JPS61199644A - Wire bonding device - Google Patents
Wire bonding deviceInfo
- Publication number
- JPS61199644A JPS61199644A JP60040417A JP4041785A JPS61199644A JP S61199644 A JPS61199644 A JP S61199644A JP 60040417 A JP60040417 A JP 60040417A JP 4041785 A JP4041785 A JP 4041785A JP S61199644 A JPS61199644 A JP S61199644A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- bonding
- tension
- vacuum
- spacers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
- H01L2224/78621—Holding means, e.g. wire clampers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
- H01L2224/78621—Holding means, e.g. wire clampers
- H01L2224/78631—Means for wire tension adjustments
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明はＩＣ，トランジスタ等の半導体部品にワイヤボ
ンディングを施すワイヤボンディング装置に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a wire bonding apparatus for wire bonding semiconductor components such as ICs and transistors.
従来の技術
近年、ワイヤボンディング装置は、ポンディングの高速
、高密度化が要求されている。この問題を解決する為に
はワイヤを一定のテンションで安定して供給する必要が
ある。BACKGROUND OF THE INVENTION In recent years, wire bonding equipment has been required to perform bonding at higher speeds and with higher density. To solve this problem, it is necessary to stably supply the wire at a constant tension.
以下図面を参照しながら従来のワイヤボンディング装置
の一例について説明する。An example of a conventional wire bonding apparatus will be described below with reference to the drawings.
第３図〜第６図は従来のワイヤボンディング装置の概略
図とワイヤボンディングのシーケンスを示す図である。3 to 6 are schematic diagrams of a conventional wire bonding apparatus and diagrams showing a wire bonding sequence.
第３−及び第４図において、ワイヤリール１に巻かれた
ワイヤ２はガイドチューブ３、テンション部４．ワイヤ
クランノ（５を経由してボンディング工具６に供給され
、ワイヤボンディングを行なう。第４図は第３図のテン
ション部の詳細図であり、７はワイヤを押えテンション
を与える為ルビー、ガラス等で構成されたワイヤ押えで
、クランプアーム８に固定され、薄板状の）ぐネ９でワ
イヤー２を押えつけている。第６図はボンディングのシ
ーケンスを示す図であり、１０はチップ、１２はチップ
を装着した基板であり、１１はワイヤリングしたワイヤ
２のループ形状を示している。なお基板１２は任意に位
置決め可能な位置決め装置に搭載されている。3 and 4, the wire 2 wound around the wire reel 1 is connected to the guide tube 3, the tension section 4. The wire is supplied to the bonding tool 6 via the wire clamp (5) to perform wire bonding. Figure 4 is a detailed view of the tension section in Figure 3, and 7 is made of ruby, glass, etc. to hold the wire and give tension. The wire holder is fixed to the clamp arm 8, and the wire 2 is held down by a thin plate-like pin 9. FIG. 6 is a diagram showing a bonding sequence, in which 10 is a chip, 12 is a substrate on which the chip is mounted, and 11 is a loop shape of the wire 2 wired. Note that the substrate 12 is mounted on a positioning device that can position it arbitrarily.
以上の様に構成された従来のワイヤボンディング装置に
ついて以下その動作を説明する。The operation of the conventional wire bonding apparatus configured as described above will be described below.
ワイヤリール１に巻かれたワイヤ２は、ガイドチューブ
３．テンション部４．クランパ６を経由してボンディン
グ工具６に供給される。ポンディの移動、２回目のボン
ディング、ワイヤの切断の各動作を行う。この時、ワイ
ヤ２にはテンション部４によシ一定のテンションが与え
られる。テンション部４は第４図に示す構造であり、ワ
イヤ押え７とクランプアーム、８．薄板バネ９とによっ
て一定圧力でワイヤ２を押えつけることによってテンシ
ョンを与えている。A wire 2 wound around a wire reel 1 is passed through a guide tube 3. Tension part 4. It is supplied to the bonding tool 6 via the clamper 6. Perform the following operations: moving the pounder, bonding for the second time, and cutting the wire. At this time, a constant tension is applied to the wire 2 by the tension section 4. The tension section 4 has a structure shown in FIG. 4, and includes a wire presser 7, a clamp arm, 8. Tension is applied by pressing the wire 2 with a constant pressure using a thin plate spring 9.
