JPS61213374A - Jig - Google Patents

Abstract

PURPOSE:To obtain a jig having superior strength, producing no foreign matter and easy to work by coating the surface of a heat resistant member having a high m.p. as a jig for handling wafers with high purity SiO2. CONSTITUTION:A jig body 3 for supporting many wafers 1 such as a boat or a fork is made of a heat resistant material having a high m.p. such as a metal having a high m.p. or a sintered body of Al2O3, SiC or BN. High purity SiO2 4 melted by heating is sprayed on the surface of the jig body 3 to obtain a coated jig 2 for wafers. The resulting jig 2 is not bent by the weight of wafers during use and produces no harmful foreign matter.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a technique that is effective when used in a diffusion or CVD process, etc.

[Background technology]

In the process of manufacturing semiconductor devices, jigs made of quartz are often used to handle wafers.

However, quartz jigs have the disadvantage of being relatively weak against weight and external forces. For example, in jigs called boats or forks that hold a large number of wafers, the weight of the wafers can bend the jigs and cause the wafers to fall. The inventor has discovered that there are problems such as falling from the jig during handling.

Therefore, it is possible to put a reinforcing material into the quartz jig, but if only the reinforcing material is inserted, a gap will be created between the jig and the supply material, foreign matter will easily occur, and machining will be difficult. The inventors have discovered that there are certain problems.

In addition, regarding the jig used in the diffusion process, the stock% formula% Are listed.

[Purpose of the invention]

An object of the present invention is to provide a jig that can obtain high strength.

Another object of the present invention is to provide a jig that can prevent the generation of foreign matter.

Another object of the present invention is to provide a jig that is easy to process and can be formed into a desired shape.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Summary of the invention]

A brief overview of typical inventions disclosed in this application is as follows.

In other words, by depositing high-purity Sing on a heat-resistant member such as a high-melting point metal or ceramic sintered body, a high-strength jig can be obtained, the generation of foreign matter can be prevented, and it can be easily processed. can do.

[Embodiment 1] FIG. 1 is a front view showing a jig according to an embodiment of the present invention.

The jig of the first embodiment is a fork 2 used to carry a wafer 1 into and out of a diffusion furnace (not shown) used in a diffusion process in the manufacturing process of semiconductor devices.

This fork 2 is made of a high melting point metal such as alumina (AI□03) or silicon carbide (SiC).
A high-purity SiC2 layer 4 is deposited on a main body 3 made of a heat-resistant member such as a ceramic sintered body. (For convenience of illustration, since the SiO□ layer 4 is a thin film, it is indicated by a dotted line area. This is the same throughout FIGS. 1 to 3.) In the fork 2 according to this embodiment, the main body 3 has a high melting point. By being made of metal, a large number of wafers 3 can be
! In addition to being able to obtain sufficient strength even when placed, it is easy to process, and because it is coated with a high-purity SiO□ layer 4, it prevents the generation of foreign matter and is easy to use with etching solutions. Penetration into the main body 3 can also be prevented.

Next, a method for forming the jig of this example will be explained.

First, the body 3 of the fork 2 is made of Al1103 or SiC.
is formed into a desired shape.

Next, SiO2 is deposited around the main body 3. This SiO□ is S'i0. may be sprayed onto the main body 3 from a nozzle (not shown), or quartz glass wool may be attached by an appropriate method.

Thereafter, the main body 3 is placed in a furnace (not shown) at a temperature of, for example, 1300°C.
By heating the main body 3 to a high temperature, SiO
□Layer 4 is coated.

In addition, when spraying the Sing after heating and melting onto the main body 3, the Sing layer 4 can also be deposited on the main body 3 without further heating.

[Embodiment 2] FIG. 2 is a perspective view of a jig according to another embodiment of the present invention.

In the second embodiment, the jig is used to store products of semiconductor devices. A high purity SiO□ layer 7 is deposited. Sin.

The layer 7 is deposited on the SiO□ layer 4 (1) in Example 1 above.
By depositing high-purity SiOz on a heat-resistant member such as a high melting point metal or a ceramic sintered body, a jig with high strength can be obtained.

(21, By adhering S i Of, the generation of foreign matter can be prevented.

(3) By forming the jig with a heat-resistant member such as a high melting point metal or a ceramic sintered body, processing is simple and a desired shape can be easily obtained.

(41, Adhesion of SiO□ can prevent impurities such as etching solution from penetrating and gas adsorption.

It goes without saying that the invention made by the present inventors is not limited to the embodiments described above, and can be modified in various ways without departing from the gist thereof.

For example, other high melting point metal materials may be used.

[Application field]

In the above explanation, the invention made by the present inventor was mainly applied to forks and magazines, which are the field of application that formed the background of the invention, but the invention is not limited thereto (for example, various applications such as CVD process, etc.). It can be widely applied to jigs used in semiconductor manufacturing processes.

[Brief explanation of the drawing]

FIG. 1 is a diagram of a jig which is an embodiment of the present invention. 1... Wafer, 2... Fork (jig), 3...
Main body, 4...Sin1 layer, 5...Magazine (jig)
, 6...Main body, 7...Sin. layer.

Claims (1)

[Claims] 1. A jig made of a heat-resistant member and coated with high-purity SiO_2 on the heat-resistant member. 2. The jig according to claim 1, wherein SiO_2 is formed by applying heat treatment after adhering to a heat-resistant member. 3. The jig according to claim 1, wherein the heat-resistant member is a ceramic made of alumina. 4. Claim 1, characterized in that the heat-resistant member is made of silicon carbide or boron nitride.
Jig described in section. 5. The jig according to claim 1, characterized in that SiO_2 is applied to a heat-resistant member by being heated and melted.