JPS61207051U - - Google Patents

Info

Publication number
JPS61207051U
JPS61207051U JP1985091774U JP9177485U JPS61207051U JP S61207051 U JPS61207051 U JP S61207051U JP 1985091774 U JP1985091774 U JP 1985091774U JP 9177485 U JP9177485 U JP 9177485U JP S61207051 U JPS61207051 U JP S61207051U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
lead wire
translucent resin
diode lamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985091774U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0412697Y2 (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985091774U priority Critical patent/JPH0412697Y2/ja
Publication of JPS61207051U publication Critical patent/JPS61207051U/ja
Application granted granted Critical
Publication of JPH0412697Y2 publication Critical patent/JPH0412697Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1985091774U 1985-06-18 1985-06-18 Expired JPH0412697Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985091774U JPH0412697Y2 (enExample) 1985-06-18 1985-06-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985091774U JPH0412697Y2 (enExample) 1985-06-18 1985-06-18

Publications (2)

Publication Number Publication Date
JPS61207051U true JPS61207051U (enExample) 1986-12-27
JPH0412697Y2 JPH0412697Y2 (enExample) 1992-03-26

Family

ID=30647959

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985091774U Expired JPH0412697Y2 (enExample) 1985-06-18 1985-06-18

Country Status (1)

Country Link
JP (1) JPH0412697Y2 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001230453A (ja) * 1999-12-08 2001-08-24 Nichia Chem Ind Ltd Ｌｅｄランプ及びその製造方法
JP2005184033A (ja) * 1999-12-08 2005-07-07 Nichia Chem Ind Ltd Ｌｅｄランプ及びその製造方法
JP2006165410A (ja) * 2004-12-10 2006-06-22 Stanley Electric Co Ltd Ｌｅｄ
JP2012190941A (ja) * 2011-03-09 2012-10-04 Stanley Electric Co Ltd 光半導体装置およびその製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5633392B2 (ja) * 2011-01-26 2014-12-03 日亜化学工業株式会社 半導体装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5179569A (enExample) * 1975-01-06 1976-07-10 Hitachi Ltd
JPS5334998A (en) * 1976-09-10 1978-03-31 Hauni Werke Koerber & Co Kg Roddshaped products conveying apparatus
JPS5839046A (ja) * 1981-08-31 1983-03-07 Rohm Co Ltd 電子部品
JPS5918691U (ja) * 1982-07-29 1984-02-04 株式会社シマノ 変速操作装置
JPS60123047A (ja) * 1983-12-07 1985-07-01 Toshiba Corp 半導体装置
JPS6347344A (ja) * 1986-08-15 1988-02-29 Koujiyundo Kagaku Kenkyusho:Kk 低酸素合金成形体の製造法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5179569A (enExample) * 1975-01-06 1976-07-10 Hitachi Ltd
JPS5334998A (en) * 1976-09-10 1978-03-31 Hauni Werke Koerber & Co Kg Roddshaped products conveying apparatus
JPS5839046A (ja) * 1981-08-31 1983-03-07 Rohm Co Ltd 電子部品
JPS5918691U (ja) * 1982-07-29 1984-02-04 株式会社シマノ 変速操作装置
JPS60123047A (ja) * 1983-12-07 1985-07-01 Toshiba Corp 半導体装置
JPS6347344A (ja) * 1986-08-15 1988-02-29 Koujiyundo Kagaku Kenkyusho:Kk 低酸素合金成形体の製造法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001230453A (ja) * 1999-12-08 2001-08-24 Nichia Chem Ind Ltd Ｌｅｄランプ及びその製造方法
JP2005184033A (ja) * 1999-12-08 2005-07-07 Nichia Chem Ind Ltd Ｌｅｄランプ及びその製造方法
JP2006165410A (ja) * 2004-12-10 2006-06-22 Stanley Electric Co Ltd Ｌｅｄ
JP2012190941A (ja) * 2011-03-09 2012-10-04 Stanley Electric Co Ltd 光半導体装置およびその製造方法

Also Published As

Publication number Publication date
JPH0412697Y2 (enExample) 1992-03-26

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