JPS61199090A - Electroforming die and its manufacture - Google Patents
Electroforming die and its manufactureInfo
- Publication number
- JPS61199090A JPS61199090A JP3982885A JP3982885A JPS61199090A JP S61199090 A JPS61199090 A JP S61199090A JP 3982885 A JP3982885 A JP 3982885A JP 3982885 A JP3982885 A JP 3982885A JP S61199090 A JPS61199090 A JP S61199090A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- cement
- matrix
- electrodeposited
- recesses
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
「対象技術分野」
この発明は電鋳型およびその製造方法に関する「従来装
置およびその問題点」
従来、表面に凹部な有する母型から電鋳型を製造するば
あい、通常の電流密度で電着な行うと第2図に示すよう
に局部的、とくに凸部2に電着層が厚く形成され、その
ために凹部3における電着層の成長が阻害される。した
がってその電鋳工程罠おける電流密度を通常の電流密度
より低く設定しているが1反面電着層の形成に多く、の
日数を要する欠点がある。また電流密度を低クシ、ても
なお凹凸部2,3の電着層が不均一となることは避けら
れず、このため電鋳工程の後に機械加工を施す必要があ
り、いきおい多くの日時を必要とする。Detailed Description of the Invention "Target Technical Field" This invention relates to an electroforming mold and a method for manufacturing the same. When electrodeposition is carried out at a current density, the electrodeposited layer is formed thick locally, particularly in the convex portions 2, as shown in FIG. 2, and the growth of the electrodeposited layer in the concave portions 3 is thereby inhibited. Therefore, the current density in the electroforming process is set lower than the normal current density, but on the other hand, there is a drawback that it takes many days to form the electrodeposited layer. Furthermore, even if the current density is low, it is unavoidable that the electrodeposited layer on the uneven parts 2 and 3 will become uneven, and for this reason, it is necessary to perform machining after the electroforming process, which requires a lot of time and effort. I need.
また電着層の不均一を補正する目的で、第一3図に示す
ように補助電、極8を用いることもなされ不いるが、歯
型などの複雑な凹凸形状を有する電鋳型の製造において
は母凰を回転させて電着を行うため、補助電極の作成な
らびに取付装置にかえって多くの時間を費す欠点がある
。Furthermore, in order to correct the non-uniformity of the electrodeposited layer, an auxiliary electrode or pole 8 may be used as shown in Fig. 13, but it is not necessary to use an auxiliary electrode or pole 8 as shown in Fig. 13. Since electrodeposition is carried out by rotating the matrix, there is a disadvantage that it takes a lot of time to prepare the auxiliary electrodes and the mounting equipment.
「目的」
この発明は歯型のように複雑な凹凸部を有する電鋳型の
製造において、電着層の形成が遅い凹部・ にも高速
で電着な施すことを目的とするものである。``Purpose'' The purpose of the present invention is to perform electrodeposition at high speed even in the recesses where the formation of the electrodeposition layer is slow, in the production of electroforming molds having complex uneven parts such as tooth patterns.
「実施例」 以下図によってこの発明の一実施例について説明する。"Example" An embodiment of the present invention will be described below with reference to the drawings.
すなわち第1図において電鋳型の母型1はたとえばギア
等の歯型用のもので、その表面には複数の凸部2および
凹部3が形成されている。そしてその母型10表面には
まず厚さが0.2〜1話の電着薄膜II#4が形成され
、その厚さは母型lの形状あるいはその大きさで異なり
、またその電着薄膜層4を形成するばあい、母型lが電
気メッキを施すことが可能な形状であるならば電気メッ
キの方が能率的罠有利であるが、電気メッキを施すこと
が困難なばあい、あるいはそのメッキ工程に比較的長い
時間を要するものKあっては無電解メッキにより形成す
ることができる。次に電着薄膜層4ノ表面において、凹
部3内にはセラミックセメント5が充填され、これによ
って母屋10表面はほぼ均一に整形される。ここでセラ
ミックセメント5の主剤は二価の金属酸化物たとえば酸
化マグネシウム(MgO)、酸化亜鉛(ZnO)や酸化
鋼(CuO)等で組成される。とくにこの二価の金属酸
化物は常温硬化性を有するため、母型1の材質がたとえ
ばプラスチックのように高温加熱に適さないもののばあ
い、とくに有利である。つづいて凹部3に充填したセラ
ミックセメント5を硬化させるが、この状態においては
セラミックセメント5は非電導体であるため、その表面
を塩化パラジウム(Pdcl、 )、塩化錫(5ncl
、 )等で表面を活性化し、その表面に厚さが約0.0
1〜0.1fi程度のメッキ層6を形成する。なおこの
メッキ層は無電解メッキにより行うことが望ましい。そ
してこのメッキ層を形成した状態においては母型1の表
面には凹凸がなくなるため、次にスルフアミノ酸ニッケ
ル浴のような高電流の流せるメッキ浴を使用して電着加
工を行うことによりその表面に電着層7を形成する。こ
れによって表面の均一な電鋳母型が完成する。That is, in FIG. 1, an electroforming master mold 1 is used for, for example, a tooth mold of a gear, and has a plurality of convex portions 2 and concave portions 3 formed on its surface. On the surface of the matrix 10, an electrodeposited thin film II#4 having a thickness of 0.2 to 1 layer is first formed, and the thickness varies depending on the shape or size of the matrix l. When forming layer 4, if the matrix l has a shape that allows electroplating, electroplating is more efficient, but if it is difficult to electroplat, or If the plating process requires a relatively long time, it can be formed by electroless plating. Next, on the surface of the electrodeposited thin film layer 4, the recess 3 is filled with ceramic cement 5, whereby the surface of the main building 10 is shaped almost uniformly. The main ingredient of the ceramic cement 5 is composed of divalent metal oxides such as magnesium oxide (MgO), zinc oxide (ZnO), and oxidized steel (CuO). In particular, since this divalent metal oxide has room temperature curability, it is particularly advantageous when the material of the matrix 1 is not suitable for high-temperature heating, such as plastic. Next, the ceramic cement 5 filled in the recess 3 is hardened, but since the ceramic cement 5 is a non-conductor in this state, its surface is coated with palladium chloride (Pdcl), tin chloride (5ncl), etc.
