JPS61199059U - - Google Patents
Info
- Publication number
- JPS61199059U JPS61199059U JP1985082044U JP8204485U JPS61199059U JP S61199059 U JPS61199059 U JP S61199059U JP 1985082044 U JP1985082044 U JP 1985082044U JP 8204485 U JP8204485 U JP 8204485U JP S61199059 U JPS61199059 U JP S61199059U
- Authority
- JP
- Japan
- Prior art keywords
- photoelectric conversion
- glass
- image sensor
- mounting structure
- conversion element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985082044U JPH0749806Y2 (ja) | 1985-05-31 | 1985-05-31 | イメージセンサの実装構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985082044U JPH0749806Y2 (ja) | 1985-05-31 | 1985-05-31 | イメージセンサの実装構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61199059U true JPS61199059U (US07696358-20100413-C00002.png) | 1986-12-12 |
| JPH0749806Y2 JPH0749806Y2 (ja) | 1995-11-13 |
Family
ID=30629404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985082044U Expired - Lifetime JPH0749806Y2 (ja) | 1985-05-31 | 1985-05-31 | イメージセンサの実装構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0749806Y2 (US07696358-20100413-C00002.png) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS637072A (ja) * | 1986-06-27 | 1988-01-12 | Matsushita Electric Ind Co Ltd | 密着形光電変換素子ユニツト |
| JP2011077554A (ja) * | 2011-01-05 | 2011-04-14 | Sony Corp | 半導体イメージセンサ・モジュールおよび半導体イメージセンサ・モジュールの製造方法 |
| JP2011077555A (ja) * | 2011-01-05 | 2011-04-14 | Sony Corp | 半導体イメージセンサ・モジュールおよび半導体イメージセンサ・モジュールの製造方法 |
| JP2011077553A (ja) * | 2011-01-05 | 2011-04-14 | Sony Corp | 半導体イメージセンサ・モジュールおよび半導体イメージセンサ・モジュールの製造方法 |
| JP4720120B2 (ja) * | 2004-07-14 | 2011-07-13 | ソニー株式会社 | 半導体イメージセンサ・モジュール |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5948954A (ja) * | 1982-09-13 | 1984-03-21 | Kyocera Corp | 密着型読み取り装置 |
| JPS6037194A (ja) * | 1983-08-09 | 1985-02-26 | 株式会社東芝 | ハイブリツド集積回路装置 |
-
1985
- 1985-05-31 JP JP1985082044U patent/JPH0749806Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5948954A (ja) * | 1982-09-13 | 1984-03-21 | Kyocera Corp | 密着型読み取り装置 |
| JPS6037194A (ja) * | 1983-08-09 | 1985-02-26 | 株式会社東芝 | ハイブリツド集積回路装置 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS637072A (ja) * | 1986-06-27 | 1988-01-12 | Matsushita Electric Ind Co Ltd | 密着形光電変換素子ユニツト |
| JP4720120B2 (ja) * | 2004-07-14 | 2011-07-13 | ソニー株式会社 | 半導体イメージセンサ・モジュール |
| JP2011077554A (ja) * | 2011-01-05 | 2011-04-14 | Sony Corp | 半導体イメージセンサ・モジュールおよび半導体イメージセンサ・モジュールの製造方法 |
| JP2011077555A (ja) * | 2011-01-05 | 2011-04-14 | Sony Corp | 半導体イメージセンサ・モジュールおよび半導体イメージセンサ・モジュールの製造方法 |
| JP2011077553A (ja) * | 2011-01-05 | 2011-04-14 | Sony Corp | 半導体イメージセンサ・モジュールおよび半導体イメージセンサ・モジュールの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0749806Y2 (ja) | 1995-11-13 |
