JPS61197037U - - Google Patents
Info
- Publication number
- JPS61197037U JPS61197037U JP8065885U JP8065885U JPS61197037U JP S61197037 U JPS61197037 U JP S61197037U JP 8065885 U JP8065885 U JP 8065885U JP 8065885 U JP8065885 U JP 8065885U JP S61197037 U JPS61197037 U JP S61197037U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- belt
- transfer device
- circuit board
- board transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Description
第１図は本考案のプリント基板用移送装置を示
す説明用斜視図、第２図は同上の従来装置を示す
説明用斜視図である。
１１―プリント基板、１２―リフト、１５―ベ
ルト、２２―送材側、２３―ノズル、２４―透孔
、２５―吸引口、２６―吸引フード。
FIG. 1 is an explanatory perspective view showing a printed circuit board transfer device of the present invention, and FIG. 2 is an explanatory perspective view showing a conventional device similar to the above. 11-Printed circuit board, 12-lift, 15-belt, 22-material feeding side, 23-nozzle, 24-through hole, 25-suction port, 26-suction hood.
Claims (1)
トの上部に、左右方向へ走る前後一対のベルトを
張設し、ベルトのやや下方にプリント基板の木口
側に向けてエアを吹き出すノズルを複数個設けて
なるプリント基板用移送装置において、ベルトの
長さ方向に間隔的に透孔を設けると共に、ベルト
の送材側上部へ、底部に吸引口をあけた吸引フー
ドを設け、吸引フードの外側を機外のサクシヨン
ポンプに接続したことを特徴としたプリント基板
用移送装置。 A pair of front and rear belts that run left and right are installed on the top of a lift that lifts and lowers a large number of printed circuit boards, and several nozzles are installed slightly below the belt to blow air toward the end of the printed circuit boards. In the printed circuit board transfer device, through holes are provided at intervals along the length of the belt, and a suction hood with a suction port at the bottom is provided on the upper part of the belt on the material feeding side, and the outside of the suction hood is A printed circuit board transfer device characterized by being connected to an external suction pump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8065885U JPS61197037U (en) | 1985-05-29 | 1985-05-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8065885U JPS61197037U (en) | 1985-05-29 | 1985-05-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61197037U true JPS61197037U (en) | 1986-12-09 |
Family
ID=30626716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8065885U Pending JPS61197037U (en) | 1985-05-29 | 1985-05-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61197037U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01275340A (en) * | 1988-04-26 | 1989-11-06 | Hiroshi Akashi | Sheet delivering device |
| WO2010116949A1 (en) * | 2009-04-07 | 2010-10-14 | 株式会社住友金属ファインテック | Wafer transfer method and wafer transfer apparatus |
| JP2010245303A (en) * | 2009-04-07 | 2010-10-28 | Sumitomo Metal Fine Technology Co Ltd | Wafer transfer method and wafer transfer apparatus |
| JP2011061121A (en) * | 2009-09-14 | 2011-03-24 | Sumitomo Metal Fine Technology Co Ltd | Wafer transport method, and wafer transport apparatus |
| JP2011061122A (en) * | 2009-09-14 | 2011-03-24 | Sumitomo Metal Fine Technology Co Ltd | Method of carrying wafer and wafer carrying device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5822032A (en) * | 1981-07-31 | 1983-02-09 | 日本光電工業株式会社 | Live body electrode |
-
1985
- 1985-05-29 JP JP8065885U patent/JPS61197037U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5822032A (en) * | 1981-07-31 | 1983-02-09 | 日本光電工業株式会社 | Live body electrode |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01275340A (en) * | 1988-04-26 | 1989-11-06 | Hiroshi Akashi | Sheet delivering device |
| WO2010116949A1 (en) * | 2009-04-07 | 2010-10-14 | 株式会社住友金属ファインテック | Wafer transfer method and wafer transfer apparatus |
| JP2010245303A (en) * | 2009-04-07 | 2010-10-28 | Sumitomo Metal Fine Technology Co Ltd | Wafer transfer method and wafer transfer apparatus |
| JP2011061121A (en) * | 2009-09-14 | 2011-03-24 | Sumitomo Metal Fine Technology Co Ltd | Wafer transport method, and wafer transport apparatus |
| JP2011061122A (en) * | 2009-09-14 | 2011-03-24 | Sumitomo Metal Fine Technology Co Ltd | Method of carrying wafer and wafer carrying device |