JPS61194841A - Substrate heating column - Google Patents

Abstract

PURPOSE:To mount a plurality of parts having different temperature conditions on a heating column by providing a plurality of regions having different heating conditions. CONSTITUTION:In a heating column used to form a mixer, the heat column 1 is split into a periphery and a center so that the periphery is the first heating column unit 2 for forming the first temperature region and the center is the second heating column unit 4 for forming the second temperature region. A heat insulator 3 for thermally separating the columns 2 and 4 is provided. According to the heat columns of this construction, the parts can be continuously mounted without temperature regulation at every part even if two types of parts having different temperature conditions are mounted by setting the temperature to separately use the first and second columns.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) This invention relates to a substrate heating heat column for use in forming hybrid circuits.

(Prior Art) Conventionally, when forming a normal hybrid circuit, a substrate of the hybrid circuit, such as an alumina substrate or a berrier substrate, is placed on a uniformly heated substrate heat column of a chipponder.
This was heated for a certain period of time to raise the temperature, and active components such as transistors and field effect transistors (FETs), as well as passive components such as resistors and capacitors, were soldered onto the substrate.

By the way, in recent years, hybrid circuits for microwaves have been created, and as the frequency of use of these hybrid circuits approaches the microwave band, the method of manufacturing these hybrid circuits has changed to a method in which active elements are packaged and then mounted in the hybrid circuit. This has led to a shift to a method in which active components such as transistors and FETs are directly die-bonded onto hybrid circuits in a bare state without being housed in a package.

(Problems to be Solved by the Invention) However, conventional substrate heating heat columns have a structure consisting of a single member that uniformly heats a sheet metal body.

For this reason, when it is necessary to mount various chips on a hybrid circuit board, we mount them first, starting with parts that can be mounted at high temperatures, and then move on to parts that can be mounted at low temperatures. The necessary temperature of the component must be adjusted each time it is mounted, making the operation complicated.

Furthermore, in this conventional method, if the substrate heat column of one chipponder can only be set to one temperature, a dedicated chipponder is required for each temperature required for the component to be mounted, for example, for each low temperature and high temperature. It was uneconomical.

Accordingly, an object of the present invention is to provide a substrate heat column configured so that two temperature settings are possible for the substrate heat column.

(Means for solving the problem) In order to achieve this object, according to the present invention, as shown in FIGS. 1(A) and (B), a substrate heating heat column 1 used for forming a hybrid circuit. , a first heat column part 2 and a second heat column part 4 which is thermally separated from the first heat column part 2 by a heat insulating part 3 and a second heat column part 4 which is heated to a first temperature. It is characterized by comprising a first heating means 5 for heating the second heat column 4 to a second temperature, and a second heating means 6 for heating the second heat column 4 to a second temperature.

(Function) With this configuration, in the substrate heat column 1 of one chipponder, it is possible to set the temperature by using the first heat column section 2 as a low temperature region and the second heat column section 4 as a high temperature region, for example. This eliminates the need to adjust the temperature for each type of component even when mounting two types of components with different temperature conditions, and also eliminates the need to install a dedicated chipponder for each different type of component. There are advantages.

(Example) Hereinafter, the present invention will be described in detail with reference to the drawings.

FIG. 1(A) is a plan view schematically showing the main part of the substrate heat column of the present invention, and FIG.
-II is a schematic cross-sectional view taken along the edge line. These drawings are only schematic illustrations to the extent that the present invention can be understood, and therefore, the dimensions, shapes, and arrangement relationships of each component are not limited to the illustrated examples.

In FIG. 1(A), l is a substrate heating heat column,
This heat column 1 is divided into two parts, a peripheral part and a central part, the peripheral part is a first heat column part 2 forming a first temperature region, and the central part is a second heat column part 4 forming a second temperature region. The structure is as follows. Reference numeral 3 denotes a heat insulating part (shown with diagonal lines in the figure) for thermally separating the first and second heat column parts 2 and 4, and is made of a conventionally commonly used heat insulating material such as asbestos. can be formed.

FIG. 1(B) is a sectional view taken along the line ■-■ in FIG. 1(A), and 5 is a first heating means for setting the first heat column part 2 to a first temperature, for example, a low temperature; Reference numeral 6 denotes a second heating means for setting the second heat column section 4 to a second temperature, for example, a high temperature. These temperature means 5 and 6 can be formed by any suitable means for directly or indirectly heating these heat column sections.

In such a configuration, for example, when mounting a component that requires thermocompression bonding of gold on the second heat column section 4 at the center, this section 4 is heated to 400"O, and the first peripheral section is heated to 400" O. Heating the first heat column part to about 200°C,
There, components can be mounted by soldering.

This invention is not limited to the above-mentioned embodiments. For example, the first and second temperature regions may be arranged in reverse, or the invention may be expanded to provide three or more temperature regions. Therefore, such cases are also within the scope of the present invention.

Further, the planar shape of this temperature region corresponding to FIG. 1(A) is not limited to the illustrated example, and can be set to various shapes as required.

(Effects of the Invention) As is clear from the above explanation, according to the configuration of the present invention, one substrate heat column of one chipponder can be reliably divided into two temperature regions, high temperature and low temperature. Therefore, when two types of components with different temperature conditions are mounted on a hybrid circuit, they can be assembled sequentially on the same substrate heat column divided into four temperatures.

Therefore, there is no need for temperature adjustment as in the conventional case, and the mounting operation becomes simple and easy.

Further, according to the present invention, it is possible to continuously mount components having different temperature conditions using - number of substrate heat columns, which is superior in terms of economy compared to the conventional case.

[Brief explanation of drawings]

FIG. 1(A) is a plan view schematically showing a main part of an embodiment of the substrate heat column of the present invention, and FIG. 1(B) is a line taken on line 11 of FIG. 1(A). FIG. l... Substrate heat column, 2... First heat column section 3... Heat insulation section, 4... Second heat column section 5... First heating means, 6... Second heating means . Patent applicant: Oki Electric Industry Co., Ltd. Figure 1 f, substrate heat column 2, first heat n tsumu stem j - insulation part 4: V ni heat kakum (? 5; season

Claims (1)

[Claims] In a substrate heating heat column used for forming a hybrid circuit, a first heat column section; a second heat column section thermally separated from the first heat column section by a heat insulating section;
A substrate heat column comprising: a first heating means for heating the first heat column part to a first temperature; and a second heating means for heating the second heat column to a second temperature.