JPS6119149A - Sealing method of semiconductor device - Google Patents
Sealing method of semiconductor deviceInfo
- Publication number
- JPS6119149A JPS6119149A JP59139630A JP13963084A JPS6119149A JP S6119149 A JPS6119149 A JP S6119149A JP 59139630 A JP59139630 A JP 59139630A JP 13963084 A JP13963084 A JP 13963084A JP S6119149 A JPS6119149 A JP S6119149A
- Authority
- JP
- Japan
- Prior art keywords
- sealing
- section
- ink
- stamp
- mirror
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54406—Marks applied to semiconductor devices or parts comprising alphanumeric information
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
- H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Abstract
Description
【発明の詳細な説明】
（技術分野）
本発明は樹脂封止型パッケージの捺印方法に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to a method of marking a resin-sealed package.
（従来技術）
従来樹脂封止型パッケージの捺印において第１図に示す
如く、品名、１−ａを捺印インクで捺印し、その後、こ
の半導体装置の電気的特性を調べ、その特性に応じて特
性記号１−ｂｔインク捺印していた。しかし、インク捺
印方法は一長、−短で、つまシインク捺印は、被捺印面
の表面あらさにそれ程、影響されることなく明瞭に判読
できる捺印を提供できるという長所がおるが、捺印装置
の調整に時間がかかシ非常に不安定な工程である。そこ
で、最近は捺印方法で、装置の調整にもほとんど時間が
かからないというレーザー捺印方法が試みられているが
、捺印面の表面あらさに影響されて、表面あらさが粗い
と捺印された文字が読みにくいという欠点を有する。一
方レーザー捺印用に、パッケージの表面を鏡面にすると
いう技術は現在あるが、鏡面にするために多大の費用が
発生し、良策とはいえない。(Prior art) As shown in FIG. 1, when stamping a conventional resin-sealed package, the product name, 1-a, is stamped with stamping ink, and then the electrical characteristics of this semiconductor device are examined, and the characteristics are determined according to the characteristics. It was stamped with symbol 1-bt ink. However, the ink stamping method has advantages and disadvantages, and the advantage of the ink stamping method is that it can provide a clearly legible stamp without being affected by the roughness of the surface to be stamped, but the adjustment of the stamping device is This is a time consuming and extremely unstable process. Recently, attempts have been made to use a laser marking method that takes almost no time to adjust the device, but it is affected by the roughness of the printing surface, and if the surface roughness is rough, the printed characters are difficult to read. It has the following drawback. On the other hand, there is currently a technology to make the surface of the package mirror-like for laser marking, but it costs a lot of money to make it mirror-like, so it is not a good idea.
（発明の目的）
本発明の目的は、現存する樹脂封止型パッケージを大巾
に変更することなく、従来技術の捺印方法の欠点を補う
捺印方法を提供することにある。(Objective of the Invention) An object of the present invention is to provide a marking method that compensates for the drawbacks of conventional marking methods without making major changes to existing resin-sealed packages.
（発明の構成）
本発明の基本的な構成は、品名等の多くの文字列は捺印
面を構成している表面の粗い部分にインク捺印し、特性
捺印は捺印面上に作られた鏡面の部分にレーザー捺印す
ることにある。(Structure of the Invention) The basic structure of the present invention is that many character strings such as product names are stamped with ink on the rough part of the stamping surface, and characteristic stamps are printed on the mirror surface made on the stamping surface. The part is marked with a laser.
