JPS6120775Y2 - - Google Patents
Info
- Publication number
- JPS6120775Y2 JPS6120775Y2 JP13113580U JP13113580U JPS6120775Y2 JP S6120775 Y2 JPS6120775 Y2 JP S6120775Y2 JP 13113580 U JP13113580 U JP 13113580U JP 13113580 U JP13113580 U JP 13113580U JP S6120775 Y2 JPS6120775 Y2 JP S6120775Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- cut
- semiconductor device
- post
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000017525 heat dissipation Effects 0.000 claims description 25
- 125000006850 spacer group Chemical group 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000005219 brazing Methods 0.000 claims 1
- 230000005855 radiation Effects 0.000 description 6
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13113580U JPS6120775Y2 (forum.php) | 1980-09-17 | 1980-09-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13113580U JPS6120775Y2 (forum.php) | 1980-09-17 | 1980-09-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5755957U JPS5755957U (forum.php) | 1982-04-01 |
| JPS6120775Y2 true JPS6120775Y2 (forum.php) | 1986-06-21 |
Family
ID=29491435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13113580U Expired JPS6120775Y2 (forum.php) | 1980-09-17 | 1980-09-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6120775Y2 (forum.php) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015164393A (ja) * | 2014-01-28 | 2015-09-10 | 学校法人日本大学 | ヒートシンク及び複合型太陽エネルギー変換装置 |
| JP6707421B2 (ja) * | 2016-08-12 | 2020-06-10 | ミネベアミツミ株式会社 | 放熱部材及び照明装置 |
-
1980
- 1980-09-17 JP JP13113580U patent/JPS6120775Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5755957U (forum.php) | 1982-04-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0645815B1 (en) | High power semiconductor switch module | |
| US4559580A (en) | Semiconductor package with internal heat exchanger | |
| US5444295A (en) | Linear dual switch module | |
| US5519253A (en) | Coaxial switch module | |
| US5794684A (en) | Stacked fin heat sink construction and method of manufacturing the same | |
| JPWO2006019059A1 (ja) | 熱電冷却装置 | |
| TWI676251B (zh) | 半導體裝置、半導體裝置的製造方法及電極板 | |
| JPS6120775Y2 (forum.php) | ||
| JPH06275746A (ja) | 半導体装置 | |
| JPS626696Y2 (forum.php) | ||
| JP2001358480A (ja) | 複合式ヒートシンク及びその製造方法 | |
| CN111082306B (zh) | 一种半导体激光阵列及其封装方法 | |
| JPH05218226A (ja) | 多層配線基板 | |
| CN211828769U (zh) | 一种叠层芯片封装结构 | |
| JP2019129228A (ja) | 半導体装置及びその製造方法 | |
| JPS6322681Y2 (forum.php) | ||
| CN116634659A (zh) | 电源模块 | |
| JPS60167349U (ja) | 半導体素子 | |
| JPS6137989Y2 (forum.php) | ||
| JPS6233332Y2 (forum.php) | ||
| JPS6350853Y2 (forum.php) | ||
| JPH1065223A (ja) | サーモモジュール | |
| JPS6112678Y2 (forum.php) | ||
| JPS61207038U (forum.php) | ||
| JPS6322680Y2 (forum.php) |