JPS61194196A - 電気錫−鉛合金メツキ法 - Google Patents

電気錫−鉛合金メツキ法

Info

Publication number
JPS61194196A
JPS61194196A JP3415685A JP3415685A JPS61194196A JP S61194196 A JPS61194196 A JP S61194196A JP 3415685 A JP3415685 A JP 3415685A JP 3415685 A JP3415685 A JP 3415685A JP S61194196 A JPS61194196 A JP S61194196A
Authority
JP
Japan
Prior art keywords
tin
lead alloy
plating
bath
alloy plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3415685A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0549760B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Shigeki Matsumoto
茂樹 松本
Yoichi Nakano
洋一 中野
Daiji Tonai
藤内　大二
Motoaki Matsuda
元秋 松田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
NEC Kyushu Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd, NEC Kyushu Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP3415685A priority Critical patent/JPS61194196A/ja
Publication of JPS61194196A publication Critical patent/JPS61194196A/ja
Publication of JPH0549760B2 publication Critical patent/JPH0549760B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
JP3415685A 1985-02-22 1985-02-22 電気錫−鉛合金メツキ法 Granted JPS61194196A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3415685A JPS61194196A (ja) 1985-02-22 1985-02-22 電気錫−鉛合金メツキ法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3415685A JPS61194196A (ja) 1985-02-22 1985-02-22 電気錫−鉛合金メツキ法

Publications (2)

Publication Number Publication Date
JPS61194196A true JPS61194196A (ja) 1986-08-28
JPH0549760B2 JPH0549760B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-07-27

Family

ID=12406339

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3415685A Granted JPS61194196A (ja) 1985-02-22 1985-02-22 電気錫−鉛合金メツキ法

Country Status (1)

Country Link
JP (1) JPS61194196A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63118093A (ja) * 1986-11-05 1988-05-23 Tanaka Electron Ind Co Ltd 電子部品の錫めつき方法
JPH04280993A (ja) * 1991-03-11 1992-10-06 Electroplating Eng Of Japan Co メッキ方法
EP0825281A1 (en) * 1996-08-21 1998-02-25 Lucent Technologies Inc. Tin electroplating process
JP2006257492A (ja) * 2005-03-17 2006-09-28 Nec Corp 合金めっき方法および合金めっき装置
JP2009249640A (ja) * 2008-04-01 2009-10-29 Mitsubishi Materials Corp はんだめっき用アノード材
EP1430166B1 (en) * 2001-03-13 2017-02-08 MacDermid Limited Method for depositing tin alloys

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63118093A (ja) * 1986-11-05 1988-05-23 Tanaka Electron Ind Co Ltd 電子部品の錫めつき方法
JPH04280993A (ja) * 1991-03-11 1992-10-06 Electroplating Eng Of Japan Co メッキ方法
EP0825281A1 (en) * 1996-08-21 1998-02-25 Lucent Technologies Inc. Tin electroplating process
US5750017A (en) * 1996-08-21 1998-05-12 Lucent Technologies Inc. Tin electroplating process
EP1430166B1 (en) * 2001-03-13 2017-02-08 MacDermid Limited Method for depositing tin alloys
JP2006257492A (ja) * 2005-03-17 2006-09-28 Nec Corp 合金めっき方法および合金めっき装置
JP2009249640A (ja) * 2008-04-01 2009-10-29 Mitsubishi Materials Corp はんだめっき用アノード材

Also Published As

Publication number Publication date
JPH0549760B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-07-27

Similar Documents

Publication Publication Date Title
US8603315B2 (en) Tin and tin alloy electroplating method with controlled internal stress and grain size of the resulting deposit
EP0075784B1 (en) Process for direct gold plating of stainless steel
US2903403A (en) Method of copper-plating metal surfaces
US3303111A (en) Electro-electroless plating method
US5614003A (en) Method for producing electroless polyalloys
US20040118696A1 (en) Tin plating method
US3264199A (en) Electroless plating of metals
JPS61243193A (ja) ステンレス鋼に純金めつきする方法
US3953624A (en) Method of electrolessly depositing nickel-phosphorus alloys
JPS61194196A (ja) 電気錫−鉛合金メツキ法
US2700019A (en) Acid copper plating
US5143544A (en) Tin lead plating solution
US2811484A (en) Electrodeposition of zinc on magnesium and its alloys
US5194139A (en) Pretreating solution for silver plating and silver plating treating process using the solution
JPH0573837B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP2680012B2 (ja) 無電解スズ一鉛合金めっき浴
US5169692A (en) Tin lead process
US4615774A (en) Gold alloy plating bath and process
JPH04160173A (ja) 銅の変色防止液
US3984291A (en) Electrodeposition of tin-lead alloys and compositions therefor
US2871172A (en) Electro-plating of metals
JP7121390B2 (ja) すず合金電気めっき浴及びそれを用いためっき方法
US2690997A (en) Electrodeposition of copper
CA1045577A (en) Electrodeposition of bright tin-nickel alloy
JPH0699831B2 (ja) Ｓｎ−Ｎｉ合金またはＳｎ−Ｃｏ合金めつき方法

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees