JPS61204397A - Plating device - Google Patents
Plating deviceInfo
- Publication number
- JPS61204397A JPS61204397A JP4545985A JP4545985A JPS61204397A JP S61204397 A JPS61204397 A JP S61204397A JP 4545985 A JP4545985 A JP 4545985A JP 4545985 A JP4545985 A JP 4545985A JP S61204397 A JPS61204397 A JP S61204397A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- current
- anode electrode
- power source
- anode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は電解めっき装置に関し、特にめつき槽内の陽極
電極の消耗を防止することのできるめっき装置に関する
。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an electrolytic plating apparatus, and more particularly to a plating apparatus capable of preventing wear of an anode electrode in a plating tank.
〈従来の技術〉
白金めっきなど不溶性電極を使用し、白金より卑な金属
（Ａｇ、 Ｎｉ、 Ｃｕなど）をめっきする時のめっき
装置において、めっき液が充満している状態で、めっき
電源を女波側で遮断した場合に、めっき装置内の電池作
用により被めっき物から陽極電極方向へ直流電源装置の
内部抵抗を通して逆電流が発生する。この逆電流により
陽極電極（貴金属等）に水素ガスが発生し、この水素ガ
スにより陽極電極面の酸化被膜が還元活性化し、次にめ
っき電源を入れ陽極電極が陽極になった時に陽極酸化を
受け、この還元活性化と酸化の繰返しにより陽極電極が
消耗する。<Conventional technology> When plating metals baser than platinum (Ag, Ni, Cu, etc.) using an insoluble electrode such as platinum plating, the plating power supply is turned off while the plating equipment is full of plating solution. When the wave side is interrupted, a reverse current is generated from the object to be plated toward the anode electrode through the internal resistance of the DC power supply due to the action of the battery within the plating apparatus. This reverse current generates hydrogen gas on the anode electrode (precious metal, etc.), and this hydrogen gas reduces and activates the oxide film on the anode electrode surface.Then, when the plating power is turned on and the anode electrode becomes an anode, it undergoes anodic oxidation. The anode electrode is consumed by this repetition of reduction activation and oxidation.
この逆電流を阻止するため直流電源装置の直流側に開閉
器を取り付は逆電流回路を遮断すれば逆電流を阻止する
ことができる。しかし、直流電流の遮断時にアークが発
生しやすく開閉器の寿命が短い、また、一般に直流側は
大電流になるため開閉器は大型、高価となる。In order to prevent this reverse current, the reverse current can be prevented by installing a switch on the DC side of the DC power supply and interrupting the reverse current circuit. However, arcs are likely to occur when the DC current is interrupted, and the life of the switch is short.Furthermore, the DC side generally carries a large current, making the switch large and expensive.
このため、この逆電流を効果的に阻とできる陽極電極の
消耗の少ないめっき装置が望まれている。For this reason, there is a need for a plating apparatus that can effectively block this reverse current and cause less wear and tear on the anode electrode.
〈発明が解決しようとする問題点〉
本発明の目的は、前記した従来技術の欠点を解消し、め
っき装置内の陽極電極の消耗を大幅に少なくすることが
できる新規なめっき装置を提供するものである。<Problems to be Solved by the Invention> An object of the present invention is to provide a new plating apparatus that can eliminate the drawbacks of the prior art described above and significantly reduce the consumption of the anode electrode in the plating apparatus. It is.
く問題点を解決するための手段〉
すなわち、本発明はめっき槽中の陽極および陰極と直流
電源とを含むめっき給電回路を有するめっき装置におい
て、非めっき時にめっき時の電流とは逆方向の逆電流が
流れるのを阻止する手段を、前記陽極または陰極と前記
直流電源との間に介挿したことを特徴とするめっき装置
である。Means for Solving the Problems> That is, the present invention provides a plating apparatus having a plating power supply circuit including an anode and a cathode in a plating bath and a DC power supply, in which a current in the opposite direction to that during plating is applied during non-plating. The plating apparatus is characterized in that a means for preventing current flow is interposed between the anode or the cathode and the DC power source.
逆電流の発生を阻止する手段はダイオードとするのが好
ましい。Preferably, the means for preventing the generation of reverse current is a diode.
本発明のめっき装置を図面に示す好適実施例につき詳細
に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The plating apparatus of the present invention will be described in detail with reference to preferred embodiments shown in the drawings.
