JPS61195056U - - Google Patents
Info
- Publication number
- JPS61195056U JPS61195056U JP7820485U JP7820485U JPS61195056U JP S61195056 U JPS61195056 U JP S61195056U JP 7820485 U JP7820485 U JP 7820485U JP 7820485 U JP7820485 U JP 7820485U JP S61195056 U JPS61195056 U JP S61195056U
- Authority
- JP
- Japan
- Prior art keywords
- terminal parts
- pin
- mounting
- semiconductor chip
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7820485U JPS61195056U (en:Method) | 1985-05-25 | 1985-05-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7820485U JPS61195056U (en:Method) | 1985-05-25 | 1985-05-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61195056U true JPS61195056U (en:Method) | 1986-12-04 |
Family
ID=30621974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7820485U Pending JPS61195056U (en:Method) | 1985-05-25 | 1985-05-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61195056U (en:Method) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53139976A (en) * | 1977-05-13 | 1978-12-06 | Seiko Epson Corp | Packaging method of semiconductor chips |
| JPS601838A (ja) * | 1983-06-17 | 1985-01-08 | Matsushita Electric Ind Co Ltd | 半導体装置 |
-
1985
- 1985-05-25 JP JP7820485U patent/JPS61195056U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53139976A (en) * | 1977-05-13 | 1978-12-06 | Seiko Epson Corp | Packaging method of semiconductor chips |
| JPS601838A (ja) * | 1983-06-17 | 1985-01-08 | Matsushita Electric Ind Co Ltd | 半導体装置 |