている。A hollow cooling air blowing ring 32 having a diameter larger than that of the central opening 26 is attached to the center of the bottom surface. A plurality of air outlets 3 are provided on the side surface of this cooling air blowing ring 32.
2m is formed. The tip of the duct portion 32b extending from the blowing ring 32 is connected to a cooling device by a connection N34 provided at a position close to the support portion 18 on the side surface of the test head 14. 20 and the other end of the duct 22. Also, on the side of the test head 14, a first
As shown in the figure, a mesh window 36 is provided.

冷却動作を説明する。冷却装置１２０から吐き出された
冷却空気は、ダクト２２に導かれてテストヘッド１４内
の冷却空気吹き出し環２６へ送られ、その吹き出し口３
２ｍより回路基板２８の実装空間に送出される。この冷
却空気は、ファン３０の作用により、外側へ送られ、そ
の際に回路基板２８の熱を奪い、最終的に網窓３６を通
じてテストヘッド１４の外部へ排出されろ。The cooling operation will be explained. The cooling air discharged from the cooling device 120 is guided to the duct 22 and sent to the cooling air blowing ring 26 in the test head 14, and the blowing outlet 3
2m into the mounting space of the circuit board 28. This cooling air is sent to the outside by the action of the fan 30, removes heat from the circuit board 28, and is finally discharged to the outside of the test head 14 through the screen window 36.

このように、外気ではなく、冷却空気が用いられるから
、回路基板全体の発熱量が多くても、十分な冷却効果を
達成できる。In this way, since cooling air is used instead of outside air, a sufficient cooling effect can be achieved even if the entire circuit board generates a large amount of heat.

また、中央開口２６はダクト２２によって遮ぎられない
から、■Ｃウェハのテスト時に、中央開口２６を通じて
顕微鏡観察を行い得る。Furthermore, since the central opening 26 is not blocked by the duct 22, microscopic observation can be performed through the central opening 26 during testing of the ■C wafer.

さらに、ダクト２２のテストヘッド１４への引き込み位
置と本体との距離は、テストヘッド１４が回動しても変
化が少ないため、ダクト２２として蛇腹状チューブまた
はフレキシブルチューブなどの簡単な部材を使用できる
。Furthermore, since the distance between the drawing position of the duct 22 into the test head 14 and the main body does not change much even when the test head 14 rotates, a simple member such as a bellows-shaped tube or a flexible tube can be used as the duct 22. .

また、ＩＣテスト装置１０に外部のダクトを接続しない
から、ＩＣテスト装Ｗ１０の移動は容易である。Furthermore, since no external duct is connected to the IC test equipment 10, the IC test equipment W10 can be easily moved.

なお、冷却空気吹き出し環３２を設けず、ダクト２２の
一端をテストヘッド内部の所定位置まで引き込み、冷却
空気を直接吐き出させるように変形することも可能であ
る。また、テストヘッド１４へのダクト２２の引き込み
位置は、テストヘッド支持位置の近傍ならば適宜変更し
得る（例えば、゛第１図の想像線３４′で示す位置など
）。Note that it is also possible to modify the test head so that the cooling air blowing ring 32 is not provided, one end of the duct 22 is drawn into a predetermined position inside the test head, and the cooling air is directly blown out. Further, the position at which the duct 22 is drawn into the test head 14 can be changed as appropriate as long as it is close to the test head support position (for example, the position indicated by the imaginary line 34' in FIG. 1).

これ以外にも、この発明は、その主旨を逸脱しないｌｌ
１Ｌ囲で適宜変形して実施″し得るものである。In addition to this, this invention does not depart from its gist.
It can be carried out with appropriate modifications within a 1L range.