, ) etc. to activate the surface, and apply a layer with a thickness of approximately 0.0 to the surface.
A plating layer 6 having a thickness of about 1 to 0.1 fi is formed. Note that this plating layer is preferably formed by electroless plating. When this plating layer is formed, the surface of the master mold 1 will have no unevenness, so next, electrodeposition processing is performed using a plating bath that can flow a high current, such as a sulfur amino acid nickel bath. An electrodeposition layer 7 is formed on the surface. This completes the electroforming mold with a uniform surface.
「効果」
この発明は上述のように母型の凹部内に二価の金属酸化
物からなるセラミックセメントを充填するとともに、こ
のセラミックセメントの表面に電着層を施すようにして
いるので、電鋳時間が著るしく短縮される。とくにこの
発明によるとその工程時間は従来の3分の1ないし2分
の1に短縮することができる。また従来のように電鋳加
工の程、別□に機械加工を行う必要もないため、電、鋳
設備の回転性が良く、しかも電気代およびメッキ薬品の
節′約と相まって電鋳加工能率が大幅に向上する利点が
ある。"Effects" As described above, this invention fills the concave portion of the matrix with ceramic cement made of divalent metal oxide, and also applies an electrodeposition layer to the surface of this ceramic cement. Time is significantly reduced. In particular, according to the present invention, the process time can be reduced to one-third to one-half of the conventional method. In addition, unlike conventional electroforming processes, there is no need for separate machining, so the rotation of electroforming and casting equipment is good, and combined with savings in electricity costs and plating chemicals, electroforming process efficiency is improved. This has the advantage of being significantly improved.
第1図はこの発明における電鋳加工方法の一実施例゛を
示す正断面図、第2図および第3図は従来の加工方・法
を示す正断面図である。
1・・・母型、2・・・凸部、3・・・凹部、4・・・
電着薄膜層、5・・・セラミックセメント、6・・・メ
ッキ層、7・・・電着層。
第1図
第2図
第3rMFIG. 1 is a front sectional view showing an embodiment of the electroforming method according to the present invention, and FIGS. 2 and 3 are front sectional views showing a conventional processing method. 1... Mother mold, 2... Convex part, 3... Concave part, 4...
Electrodeposition thin film layer, 5... Ceramic cement, 6... Plating layer, 7... Electrodeposition layer. Figure 1 Figure 2 Figure 3rM
Claims (2)
、この電着薄膜層の表面において、上記凹部内に二価の
金属酸化物からなるセラミックセメントを充填し、かつ
このセラミックセメントの表面を活性化し、さらにこの
セラミックセメントの表面に電着層を施すことを特徴と
する電鋳型の製造方法。(1) An electrodeposited thin film layer is formed on the surface of a matrix having irregularities, and on the surface of the electrodeposited thin film layer, a ceramic cement made of a divalent metal oxide is filled in the recesses, and the ceramic A method for producing an electroforming mold, which comprises activating the surface of cement and further applying an electrodeposition layer to the surface of the ceramic cement.
、この電着薄膜層の表面において、上記凹部内に二価の
金属酸化物を含有するセラミックセメントからなる充填
剤を充填し、かつこの充填剤の表面に電着層を施すこと
を特徴とする電鋳型。(2) An electrodeposited thin film layer is formed on the surface of the matrix having uneven parts, and a filler made of ceramic cement containing a divalent metal oxide is filled in the recesses on the surface of the electrodeposited thin film layer. An electroforming mold characterized in that: and an electrodeposited layer is applied to the surface of the filler.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3982885A JPS61199090A (en) | 1985-02-28 | 1985-02-28 | Electroforming die and its manufacture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3982885A JPS61199090A (en) | 1985-02-28 | 1985-02-28 | Electroforming die and its manufacture |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61199090A true JPS61199090A (en) | 1986-09-03 |
JPH0124871B2 JPH0124871B2 (en) | 1989-05-15 |
Family
ID=12563830
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3982885A Granted JPS61199090A (en) | 1985-02-28 | 1985-02-28 | Electroforming die and its manufacture |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61199090A (en) |
-
1985
- 1985-02-28 JP JP3982885A patent/JPS61199090A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0124871B2 (en) | 1989-05-15 |
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