JPH0124871B2 - - Google Patents
Info
- Publication number
- JPH0124871B2 JPH0124871B2 JP3982885A JP3982885A JPH0124871B2 JP H0124871 B2 JPH0124871 B2 JP H0124871B2 JP 3982885 A JP3982885 A JP 3982885A JP 3982885 A JP3982885 A JP 3982885A JP H0124871 B2 JPH0124871 B2 JP H0124871B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- ceramic cement
- thin film
- film layer
- electrodeposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004568 cement Substances 0.000 claims description 11
- 239000000919 ceramic Substances 0.000 claims description 11
- 238000005323 electroforming Methods 0.000 claims description 11
- 238000004070 electrodeposition Methods 0.000 claims description 10
- 239000011159 matrix material Substances 0.000 claims description 7
- 239000010409 thin film Substances 0.000 claims description 7
- 229910044991 metal oxide Inorganic materials 0.000 claims description 5
- 150000004706 metal oxides Chemical class 0.000 claims description 5
- 239000000945 filler Substances 0.000 claims 2
- 230000003213 activating effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 description 9
- 238000007747 plating Methods 0.000 description 7
- 238000007772 electroless plating Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 239000000395 magnesium oxide Substances 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- KERTUBUCQCSNJU-UHFFFAOYSA-L nickel(2+);disulfamate Chemical compound [Ni+2].NS([O-])(=O)=O.NS([O-])(=O)=O KERTUBUCQCSNJU-UHFFFAOYSA-L 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
Description
【発明の詳細な説明】
「対象技術分野」
この発明は電鋳型およびその製造方法に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] This invention relates to an electroforming mold and a method for manufacturing the same.
「従来装置およびその問題点」
従来、表面に凹部を有する母型から電鋳型を製
造するばあい、通常の電流密度で電着を行うと第
２図に示すように局部的、とくに凸部２に電着層
が厚く形成され、そのために凹部３における電着
層の成長が阻害される。したがつてその電鋳工程
における電流密度を通常の電流密度より低く設定
しているが、反面電着層の形成に多くの日数を要
する欠点がある。また電流密度を低くしてもなお
凹凸部２，３の電着層が不均一となることは避け
られず、このため電鋳工程の後に機械加工を施す
必要があり、いきおい多くの日時を必要とする。"Conventional Apparatus and its Problems" Conventionally, when producing an electroforming mold from a master mold having concave portions on its surface, when electrodeposition is carried out at a normal current density, as shown in FIG. The electrodeposited layer is formed thickly in the recess 3, which inhibits the growth of the electrodeposited layer in the recess 3. Therefore, the current density in the electroforming process is set lower than the usual current density, but on the other hand, it has the disadvantage that it takes many days to form the electrodeposited layer. Furthermore, even if the current density is lowered, it is unavoidable that the electrodeposited layer on the uneven parts 2 and 3 will be non-uniform, and for this reason, it is necessary to perform machining after the electroforming process, which requires a lot of time and effort. shall be.
また電着層の不均一を補正する目的で、第３図
に示すように補助電極８を用いることもなされて
いるが、歯型などの複雑な凹凸形状を有する電鋳
型の製造においては母型を回転させて電着を行う
ため、補助電極の作成ならびに取付装置にかえつ
て多くの時間を費す欠点がある。 In addition, for the purpose of correcting non-uniformity of the electrodeposition layer, an auxiliary electrode 8 is used as shown in Fig. 3. Since electrodeposition is carried out by rotating the electrode, there is a disadvantage that a lot of time is spent on the preparation of the auxiliary electrode and the attachment device.
「目的」
この発明は歯型のように複雑な凹凸部を有する
電鋳型の製造において、電着層の形成が遅い凹部
にも高速で電着を施すことを目的とするものであ
る。"Purpose" The purpose of the present invention is to perform electrodeposition at high speed even in the recesses where the formation of the electrodeposition layer is slow, in the production of electroforming molds having complex uneven parts such as tooth patterns.
「実施例」
以下図によつてこの発明の一実施例について説
明する。"Embodiment" An embodiment of the present invention will be described below with reference to the drawings.