第１図は本発明のめっき装置の１例を示す。FIG. 1 shows an example of the plating apparatus of the present invention.
めっき槽７への給電は、一般に商用交流電源ｌより開閉
器２を通して直流電源装置３により交流を直流に変換し
、直流電源装置３の陽極側をめっき装置７内の陽極電極
６に接続し、直流電源装置３の陰極側は被めっき物５に
接続する回路により行われる。押え板４により被めっき
物５をめっき用マスクｌＯに押し付けて固定し、めっき
槽７内にめっき液８を送り込み開閉器２を閉じることに
より、直流電流を給電回路に流しめっきを行う。Power is generally supplied to the plating tank 7 by converting the AC into DC by a DC power supply 3 through a switch 2 from a commercial AC power supply 1, and connecting the anode side of the DC power supply 3 to the anode electrode 6 in the plating apparatus 7. The cathode side of the DC power supply device 3 is connected to the object 5 to be plated. The object to be plated 5 is pressed and fixed against the plating mask IO by the holding plate 4, the plating solution 8 is fed into the plating tank 7, and the switch 2 is closed, thereby direct current is passed through the power supply circuit and plating is performed.
被めっき物を順送りにめっきする場合は、開閉器２を開
いて電流を遮断し、次にめっき液８をめっき槽７から放
出し、押え板４を開放し、被めっき物５を順送りし、再
び押え板４で被めっき物５を押え、めっき液８をめっき
槽７に送り込んで充満させ、次に開閉器２を閉じて通電
し、めっきする操作を繰り返す。When plating the object to be plated sequentially, open the switch 2 to cut off the current, then release the plating solution 8 from the plating tank 7, open the holding plate 4, and sequentially feed the object 5 to be plated. The object to be plated 5 is held down again by the holding plate 4, the plating solution 8 is sent into the plating tank 7 to fill it, the switch 2 is closed, the electricity is turned on, and the plating operation is repeated.
この際めっき液８がめつき槽７内に充満し、まだ直流電
源の開閉器２が開いていて、電流の流れない時間がめっ
きの前後に生じる。この時間にめっき槽７内は貴金属極
板と卑金属極板とめっき液により構成される電池作用に
より、卑金属極板の被めっき物５から貴金属極板である
陽極電極６の方向へ直流電源装置３の内部抵抗を通して
電流が流れる。この逆電流により陽極電極６側に水素ガ
スが発生し、この水素ガスにより陽極電極６の表面の酸
化被膜が還元され陽極電極６が消耗する。At this time, the plating bath 7 is filled with the plating solution 8, the switch 2 of the DC power source is still open, and there is a time before and after plating when no current flows. During this time, the inside of the plating tank 7 is composed of a noble metal plate, a base metal plate, and a plating solution. Due to the battery action, the DC power supply 3 moves from the base metal plate to be plated 5 to the anode electrode 6, which is a noble metal plate. Current flows through the internal resistance of Hydrogen gas is generated on the anode electrode 6 side by this reverse current, and the oxide film on the surface of the anode electrode 6 is reduced by this hydrogen gas, and the anode electrode 6 is consumed.
このような電池作用による逆電流を阻止するために、本
発明のめっき装置では、第１図に示すように、直流電源
３と陽極電極６の間に直流電源３側が陽極となり、めっ
き槽７内の陽極電極６側が陰極となるように整流器９を
挿入接続する。In order to prevent such reverse current due to battery action, in the plating apparatus of the present invention, as shown in FIG. The rectifier 9 is inserted and connected so that the anode electrode 6 side of the rectifier 9 becomes the cathode.
あるいは、第２図に示す本発明めっき装置の他の構成例
のように、めっき槽７内の陰極電極５と直流電源３との
間に、陰極電極５側が陽極となり、直流電源３側が陽極
となるように、整流器９を接続する。Alternatively, as in another configuration example of the plating apparatus of the present invention shown in FIG. 2, between the cathode electrode 5 and the DC power supply 3 in the plating tank 7, the cathode electrode 5 side becomes the anode, and the DC power supply 3 side becomes the anode. Connect the rectifier 9 so that
整流器９は、上記再構成例に示すいずれの位置に挿入し
ても、給電回路が交流電源ｌと接続し、正方向にめっき
電流が流れる時は正常にめっき電流を流し、給電回路が
交流電源ｌと切り離された場合には、電池作用による逆
電流を阻止する整流作用をする方向に接続する。No matter which position the rectifier 9 is inserted in as shown in the above reconfiguration example, the power supply circuit is connected to the AC power supply l, and when the plating current flows in the positive direction, the plating current flows normally, and the power supply circuit connects to the AC power supply l. If it is disconnected from 1, it is connected in a direction that provides rectification to prevent reverse current caused by battery action.