発明が解決しようとする問題点
しかしながら上記のような構成では、ワイヤ２のテンシ
ョンを機械的に押えつけて与えているために、ワイヤ２
の外周部にキズ等のダメージが発生する。又ワイヤ２に
与えるテンションはワイヤ破断力以下の微小な量であシ
、このテンションか弱すぎると１回目のボンディング後
、ボンディング工具６と半導体チップ１ｏとが相対移動
する時にワイヤ２が慣性によって必要量以上引き出され
、２回目のボンディング時に一定のテンションでボンデ
ィングできない為、ループ１１の形状が一定しない。逆
にワイヤ２のテンションが強すざると、ボンディング工
具ｅの先端に形成されたボールがボンディング工具６の
センター穴につまってしまう。Problems to be Solved by the Invention However, in the above configuration, since the tension of the wire 2 is mechanically pressed down, the tension of the wire 2 is
Damage such as scratches occurs on the outer periphery. In addition, the tension applied to the wire 2 must be a minute amount less than the wire breaking force. If this tension is too weak, the wire 2 will be required due to inertia when the bonding tool 6 and the semiconductor chip 1o move relative to each other after the first bonding. The shape of the loop 11 is not constant because it is pulled out more than the amount and cannot be bonded with a constant tension during the second bonding. Conversely, if the tension of the wire 2 is not too strong, the ball formed at the tip of the bonding tool e will get stuck in the center hole of the bonding tool 6.
さらに第６図・に示すようにボンディング完了時にテン
ション部４とボンディング工具６の間にワイヤ２のクル
ミが生じ、ワイヤに曲り等の変形が生じるためワイヤリ
ング時にループ形状が一定しない。Further, as shown in FIG. 6, when bonding is completed, the wire 2 is bent between the tension part 4 and the bonding tool 6, and the wire is deformed such as bending, so that the loop shape is not constant during wiring.
以上のように、従来のワイヤボンディング装置は多くの
問題点を有している。As described above, conventional wire bonding devices have many problems.
本発明は上記問題点に鑑み、ワイヤに機械的ダメージを
与えることなく一定のテンションを与えるとともに、ワ
イヤボンディング時に常に一定のテンシヨンがかかるよ
うにワイヤのクルミ等を無くし、またワイヤに与えるテ
ンションの大きさを零からワイヤの破断力の範囲内で任
意にコントロールすることにより、ループ形状を安定し
てワイヤボンディングするワイヤボンディング装置を提
供するものである。In view of the above problems, the present invention provides a constant tension to the wire without causing mechanical damage, eliminates walnuts, etc. of the wire so that a constant tension is always applied during wire bonding, and increases the tension applied to the wire. The present invention provides a wire bonding device that performs wire bonding in a stable loop shape by arbitrarily controlling the wire bonding strength within the range from zero to the breaking force of the wire.
問題点を解決するだめの手段”
上記問題点を解決するために本発明のボンディング装置
は、ワイヤリールとボンディング工具との間にテンショ
ンを与える真空コラムを備えたものである。Means for Solving the Problems” In order to solve the above problems, the bonding apparatus of the present invention is equipped with a vacuum column that applies tension between the wire reel and the bonding tool.
作用
本発明は上記した構成によって、ワイヤにテンションを
与える時に真空圧を利用するため、ワイヤに機械的なダ
メージがなく、さらにボンディング工具と真空コラムと
の間に発生したクルミを巻き戻すことによりボンディン
グ時に一定のテンションでボンディングするため、ワイ
ヤルーズの形状が安定して形成されることとなる。Function: With the above-described configuration, the present invention utilizes vacuum pressure when applying tension to the wire, so there is no mechanical damage to the wire, and furthermore, the bonding process is improved by unwinding the walnuts generated between the bonding tool and the vacuum column. Since bonding is performed at a constant tension, a loose wire shape is stably formed.
実施例
以下本発明の一実施例のワイヤボンディング装置につい
て、図面を参照しながら説明する。EXAMPLE Hereinafter, a wire bonding apparatus according to an example of the present invention will be described with reference to the drawings.