すなわち第１図において電鋳型の母型１はたと
えばギア等の歯型用のもので、その表面には複数
の凸部２および凹部３が形成されている。そして
その母型１の表面にはまず厚さが0.2〜１mmの電
着薄膜層４が形成され、その厚さは母型１の形状
あるいはその大きさで異なり、またその電着薄膜
層４を形成するばあい、母型１が電気メツキを施
すことが可能な形状であるならば電気メツキの方
が能率的に有利であるが、電気メツキを施すこと
が困難なばあい、あるいはそのメツキ工程に比較
的長い時間を要するものにあつては無電解メツキ
により形成することができる。次に電着薄膜層４
の表面において、凹部３内にはセラミツクセメン
ト５が充填され、これによつて母型１の表面はほ
ぼ均一に整形される。ここでセラミツクセメント
５の主剤は二価の金属酸化物たとえば酸化マグネ
シウム（MgO）、酸化亜鉛（ZnO）や酸化銅
（CuO）等で組成される。とくにこの二価の金属
酸化物は常温硬化性を有するため、母型１の材質
がたとえばプラスチツクのように高温加熱に適さ
ないもののばあい、とくに有利である。つづいて
凹部３に充填したセラミツクセメント５を硬化さ
せるが、この状態においてはセラミツクセメント
５は非電導体であるため、その表面を塩化パラジ
ウム（Pdcl2）、塩化錫（Sncl2）等で表面を活性
化し、その表面に厚さが約0.01〜0.1mm程度のメ
ツキ層６を形成する。なおこのメツキ層は無電解
メツキにより行うことが望ましい。そしてこのメ
ツキ層を形成した状態においては母型１の表面に
は凹凸がなくなるため、次にスルフアミン酸ニツ
ケル浴のような高電流の流せるメツキ浴を使用し
て電着加工を行うことによりその表面に電着層７
を形成する。これによつて表面の均一な電鋳母型
が完成する。 That is, in FIG. 1, an electroforming master mold 1 is for example a tooth mold of a gear, and has a plurality of protrusions 2 and recesses 3 formed on its surface. First, an electrodeposited thin film layer 4 with a thickness of 0.2 to 1 mm is formed on the surface of the matrix 1, and the thickness varies depending on the shape or size of the matrix 1. When forming, electroplating is more efficient if the matrix 1 has a shape that allows electroplating, but if it is difficult to electroplat or the plating process If the process requires a relatively long time, it can be formed by electroless plating. Next, the electrodeposited thin film layer 4
Ceramic cement 5 is filled in the recess 3 on the surface of the mold 1, so that the surface of the mother mold 1 is shaped almost uniformly. The main ingredient of the ceramic cement 5 is composed of divalent metal oxides such as magnesium oxide (MgO), zinc oxide (ZnO), and copper oxide (CuO). In particular, since this divalent metal oxide has room temperature curability, it is particularly advantageous when the material of the matrix 1 is not suitable for high temperature heating, such as plastic. Next, the ceramic cement 5 filled in the recess 3 is hardened, but since the ceramic cement 5 is non-conductive in this state, its surface is coated with palladium chloride (Pdcl 2 ), tin chloride (Sncl 2 ), etc. It is activated, and a plating layer 6 having a thickness of about 0.01 to 0.1 mm is formed on the surface. Note that this plating layer is preferably formed by electroless plating. When this plating layer is formed, the surface of the mother mold 1 has no irregularities, so the surface is then processed by electrodeposition using a plating bath that can flow a high current, such as a nickel sulfamate bath. Electrodeposited layer 7 on
form. As a result, an electroformed mother mold with a uniform surface is completed.
「効果」
この発明は上述のように母型の凹部内に二価の
金属酸化物からなるセラミツクセメントを充填す
るとともに、このセラミツクセメントの表面に電
着層を施すようにしているので、電鋳時間が著る
しく短縮される。とくにこの発明によるとその工
程時間は従来の３分の１ないし２分の１に短縮す
ることができる。また従来のように電鋳加工の
程、別に機械加工を行う必要もないため、電鋳設
備の回転性が良く、しかも電気代およびメツキ薬
品の節約と相まつて電鋳加工能率が大幅に向上す
る利点がある。``Effects'' As described above, this invention fills the concave portion of the matrix with ceramic cement made of divalent metal oxide, and also applies an electrodeposition layer to the surface of this ceramic cement. Time is significantly reduced. In particular, according to the present invention, the process time can be reduced to one-third to one-half of the conventional method. In addition, unlike conventional electroforming processes, there is no need to perform separate machining, so the rotatability of electroforming equipment is good, and the efficiency of electroforming processes is greatly improved due to savings in electricity costs and plating chemicals. There are advantages.
第１図はこの発明における電鋳加工方法の一実
施例を示す正断面図、第２図および第３図は従来
の加工方法を示す正断面図である。
１……母型、２……凸部、３……凹部、４……
電着薄膜層、５……セラミツクセメント、６……
メツキ層、７……電着層。
FIG. 1 is a front sectional view showing an embodiment of the electroforming method according to the present invention, and FIGS. 2 and 3 are front sectional views showing a conventional processing method. 1... Mother mold, 2... Convex part, 3... Concave part, 4...
Electrodeposited thin film layer, 5... Ceramic cement, 6...
Plating layer, 7...electrodeposition layer.
Claims (1)
成し、この電着薄膜層の表面において、上記凹部
内に二価の金属酸化物からなるセラミツクセメン
トを充填し、かつこのセラミツクセメントの表面
を活性化し、さらにこのセラミツクセメントの表
面に電着層を施すことを特徴とする電鋳型の製造
方法。 ２ 凹凸部を有する母型の表面に電着薄膜層を形
成し、この電着薄膜層の表面において、上記凹部
内に二価の金属酸化物を含有するセラミツクセメ
ントからなる充填剤を充填し、かつこの充填剤の
表面に電着層を施すことを特徴とする電鋳型。[Claims] 1. An electrodeposited thin film layer is formed on the surface of a matrix having uneven parts, and on the surface of this electrodeposited thin film layer, ceramic cement made of a divalent metal oxide is filled into the recesses. and activating the surface of this ceramic cement, and further applying an electrodeposition layer to the surface of this ceramic cement. 2. Forming an electrodeposited thin film layer on the surface of the matrix having uneven parts, filling the recesses on the surface of the electrodeposited thin film layer with a filler made of ceramic cement containing a divalent metal oxide, An electroforming mold characterized by applying an electrodeposition layer to the surface of this filler.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3982885A JPS61199090A (en) | 1985-02-28 | 1985-02-28 | Electroforming die and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3982885A JPS61199090A (en) | 1985-02-28 | 1985-02-28 | Electroforming die and its manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61199090A JPS61199090A (en) | 1986-09-03 |
| JPH0124871B2 true JPH0124871B2 (en) | 1989-05-15 |
Family
ID=12563830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3982885A Granted JPS61199090A (en) | 1985-02-28 | 1985-02-28 | Electroforming die and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61199090A (en) |
-
1985
- 1985-02-28 JP JP3982885A patent/JPS61199090A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61199090A (en) | 1986-09-03 |
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