整流器９としては、ここではダイオードを用いることが
好ましい。As the rectifier 9, it is preferable to use a diode here.
本発明は、特に被めっき物を順送りして間欠的にめっき
を行うめっき装置に適用してその効果を発揮するもので
ある。The present invention is particularly effective when applied to a plating apparatus that sequentially feeds the object to be plated and performs plating intermittently.
めっき液８の種類、被めっき物５の種類、陽極電極６の
種類はいかなるものでもよいが、貴金属を陽極電極に使
用するめっき方法において本発明の効果は発揮される。Although any type of plating solution 8, type of object to be plated 5, and type of anode electrode 6 may be used, the effects of the present invention are exhibited in a plating method using a noble metal for the anode electrode.
く実 施 例〉
第１図に示すめっき装置を用いて以下の条件でめっきを
行った。Example> Plating was performed using the plating apparatus shown in FIG. 1 under the following conditions.
陽極電極・・・白金、被めっき物・・・銅条、めっき浴
・・・濃シアン浴、めっき電流密度・・・７０ Ａ／ｄ
ｍ２でめっき時間３秒のめっきを順送リサイクル１回／
１０秒で行った。従来のように逆電流阻止用手段のない
場合は陽極電極の消耗によりその交換頻度が多かったが
、本発明のめっき装置では陽極電極の消耗がなく、交換
が不必要となった。Anode electrode...Platinum, Plating object...Copper strip, Plating bath...Concentrated cyan bath, Plating current density...70 A/d
Progressive recycling of plating with plating time of 3 seconds in m2/1 time/
It took 10 seconds. In the conventional plating apparatus without a reverse current blocking means, the anode electrode was worn out and had to be replaced frequently, but in the plating apparatus of the present invention, the anode electrode is not worn out and replacement is not necessary.
〈発明の効果〉
本発明のめつき装置は、逆電流が発生するのを遮断する
ことができるよう構成されているので、陽極電極の消耗
を防上する。<Effects of the Invention> The plating apparatus of the present invention is configured to be able to block generation of reverse current, thereby preventing wear and tear of the anode electrode.
特に、金・銀めっき装置において、陽極電極に使われる
白金等の貴金属の消耗を防止し、電極寿命を延ばすこと
に大きな効果を有する。In particular, in gold/silver plating equipment, it has a great effect on preventing consumption of precious metals such as platinum used in anode electrodes and extending the life of the electrodes.
第１図は、本発明のめっき装置の電気回路を含む断面図
である。
第２図は、本発明のめっき装置の他の実施例を示す電気
回路を含む断面図である。
符号の説明
ｌ・・・交流電源、２・・・開閉器、３・・・直流電源
装置、４・・・押え板、５・・・被めっき物、６・・・
陽極電極。
７・・・めっき槽、８・・・めっき液、９・・・整流器
、１０・・・めっき用マスク
ＦＩＧ、１FIG. 1 is a sectional view including an electric circuit of the plating apparatus of the present invention. FIG. 2 is a sectional view including an electric circuit showing another embodiment of the plating apparatus of the present invention. Explanation of symbols l... AC power supply, 2... Switch, 3... DC power supply, 4... Holding plate, 5... To be plated, 6...
Anode electrode. 7... Plating tank, 8... Plating solution, 9... Rectifier, 10... Plating mask FIG, 1
Claims (2)
めっき給電回路を有するめっき装置において、非めっき
時にめっき時の電流とは逆方向の逆電流が流れるのを阻
止する手段を、前記陽極または陰極と前記直流電源との
間に介挿したことを特徴とするめっき装置。(1) In a plating apparatus having a plating power supply circuit including an anode and a cathode in a plating bath and a DC power supply, a means for preventing a reverse current from flowing in the direction opposite to the current during plating during non-plating is provided at the anode. Alternatively, a plating apparatus characterized in that the plating apparatus is inserted between a cathode and the DC power source.