〔効果〕〔effect〕

以上説明したように、この発明によれば、ＩＣテスト装
置の本体に冷却装置が設けられるとともに、この冷却装
置から冷却空気をテストヘッドに導くダクトが、テスト
ヘッドの支持位置の近傍よりテストヘッドに侵入するよ
うに設けられる。したがって、この発明によれば、ｖｔ
Ｗｔの移動およびテストヘッドの回動、ＩＣウニ八へテ
スト時の顛ｒｘｘｆｌ！ｔａｍに支障を来すことなく、
テストヘッドに対する冷却効果を高めたＩＣテスト装置
を実現できる。As described above, according to the present invention, a cooling device is provided in the main body of an IC test device, and a duct that guides cooling air from the cooling device to the test head is connected to the test head from near the supporting position of the test head. arranged to penetrate. Therefore, according to this invention, vt
Movement of Wt and rotation of the test head, test results for IC Uni-Hachi rxxfl! without interfering with tam.
It is possible to realize an IC test device with improved cooling effect on the test head.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、この発明によるＩＣテスト装置の一実施例を
示す概略正面図、第２図はテストヘッドの■−■′線概
略断面図である。 １０・・・ＩＣテスト装置、１２・・・本体、１４・・
・テストヘッド、１８・・・支持部、２０・・・冷却装
置、２２・・・ダクト、２６・・・中央開口、２８・・
・回路基板、３０・・・ファン１．３２・・・冷却空気
吹き出し環、３２ａ・・・吹き出し口、３２ｂ・・・ダ
クト部。 特許出願人　日立電子エンジニアリング株式会社代理人
　弁理士　梶　山　倍　是 第１図 フｎ 第２図 １を 手続補正帯（方式） ％式％ １、事件の表示 昭和６０年特許願第０５４８５３号 ２、発明の名称 ＩＣテスト装置 ３、補正をする者 事件との関係　　特許出願人 住所　神奈川県足柄上郡中井町久所３０Ｇ番地名称　日
立電子エンジニアリング株式会社代表者　中　１）九　
州　男 ４、代理人 住所　東京都千代田区神田練塀町５６番地第１マルマサ
ビル２階 ５、補正命令の日付　　昭和６０年６月２５日６、補正
の対象 ７、補正の内容 「願書に最初に添付した明細書の浄書・別紙のとおり（
内容に変更なし）」 以　　　　上FIG. 1 is a schematic front view showing an embodiment of an IC test apparatus according to the present invention, and FIG. 2 is a schematic cross-sectional view of the test head along the line 1--2'. 10... IC test device, 12... Main body, 14...
- Test head, 18... Support part, 20... Cooling device, 22... Duct, 26... Center opening, 28...
- Circuit board, 30... Fan 1. 32... Cooling air blowing ring, 32a... Air outlet, 32b... Duct part. Patent Applicant Hitachi Electronics Engineering Co., Ltd. Agent Patent Attorney Masu Kajiyama Figure 1 F n Figure 2 1 Procedure Amendment Band (Method) % Formula % 1, Case Indication Patent Application No. 054853 1985 2, Name of the invention IC test device 3, relationship with the case of the person making the amendment Patent applicant address Address 30G Kusho, Nakai-cho, Ashigarakami-gun, Kanagawa Prefecture Name Hitachi Electronics Engineering Co., Ltd. Representative Middle 1) Nine
State: Male 4, Agent Address: 2nd Floor 5, 1st Marumasa Building, 56 Kanda Renbei-cho, Chiyoda-ku, Tokyo, Date of Amendment Order: June 25, 1985 6, Subject of Amendment 7, Contents of Amendment: ``Initially stated in the application. As shown in the attached copy of the detailed statement (
(No change in content)”

Claims (1)

【特許請求の範囲】[Claims] （１）床に設置される本体上に、テストヘッドを少なく
とも回動可能に支持してなるＩＣテスト装置において、
前記本体に冷却装置が設けられるとともに、この冷却装
置から冷却空気を前記テストヘッドに導くダクトが、前
記テストヘッドに、その支持位置の近傍より侵入するよ
うに設けられたことを特徴とするＩＣテスト装置。(1) In an IC test device in which a test head is at least rotatably supported on a main body installed on the floor,
An IC test characterized in that the main body is provided with a cooling device, and a duct for guiding cooling air from the cooling device to the test head is provided so as to enter the test head from near a supporting position thereof. Device.
JP5485385A 1985-03-19 1985-03-19 Ic testing device Granted JPS61213680A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5485385A JPS61213680A (en) 1985-03-19 1985-03-19 Ic testing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5485385A JPS61213680A (en) 1985-03-19 1985-03-19 Ic testing device

Publications (2)

Publication Number Publication Date
JPS61213680A true JPS61213680A (en) 1986-09-22
JPH0578791B2 JPH0578791B2 (en) 1993-10-29

Family

ID=12982148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5485385A Granted JPS61213680A (en) 1985-03-19 1985-03-19 Ic testing device

Country Status (1)

Country Link
JP (1) JPS61213680A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01193667A (en) * 1988-01-28 1989-08-03 Toshiba Corp Ic tester
KR19990042528A (en) * 1997-11-27 1999-06-15 윤종용 Semiconductor Package Test Device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01193667A (en) * 1988-01-28 1989-08-03 Toshiba Corp Ic tester
KR19990042528A (en) * 1997-11-27 1999-06-15 윤종용 Semiconductor Package Test Device

Also Published As

Publication number Publication date
JPH0578791B2 (en) 1993-10-29

Similar Documents

Publication Publication Date Title
US5834946A (en) Integrated circuit test head
JP4624262B2 (en) Probe station with low inductance path
US4468616A (en) Testing equipment for electric components
ES2036042T3 (en) DEVICE FOR MEASURING PARAMETERS IN THE NUCLEUS OF A NUCLEAR REACTOR IN SERVICE.
JPS61213680A (en) Ic testing device
CN106236137A (en) Vertical color supersonic diagnostic appts
GB2293700A (en) Test head for circuit tester
US5231653A (en) X-ray diagnostics installation
CN212275709U (en) High-altitude gas alarm detection equipment
JPS61213679A (en) Ic testing device
CN212784371U (en) Block terminal protective structure and block terminal
JP2744272B2 (en) Device test equipment
JPH0611583Y2 (en) Electronic device cooling device
JP2525489Y2 (en) Electronic equipment cooling device
CN211930654U (en) Mobile application network test system
CN209785286U (en) Novel computer science and technology teaching sample show device
CN214186849U (en) Musical instrument horn mouth anchor clamps
CN217543071U (en) Water quality testing equipment convenient to carry
JP2004527103A (en) Movable slide for measurement and / or analyzer
JPH09153531A (en) Inspection device with high cleanliness
CN211122441U (en) Portable low-concentration large-flow smoke automatic tester
US1640477A (en) Testing apparatus for ventilators
CN213812840U (en) Novel detection device for cleanliness of patch suction nozzle
US3395574A (en) Engine tester mounting system
CN210630828U (en) Multifunctional teaching instrument