JPS61196543U - - Google Patents
Info
- Publication number
- JPS61196543U JPS61196543U JP7925585U JP7925585U JPS61196543U JP S61196543 U JPS61196543 U JP S61196543U JP 7925585 U JP7925585 U JP 7925585U JP 7925585 U JP7925585 U JP 7925585U JP S61196543 U JPS61196543 U JP S61196543U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- lead
- integrated circuit
- electrically connected
- semiconductor integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7925585U JPS61196543U (enrdf_load_stackoverflow) | 1985-05-29 | 1985-05-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7925585U JPS61196543U (enrdf_load_stackoverflow) | 1985-05-29 | 1985-05-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61196543U true JPS61196543U (enrdf_load_stackoverflow) | 1986-12-08 |
Family
ID=30623997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7925585U Pending JPS61196543U (enrdf_load_stackoverflow) | 1985-05-29 | 1985-05-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61196543U (enrdf_load_stackoverflow) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS564255A (en) * | 1979-06-25 | 1981-01-17 | Hitachi Ltd | Semiconductor device sealed up with resin |
| JPS5957466A (ja) * | 1982-08-25 | 1984-04-03 | シ−メンス・アクチエンゲゼルシヤフト | 接続片を備えた電気デバイス |
| JPS6027150A (ja) * | 1983-07-25 | 1985-02-12 | Nec Corp | 樹脂封止型半導体装置 |
-
1985
- 1985-05-29 JP JP7925585U patent/JPS61196543U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS564255A (en) * | 1979-06-25 | 1981-01-17 | Hitachi Ltd | Semiconductor device sealed up with resin |
| JPS5957466A (ja) * | 1982-08-25 | 1984-04-03 | シ−メンス・アクチエンゲゼルシヤフト | 接続片を備えた電気デバイス |
| JPS6027150A (ja) * | 1983-07-25 | 1985-02-12 | Nec Corp | 樹脂封止型半導体装置 |