JPS61210619A - 廃ガス分解装置 - Google Patents

廃ガス分解装置

Info

Publication number
JPS61210619A
JPS61210619A JP5179185A JP5179185A JPS61210619A JP S61210619 A JPS61210619 A JP S61210619A JP 5179185 A JP5179185 A JP 5179185A JP 5179185 A JP5179185 A JP 5179185A JP S61210619 A JPS61210619 A JP S61210619A
Authority
JP
Japan
Prior art keywords
waste gas
piping
section
gas decomposition
heated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5179185A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0587971B2 (enrdf_load_stackoverflow
Inventor
Kazumi Kasai
和美 河西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP5179185A priority Critical patent/JPS61210619A/ja
Publication of JPS61210619A publication Critical patent/JPS61210619A/ja
Publication of JPH0587971B2 publication Critical patent/JPH0587971B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
JP5179185A 1985-03-14 1985-03-14 廃ガス分解装置 Granted JPS61210619A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5179185A JPS61210619A (ja) 1985-03-14 1985-03-14 廃ガス分解装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5179185A JPS61210619A (ja) 1985-03-14 1985-03-14 廃ガス分解装置

Publications (2)

Publication Number Publication Date
JPS61210619A true JPS61210619A (ja) 1986-09-18
JPH0587971B2 JPH0587971B2 (enrdf_load_stackoverflow) 1993-12-20

Family

ID=12896761

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5179185A Granted JPS61210619A (ja) 1985-03-14 1985-03-14 廃ガス分解装置

Country Status (1)

Country Link
JP (1) JPS61210619A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6453412A (en) * 1987-08-24 1989-03-01 Toshiba Corp Unreacted gas treatment device
JP2020521328A (ja) * 2017-05-19 2020-07-16 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 液体および固体の排出物を収集して後に反応させて気体の排出物にする装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6453412A (en) * 1987-08-24 1989-03-01 Toshiba Corp Unreacted gas treatment device
JP2020521328A (ja) * 2017-05-19 2020-07-16 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 液体および固体の排出物を収集して後に反応させて気体の排出物にする装置

Also Published As

Publication number Publication date
JPH0587971B2 (enrdf_load_stackoverflow) 1993-12-20

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees