JPS61199001U - - Google Patents
Info
- Publication number
- JPS61199001U JPS61199001U JP8287685U JP8287685U JPS61199001U JP S61199001 U JPS61199001 U JP S61199001U JP 8287685 U JP8287685 U JP 8287685U JP 8287685 U JP8287685 U JP 8287685U JP S61199001 U JPS61199001 U JP S61199001U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lands
- circuit board
- printed circuit
- component electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8287685U JPS61199001U (en17) | 1985-05-31 | 1985-05-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8287685U JPS61199001U (en17) | 1985-05-31 | 1985-05-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61199001U true JPS61199001U (en17) | 1986-12-12 |
Family
ID=30630990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8287685U Pending JPS61199001U (en17) | 1985-05-31 | 1985-05-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61199001U (en17) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10256432A (ja) * | 1997-03-14 | 1998-09-25 | Nec Corp | 樹脂封止型半導体パッケージ |
| JP2001351802A (ja) * | 2000-06-06 | 2001-12-21 | Rohm Co Ltd | 電子部品 |
| WO2021201290A1 (ja) * | 2020-04-03 | 2021-10-07 | Ｄｏｗａエレクトロニクス株式会社 | 光半導体パッケージの製造方法及び光半導体パッケージ |
-
1985
- 1985-05-31 JP JP8287685U patent/JPS61199001U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10256432A (ja) * | 1997-03-14 | 1998-09-25 | Nec Corp | 樹脂封止型半導体パッケージ |
| JP2001351802A (ja) * | 2000-06-06 | 2001-12-21 | Rohm Co Ltd | 電子部品 |
| WO2021201290A1 (ja) * | 2020-04-03 | 2021-10-07 | Ｄｏｗａエレクトロニクス株式会社 | 光半導体パッケージの製造方法及び光半導体パッケージ |
| JP2021163950A (ja) * | 2020-04-03 | 2021-10-11 | Ｄｏｗａエレクトロニクス株式会社 | 光半導体パッケージの製造方法及び光半導体パッケージ |