の範囲第１項に記載のめっき装置。(2) The plating apparatus according to claim 1, wherein the reverse current blocking means is a diode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4545985A JPS61204397A (en) | 1985-03-07 | 1985-03-07 | Plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4545985A JPS61204397A (en) | 1985-03-07 | 1985-03-07 | Plating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61204397A true JPS61204397A (en) | 1986-09-10 |
Family
ID=12719938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4545985A Pending JPS61204397A (en) | 1985-03-07 | 1985-03-07 | Plating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61204397A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05132799A (en) * | 1991-06-25 | 1993-05-28 | Internatl Business Mach Corp <Ibm> | Electroplating method and apparatus therefor |
| JP2002285400A (en) * | 2001-03-23 | 2002-10-03 | Sansha Electric Mfg Co Ltd | Plating current supply power unit |
| JP2010047792A (en) * | 2008-08-20 | 2010-03-04 | Chuo Seisakusho Ltd | Plating apparatus with power failure compensation function |
| JP2016074975A (en) * | 2014-10-06 | 2016-05-12 | 株式会社荏原製作所 | Plating method |
| WO2017188422A1 (en) * | 2016-04-27 | 2017-11-02 | デノラ・ペルメレック株式会社 | Electrolytic cell |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4849633A (en) * | 1971-10-27 | 1973-07-13 | ||
| JPS4866536A (en) * | 1971-12-17 | 1973-09-12 | ||
| JPS51108639A (en) * | 1975-02-24 | 1976-09-27 | Teikoku Piston Ring Co Ltd | |
| JPS53122633A (en) * | 1977-03-31 | 1978-10-26 | Nippon Steel Corp | Insoluble anode and electrolytic methdo in electroplating and the like |
-
1985
- 1985-03-07 JP JP4545985A patent/JPS61204397A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4849633A (en) * | 1971-10-27 | 1973-07-13 | ||
| JPS4866536A (en) * | 1971-12-17 | 1973-09-12 | ||
| JPS51108639A (en) * | 1975-02-24 | 1976-09-27 | Teikoku Piston Ring Co Ltd | |
| JPS53122633A (en) * | 1977-03-31 | 1978-10-26 | Nippon Steel Corp | Insoluble anode and electrolytic methdo in electroplating and the like |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05132799A (en) * | 1991-06-25 | 1993-05-28 | Internatl Business Mach Corp <Ibm> | Electroplating method and apparatus therefor |
| JP2002285400A (en) * | 2001-03-23 | 2002-10-03 | Sansha Electric Mfg Co Ltd | Plating current supply power unit |
| JP4704590B2 (en) * | 2001-03-23 | 2011-06-15 | 株式会社三社電機製作所 | Plating current supply power supply |
| JP2010047792A (en) * | 2008-08-20 | 2010-03-04 | Chuo Seisakusho Ltd | Plating apparatus with power failure compensation function |
| JP2016074975A (en) * | 2014-10-06 | 2016-05-12 | 株式会社荏原製作所 | Plating method |
| US10294581B2 (en) | 2014-10-06 | 2019-05-21 | Ebara Corporation | Plating method |
| WO2017188421A1 (en) * | 2016-04-27 | 2017-11-02 | デノラ・ペルメレック株式会社 | Electrode for electrolysis, manufacturing method of electrode for electrolysis and electrolytic cell |
| CN107923053A (en) * | 2016-04-27 | 2018-04-17 | 迪诺拉永久电极股份有限公司 | Electrolytic cell |
| JPWO2017188422A1 (en) * | 2016-04-27 | 2018-06-07 | デノラ・ペルメレック株式会社 | Electrolytic cell |
| JPWO2017188421A1 (en) * | 2016-04-27 | 2018-07-12 | デノラ・ペルメレック株式会社 | Electrode for electrolysis, method for producing electrode for electrolysis, and electrolytic cell |
| US20180245224A1 (en) * | 2016-04-27 | 2018-08-30 | De Nora Permelec Ltd | Electrolyzer |
| WO2017188422A1 (en) * | 2016-04-27 | 2017-11-02 | デノラ・ペルメレック株式会社 | Electrolytic cell |
| US10590551B2 (en) | 2016-04-27 | 2020-03-17 | De Nora Permelec Ltd | Electrode for electrolysis, manufacturing method of electrode for electrolysis, and electrolyzer |
| US10669638B2 (en) | 2016-04-27 | 2020-06-02 | De Nora Permelec Ltd | Electrolyzer |
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