JPS61199042U - - Google Patents

Info

Publication number
JPS61199042U
JPS61199042U JP1985082080U JP8208085U JPS61199042U JP S61199042 U JPS61199042 U JP S61199042U JP 1985082080 U JP1985082080 U JP 1985082080U JP 8208085 U JP8208085 U JP 8208085U JP S61199042 U JPS61199042 U JP S61199042U
Authority
JP
Japan
Prior art keywords
semiconductor device
pellet
electrode
face electrode
envelope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985082080U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985082080U priority Critical patent/JPS61199042U/ja
Publication of JPS61199042U publication Critical patent/JPS61199042U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の半導体装置の断面
図、第２図は同実施例の要部拡大断面図、第３図
は本考案の他の実施例の断面図、第４図は従来例
の断面図、第５図は従来例の部分拡大断面図であ
る。 １……外囲器、３……端面電極、４……ペレツ
ト、５，５′，６，６′……電極、１１……絶縁
層、１３……圧接面、１４……凹部、１５……凸
部。

Claims (1)

  1. 【実用新案登録請求の範囲】 端面電極を有するペレツトを、外囲器内で一組
    の電極により挾持して封止した半導体装置におい
    て、 上記ペレツトの端面電極に圧接する上記電極の
    圧接面を凹凸に形成したことを特徴とする半導体
    装置。
JP1985082080U 1985-05-30 1985-05-30 Pending JPS61199042U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985082080U JPS61199042U (ja) 1985-05-30 1985-05-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985082080U JPS61199042U (ja) 1985-05-30 1985-05-30

Publications (1)

Publication Number Publication Date
JPS61199042U true JPS61199042U (ja) 1986-12-12

Family

ID=30629474

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985082080U Pending JPS61199042U (ja) 1985-05-30 1985-05-30

Country Status (1)

Country Link
JP (1) JPS61199042U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013235948A (ja) * 2012-05-09 2013-11-21 Meidensha Corp 半導体デバイス

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS559559B2 (ja) * 1974-06-21 1980-03-11

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS559559B2 (ja) * 1974-06-21 1980-03-11

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013235948A (ja) * 2012-05-09 2013-11-21 Meidensha Corp 半導体デバイス

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