JPS61210692A - プリント配線基板に部品を半田付けする方法 - Google Patents

プリント配線基板に部品を半田付けする方法

Info

Publication number
JPS61210692A
JPS61210692A JP5186085A JP5186085A JPS61210692A JP S61210692 A JPS61210692 A JP S61210692A JP 5186085 A JP5186085 A JP 5186085A JP 5186085 A JP5186085 A JP 5186085A JP S61210692 A JPS61210692 A JP S61210692A
Authority
JP
Japan
Prior art keywords
solder
component
intake
air supply
end nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5186085A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0227833B2 (enrdf_load_stackoverflow
Inventor
八木 金作
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP5186085A priority Critical patent/JPS61210692A/ja
Publication of JPS61210692A publication Critical patent/JPS61210692A/ja
Publication of JPH0227833B2 publication Critical patent/JPH0227833B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP5186085A 1985-03-15 1985-03-15 プリント配線基板に部品を半田付けする方法 Granted JPS61210692A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5186085A JPS61210692A (ja) 1985-03-15 1985-03-15 プリント配線基板に部品を半田付けする方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5186085A JPS61210692A (ja) 1985-03-15 1985-03-15 プリント配線基板に部品を半田付けする方法

Publications (2)

Publication Number Publication Date
JPS61210692A true JPS61210692A (ja) 1986-09-18
JPH0227833B2 JPH0227833B2 (enrdf_load_stackoverflow) 1990-06-20

Family

ID=12898618

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5186085A Granted JPS61210692A (ja) 1985-03-15 1985-03-15 プリント配線基板に部品を半田付けする方法

Country Status (1)

Country Link
JP (1) JPS61210692A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6377193A (ja) * 1986-09-19 1988-04-07 東洋エレクトロニクス株式会社 プリント配線基板に部品を半田付けする方法
JP2016004846A (ja) * 2014-06-14 2016-01-12 株式会社アンド 半田処理装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03154733A (ja) * 1989-11-13 1991-07-02 Fuji Jikou Kk 磁力チャック

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5742999A (en) * 1981-03-20 1982-03-10 Denki Kagaku Kogyo Kk Paint for polishing and press processing paper
JPS5765771U (enrdf_load_stackoverflow) * 1980-09-30 1982-04-20

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5765771U (enrdf_load_stackoverflow) * 1980-09-30 1982-04-20
JPS5742999A (en) * 1981-03-20 1982-03-10 Denki Kagaku Kogyo Kk Paint for polishing and press processing paper

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6377193A (ja) * 1986-09-19 1988-04-07 東洋エレクトロニクス株式会社 プリント配線基板に部品を半田付けする方法
JP2016004846A (ja) * 2014-06-14 2016-01-12 株式会社アンド 半田処理装置

Also Published As

Publication number Publication date
JPH0227833B2 (enrdf_load_stackoverflow) 1990-06-20

Similar Documents

Publication Publication Date Title
JP3359974B2 (ja) 特に集積回路のためのはんだ付け/はんだ剥がし装置
US4426571A (en) Portable electric hot air rework tool for soldering and desoldering printed circuit assemblies
US4934582A (en) Method and apparatus for removing solder mounted electronic components
US4813589A (en) Surface mounted device rework heat guide
WO2007097134A1 (ja) 半田付け実装構造の製造方法および製造装置
US6360934B1 (en) Apparatus and method for removing a soldered device from a printed circuit board
US3673384A (en) Integrated circuit extractor tool
JPS61210692A (ja) プリント配線基板に部品を半田付けする方法
JP4685793B2 (ja) 二段式の予熱器、はんだ付け又ははんだ除去の方法及びキット、並びに、電子部品実装システム
JPS6377193A (ja) プリント配線基板に部品を半田付けする方法
CN217018967U (zh) 无铅焊接热风的pcb板回流焊机
US6827253B2 (en) Method and means for rapid heat-sink soldering
CN201256488Y (zh) 重工焊接治具
JPH0241771A (ja) 半田付装置
JPS5877769A (ja) はんだ付け方法及び装置
JP3127407B2 (ja) 熱圧着方法
JP3164062B2 (ja) ヒートシンク半田付け用の治工具
JP2001274542A (ja) 半田付け装置
CN119609278A (zh) 具有局部加热功能的加热结构及其使用方法
JPH01286387A (ja) 電子部品のリプレース方法
JPH04309457A (ja) 半田付け装置
JPS60164394A (ja) プリント配線基板に部品を半田付けする方法
JP2812094B2 (ja) 半田tabの構造ならびに半田tabのilb装置およびilb方法
JPH07142857A (ja) 多ピン電子部品外し器具
JP2001223464A (ja) 半田付け方法