第１図は本発明の実施例におけるワイヤボンディング装
置を示すものであり、第２図は第１図のテンション部の
断面図を示すものである。第１図及び第２図において、
１３はワイヤ１４が巻かれたワイヤリールである。１６
１Ｌ、１６ｂ、１７は真空コラム３０を形成するスペー
サとガイド板であり、スペーサ１６１Ｌ、１６ｂの間隔
人は任意の寸法に変更可能である。１８は２回目のボン
ディング後ワイヤ１４を切断するためのクランパ、１９
はボンディング工具、２０．２１はそれぞれ半導体部品
及び基板である。また２２及び２３は真空コラム３ｏ内
の空気の流れを示す。FIG. 1 shows a wire bonding apparatus according to an embodiment of the present invention, and FIG. 2 shows a sectional view of the tension section of FIG. 1. In Figures 1 and 2,
13 is a wire reel around which a wire 14 is wound. 16
1L, 16b, and 17 are spacers and guide plates that form the vacuum column 30, and the distance between the spacers 161L and 16b can be changed to any size. 18 is a clamper for cutting the wire 14 after the second bonding; 19
20 and 21 are a bonding tool and a semiconductor component and a substrate, respectively. Further, 22 and 23 indicate air flows within the vacuum column 3o.
以上のように構成されたワイヤボンディング装置につい
て、第１図、第２図を用いてその動作を説明する。ワイ
ヤリール１３に巻かれたワイヤ１４は真空コラム３ｏと
クランパ１８．ボンディング工具１９を介して図に示す
状態に保持される。The operation of the wire bonding apparatus configured as described above will be explained with reference to FIGS. 1 and 2. The wire 14 wound around the wire reel 13 is connected to the vacuum column 3o and the clamper 18. It is held in the state shown in the figure via a bonding tool 19.
この状態でスペーサ１６ａと１６ｂの間より矢印２３の
方向に真空圧をかけると、ワイヤ１４は大気圧２２によ
ってスペーサ１６＆、１６ｂの側面に押しつけられる。In this state, when vacuum pressure is applied between the spacers 16a and 16b in the direction of the arrow 23, the wire 14 is pressed against the side surfaces of the spacers 16&, 16b by the atmospheric pressure 22.
このように本実施例によれば、ワイヤ１４に真空コラム
３ｏにてテンションを与えるためワイヤ１４にダメージ
が発生しない。またボンディング動作を行なう時、ワイ
ヤ１４に第６図ｅに示すようなりルミが発生しても、真
空コラム３０内にワイヤ１４を巻き戻す事が可能となる
。またワイヤ１４にかかるテンションの調整はスペーサ
１６＆と１６ｂの間隔人を調節することによって、真空
度を調節することなくコントロールすることが可能であ
る。従って、ワイヤ１４にダメージを与えることなく、
さらにワイヤ１４にクルミが発生することなく一定のテ
ンションで安定してループ形状のワイヤボンディングが
可能となる。As described above, according to the present embodiment, since the wire 14 is tensioned by the vacuum column 3o, no damage occurs to the wire 14. Furthermore, even if lume occurs in the wire 14 as shown in FIG. 6e during the bonding operation, the wire 14 can be wound back into the vacuum column 30. Further, the tension applied to the wire 14 can be controlled by adjusting the distance between the spacers 16& and 16b without adjusting the degree of vacuum. Therefore, without damaging the wire 14,
Furthermore, loop-shaped wire bonding can be stably performed with a constant tension without causing walnuts in the wire 14.
発明の効果
以上のように本発明は、ワイヤリールとボンディング工
具との間に、ワイヤ径より大きい薄板状のスペーサと、
これを両側より保持するガイド板とで構成された真空コ
ラムと、これに真空を与える真空源を設けたものであり
、大気圧によってテンシコンを与えるためワイヤにダメ
ージが発生することなく、又ボンディング中に発生した
クルミを真空コラム内に巻き戻すことが可能となり、ワ
イヤには常に一定のテンションが与えられる。このため
ボンディング後のループ形状は、ボンディング工具と半
導体部品の相対的な移動に応じて左右に煩＜’ｔとなく
、安定したワイヤボンディングのループ形状を得ること
が可能となる。Effects of the Invention As described above, the present invention includes a thin plate-shaped spacer larger than the wire diameter between the wire reel and the bonding tool,
It is equipped with a vacuum column consisting of guide plates that hold the wire from both sides, and a vacuum source that applies a vacuum to the column.Since the tensicon is applied using atmospheric pressure, there is no damage to the wire, and there is no damage to the wire during bonding. This makes it possible to unwind the walnuts generated in the process into the vacuum column, and the wire is always kept under constant tension. Therefore, the loop shape after bonding does not shift from side to side depending on the relative movement of the bonding tool and the semiconductor component, and it is possible to obtain a stable wire bonding loop shape.
