JPS6193646A - Semiconductor integrated circuit - Google Patents

Abstract

PURPOSE:To form an IC, in which wire breakdown in wiring is hard to occur in manufacturing, by forming a wiring pattern, which can be straightened in a strip shape without being interfered by other patterns, in a nonlinear strip shape that can alleviate tensile stress. CONSTITUTION:The pattern of a wiring 3a has a zigzag strip shape, which is formed by combining U-shapes. The wiring 3a has parts,whose direction is about perpendicular to the longitudinal direction of the wiring 3a. Therefore, the wiring can be expanded and contracted in the longitudinal direction. Even if tensile stress is applied during manufacture, the wirings is not broken down, and the occurrence of manufacturing troubles can be suppressed.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a semiconductor integrated circuit, and particularly to a wiring pattern formed on a chip thereof.

2. Description of the Related Art As semiconductor integrated circuits become more highly integrated, wiring patterns formed on semiconductor chips are becoming narrower.

This thinning of the wiring pattern is the result of semiconductor integrated circuits (LC).
This may lead to manufacturing troubles such as disconnection of the wiring during the manufacturing process, and countermeasures are required to deal with these troubles.

[Conventional technology]

FIG. 2 is a plan view showing an example of conventional wiring formed on a semiconductor chip.

In the figure, la and lb are transistors formed on the same semiconductor chip, 2a and 2b are contact holes for leading wiring from transistors las and lb, respectively, and 3 is a contact hole made of a conductor such as aluminum. This is a wiring that connects transistors 1a and 1b through 2a and 2b.

Generally, the pattern of the wiring 3 is formed in a straight line unless it is interfered with by other wiring patterns.

Furthermore, the pattern width of the wiring 3 has become narrower, for example, from 2.0-1.5 to 1.0 μm, due to higher integration of ICs.

[Problem that the invention seeks to solve]

On the other hand, it has been found that when the wiring 3 made of, for example, aluminum is made straight and has a narrow width, the wiring 3 may break during a subsequent process such as a heat treatment process, which may cause problems in manufacturing. I came.

[Means for solving problems]

The above problem is solved by the semiconductor integrated circuit of the present invention, which has a wiring pattern that can be formed into a linear band shape without being interfered with by other patterns, but is formed into a non-linear band shape that relieves tensile stress. solved by.

[Effect]

The above-mentioned problem of disconnection of wiring during the manufacturing process increases during post-processing, such as heat treatment, because the wiring itself has internal stress and the wiring pattern is in the form of a straight band. This is thought to be due to the failure to withstand tensile stress and fracture at grain boundaries.

Therefore, by forming the pattern into a non-linear band shape that relieves tensile stress, such as a zigzag band shape, it is possible to alleviate the tensile stress that increases during the post-processing and prevent the occurrence of disconnection of the wiring. It becomes possible to do so. This can be done only for the wiring in question.

In this way, it is possible to provide an IC that is less likely to cause disconnection of wiring during manufacturing even if it is highly integrated, thereby reducing manufacturing troubles of the IC.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings. The same reference numerals refer to the same objects throughout the design.

FIG. 1 is a hexagonal plan view showing one embodiment of the present invention of wiring formed on a semiconductor chip, and corresponds to FIG. 2.

The wiring 3a shown in FIG. 1 is a replacement for the wiring 3 shown in FIG. 2, and its pattern is a zigzag strip formed by combining U-shapes.

Specifically, when the material of the wiring 3a is aluminum, its dimensions a, bSc, d and thickness are, for example, approximately 1.5 μm, approximately 3.0 μm, approximately 1.5 μm, and approximately 10 μm, respectively.
rm, about 1.0. It is czm.

This wiring 3a has a portion in a direction substantially perpendicular to the longitudinal direction of the wiring 3a in the center line of the strip, and therefore can be expanded and contracted in the longitudinal direction. For this reason, even if tensile stress is applied during the manufacturing process, it will not break like in the past, and orders for manufacturing problems can be suppressed.

In addition, although the pattern of the wiring 3a in the above embodiment is a zigzag strip formed by combining U-shapes, the present invention is not limited to this shape in view of its principle. It may be in the form of a band with zigzags formed by combining letters, or these zigzags may be provided partially.

[1 Effect of the Invention] As explained above, according to the configuration of the present invention, it is possible to provide an IC that is unlikely to cause disconnection of wiring during manufacturing even if it is highly integrated, making it possible to reduce manufacturing troubles of the RC. It has the effect of

[Brief explanation of drawings]

In the drawings, FIG. 1 is a plan view showing an example of wiring formed on a semiconductor chip according to the present invention, and FIG. 2 is a plan view showing an example of a conventional wiring formed on a semiconductor chip. In the figure, 1aSlb is a transistor, 2a and 2b are contact holes, 3.3a is wiring, and a and bScSd are dimensions, respectively.

Claims (1)

[Claims] A semiconductor integrated circuit characterized in that a wiring pattern that can be formed into a linear band shape without being interfered with by other patterns has wiring formed in a non-linear band shape that relieves tensile stress.