JPS61199090A - Electroforming die and its manufacture - Google Patents

Abstract

PURPOSE:To obtain an electroforming die having a complex uneven part in a short period by electrodepositing a thin layer on the surface of a matrix having an uneven part, filling ceramic cement contg. a bivalent metallic oxide as the base into the recesses, and forming an electrodeposited layer on the surface of the cement. CONSTITUTION:An electrodeposited thin layer 4 of about 0.2-1mm thickness is formed on the surface of a matrix 1 for an electroforming die such as a toothed matrix having plural projections 2 and recesses 3 on the surface. Ceramic cement 5 is filled into the recesses 3 with the layer 4 in-between to make the surface of the matrix 1 nearly even. A bivalent metallic oxide such as MgO is used as the base of the cement 5. Since the cement 5 has curability at ordinary temp., it is especially advantageous when the matrix 1 is made of plastics or the like unsuitable for heating at a high temp. The cement 5 is then cured and at this time, the surface of the cement is activated with PdCl2 or the like. A plated layer 6 of about 0.01-0.1mm thickness is formed on the activate surface, and an electrodeposited layer 7 is formed on the layer 6 in a plating bath through which a high electric current can be passed such as a nickel sulfamate bath.

Description

Detailed Description of the Invention "Target Technical Field" This invention relates to an electroforming mold and a method for manufacturing the same. When electrodeposition is carried out at a current density, the electrodeposited layer is formed thick locally, particularly in the convex portions 2, as shown in FIG. 2, and the growth of the electrodeposited layer in the concave portions 3 is thereby inhibited. Therefore, the current density in the electroforming process is set lower than the normal current density, but on the other hand, there is a drawback that it takes many days to form the electrodeposited layer. Furthermore, even if the current density is low, it is unavoidable that the electrodeposited layer on the uneven parts 2 and 3 will become uneven, and for this reason, it is necessary to perform machining after the electroforming process, which requires a lot of time and effort. I need.

Furthermore, in order to correct the non-uniformity of the electrodeposited layer, an auxiliary electrode or pole 8 may be used as shown in Fig. 13, but it is not necessary to use an auxiliary electrode or pole 8 as shown in Fig. 13. Since electrodeposition is carried out by rotating the matrix, there is a disadvantage that it takes a lot of time to prepare the auxiliary electrodes and the mounting equipment.

``Purpose'' The purpose of the present invention is to perform electrodeposition at high speed even in the recesses where the formation of the electrodeposition layer is slow, in the production of electroforming molds having complex uneven parts such as tooth patterns.

"Example" An embodiment of the present invention will be described below with reference to the drawings.

That is, in FIG. 1, an electroforming master mold 1 is used for, for example, a tooth mold of a gear, and has a plurality of convex portions 2 and concave portions 3 formed on its surface. On the surface of the matrix 10, an electrodeposited thin film II#4 having a thickness of 0.2 to 1 layer is first formed, and the thickness varies depending on the shape or size of the matrix l. When forming layer 4, if the matrix l has a shape that allows electroplating, electroplating is more efficient, but if it is difficult to electroplat, or If the plating process requires a relatively long time, it can be formed by electroless plating. Next, on the surface of the electrodeposited thin film layer 4, the recess 3 is filled with ceramic cement 5, whereby the surface of the main building 10 is shaped almost uniformly. The main ingredient of the ceramic cement 5 is composed of divalent metal oxides such as magnesium oxide (MgO), zinc oxide (ZnO), and oxidized steel (CuO). In particular, since this divalent metal oxide has room temperature curability, it is particularly advantageous when the material of the matrix 1 is not suitable for high-temperature heating, such as plastic. Next, the ceramic cement 5 filled in the recess 3 is hardened, but since the ceramic cement 5 is a non-conductor in this state, its surface is coated with palladium chloride (Pdcl), tin chloride (5ncl), etc.
, ) etc. to activate the surface, and apply a layer with a thickness of approximately 0.0 to the surface.
A plating layer 6 having a thickness of about 1 to 0.1 fi is formed. Note that this plating layer is preferably formed by electroless plating. When this plating layer is formed, the surface of the master mold 1 will have no unevenness, so next, electrodeposition processing is performed using a plating bath that can flow a high current, such as a sulfur amino acid nickel bath. An electrodeposition layer 7 is formed on the surface. This completes the electroforming mold with a uniform surface.

"Effects" As described above, this invention fills the concave portion of the matrix with ceramic cement made of divalent metal oxide, and also applies an electrodeposition layer to the surface of this ceramic cement. Time is significantly reduced. In particular, according to the present invention, the process time can be reduced to one-third to one-half of the conventional method. In addition, unlike conventional electroforming processes, there is no need for separate machining, so the rotation of electroforming and casting equipment is good, and combined with savings in electricity costs and plating chemicals, electroforming process efficiency is improved. This has the advantage of being significantly improved.

[Brief explanation of the drawing]

FIG. 1 is a front sectional view showing an embodiment of the electroforming method according to the present invention, and FIGS. 2 and 3 are front sectional views showing a conventional processing method. 1... Mother mold, 2... Convex part, 3... Concave part, 4...
Electrodeposition thin film layer, 5... Ceramic cement, 6... Plating layer, 7... Electrodeposition layer. Figure 1 Figure 2 Figure 3rM

Claims (2)

[Claims] (1) An electrodeposited thin film layer is formed on the surface of a matrix having irregularities, and on the surface of the electrodeposited thin film layer, a ceramic cement made of a divalent metal oxide is filled in the recesses, and the ceramic A method for producing an electroforming mold, which comprises activating the surface of cement and further applying an electrodeposition layer to the surface of the ceramic cement. (2) An electrodeposited thin film layer is formed on the surface of the matrix having uneven parts, and a filler made of ceramic cement containing a divalent metal oxide is filled in the recesses on the surface of the electrodeposited thin film layer. An electroforming mold characterized in that: and an electrodeposited layer is applied to the surface of the filler.