第１図は本発明の一実施例におけるワイヤボンディング
装置の構成図、第２図は第１図の断面図、第３図は従来
のボンディング装置の構成図、第４図は第３図のテンシ
ョン部の構造を示す斜視図、第６図はワイヤボンディン
グのシーケンスを示す図である。
１３・・・・・・ワイヤリール、 １４ ・・・・−ワ
イヤ。
１６１Ｌ、１６ｂ・・・・・・スペーサ、１７・・・・
・・ガイド板、１９・・・・・・ボンディング工具、２
３・・・・・・真空源。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第
１ 図
１３・・・ワイヤリール
１４、、、ワイヤ
第２図
１Δ
第 ３ 図 ２１．ワイヤ
第 ４ 図 ７
ワイヤ押え８ ククン７°マーム
ｙ 薄板／＜ネ
第５図Fig. 1 is a block diagram of a wire bonding device according to an embodiment of the present invention, Fig. 2 is a sectional view of Fig. 1, Fig. 3 is a block diagram of a conventional bonding machine, and Fig. 4 is a tension diagram of Fig. 3. FIG. 6 is a perspective view showing the structure of the part, and FIG. 6 is a diagram showing the sequence of wire bonding. 13...Wire reel, 14...-Wire. 161L, 16b...Spacer, 17...
...Guide plate, 19...Bonding tool, 2
3...Vacuum source. Name of agent: Patent attorney Toshio Nakao and 1 other person
1 Fig. 13...Wire reel 14... Wire Fig. 2 1Δ Fig. 3 Fig. 21. Wire Figure 4 7
Wire presser foot 8 Kukun 7° mam y Thin plate/<ne Figure 5
Claims (1)
引き出されたワイヤを所定の箇所にボンディングするボ
ンディング工具と、前記ワイヤをはさむ上下動可能なク
ランパと、前記ワイヤリールとクランパとの間に配され
、ワイヤに所定のテンションを与えるテンション部を備
え、前記テンション部を、ワイヤ径より厚い一対のスペ
ーサ及びこの一対のスペーサを所定の間隔をおいて両側
より保持するガイド板よりなる真空コラムと、前記真空
コラムの一対のスペーサ間から空気を吸引してワイヤを
前記スペーサの側面に押しつける真空源とで構成したワ
イヤボンディング装置。A wire reel wound with a wire, a bonding tool for bonding the wire pulled out from the wire reel to a predetermined location, a vertically movable clamper that sandwiches the wire, and disposed between the wire reel and the clamper, A vacuum column includes a tension section that applies a predetermined tension to the wire, and the tension section is connected to a vacuum column consisting of a pair of spacers thicker than the wire diameter and a guide plate that holds the pair of spacers from both sides at a predetermined interval; A wire bonding device comprising a vacuum source that sucks air from between a pair of spacers in a column and presses the wire against the side surface of the spacer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60040417A JPS61199644A (en) | 1985-03-01 | 1985-03-01 | Wire bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60040417A JPS61199644A (en) | 1985-03-01 | 1985-03-01 | Wire bonding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61199644A true JPS61199644A (en) | 1986-09-04 |
| JPH0358536B2 JPH0358536B2 (en) | 1991-09-05 |
Family
ID=12580082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60040417A Granted JPS61199644A (en) | 1985-03-01 | 1985-03-01 | Wire bonding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61199644A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4909431A (en) * | 1988-05-18 | 1990-03-20 | Emanuele Japichino | Method and apparatus for preparing a bonding wire |
-
1985
- 1985-03-01 JP JP60040417A patent/JPS61199644A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4909431A (en) * | 1988-05-18 | 1990-03-20 | Emanuele Japichino | Method and apparatus for preparing a bonding wire |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0358536B2 (en) | 1991-09-05 |
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