（発明の実施例）
第２図に、第３図本発明による捺印の実施例を示す。こ
れらの図面はパッケージ表面に捺印されたところを示す
ものである。第２図と第３図との違いはパッケージによ
りて鏡面の部分が異なるので、例と示した。第２図では
、まず品名２−ａをインク捺印して後の工程で特性試験
を行ない、その結果を図の斜線部２−ｃに特性捺印２−
ｂをレーザー捺印したものである。図の斜線部２−ｃは
インジェクタピン跡と通常呼ばれる樹脂封止型パッケー
ジの製造上性ずといっていいほど必要なものであり、そ
の表面あらさは封止金型の製造上鏡面となる。第３図は
インジェクタピン跡（鏡面）３−ｃの位置が異なりそこ
にレーザ捺印３−ｂを行い、中央の表のちらい部分には
インク捺印３−ａを行ったものを示している。(Embodiment of the Invention) FIG. 2 shows an embodiment of the sealing according to the present invention shown in FIG. These drawings show what is stamped on the surface of the package. The difference between FIG. 2 and FIG. 3 is that the mirror surface portion differs depending on the package, so this is shown as an example. In Fig. 2, the product name 2-a is first stamped in ink, a characteristic test is performed in a subsequent process, and the results are shown in the shaded area 2-c of the figure with the characteristic stamp 2-a.
b is laser-marked. The shaded area 2-c in the figure is usually called an injector pin mark and is almost necessary for the production of a resin-sealed package, and its surface roughness becomes a mirror surface for the production of the sealing mold. FIG. 3 shows an injector pin mark (mirror surface) 3-c in a different position, where a laser mark 3-b is applied, and an ink mark 3-a is applied to a small part of the center front.
（発明の効果）
本発明は、表面の粗い部分に捺印する品名捺印には従来
技術のインク捺印を施して明瞭に読める捺印を提供して
おき、特性捺印に関しては本発明により表面が鏡面であ
る部分に、レーザー捺印で特性捺印することによって、
インク捺印と同程度に読みやすい捺印ができる。パッケ
ージ表面の鏡面部を使うことによってインク捺印がレー
ザー捺印に置き変わったけである。これによって、よ多
安定した特性捺印ができることになった。(Effects of the Invention) The present invention provides a clearly readable stamp by applying a prior art ink stamp to the product name stamp stamped on a rough surface, and the present invention provides a clearly readable stamp by applying the ink stamp of the prior art. By marking the parts with a laser mark,
A stamp that is as easy to read as an ink stamp can be made. By using the mirror surface of the package surface, the ink stamp was simply replaced with a laser stamp. This allows for more stable characteristic markings.
第１図は従来技術を示す平面図であシ、第２図および第
３図はそれぞれ本発明の実施例を示す平面図である。
１−ａ・・・・・・品名捺印（インク捺印）、１−ｂ・
・・・・・特性捺印（インク捺印）、２−ａ・・・・・
・品名捺印（インク捺印）、２−ｂ・・・・・・特性捺
印（レーザー捺印）Ｓ ２−Ｃ・・・・・・インジェ
クタービン跡（鏡面）、３−ａ・・・・・・品名捺印（
インク捺印）、３−ｂ・・・・・・特性捺印（レーザー
捺印）％３−Ｃ・・団・インジェクタービン跡（鏡面）
。FIG. 1 is a plan view showing a conventional technique, and FIGS. 2 and 3 are plan views showing an embodiment of the present invention, respectively. 1-a...Product name stamp (ink stamp), 1-b.
...Characteristic stamp (ink stamp), 2-a...
・Product name stamp (ink stamp), 2-b... Characteristic stamp (laser stamp) S 2-C... Injector turbine trace (mirror surface), 3-a... Product name Seal (
Ink stamp), 3-b... Characteristic stamp (laser stamp)% 3-C... group, injector turbine trace (mirror surface)
.
Claims (2)
い第１の部分と、該第１の部分よりも表面あらさがあら
くない第２の部分とを有し、該第１の部分にインク捺印
を行い、該第２の部分にレーザー捺印を行うことを特徴
とする半導体装置の捺印方法。(1) A resin-sealed package has a first portion with a rough surface on one side and a second portion with a surface roughness less rough than the first portion, and the first portion has a first portion with a rough surface. 1. A method for marking a semiconductor device, comprising performing ink marking and laser marking on the second portion.
ることを特徴とする特許請求の範囲第（１）項記載の半
導体装置の捺印方法。(2) The method for marking a semiconductor device according to claim (1), wherein the second portion is an injector pin mark on the mold.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59139630A JPS6119149A (en) | 1984-07-05 | 1984-07-05 | Sealing method of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59139630A JPS6119149A (en) | 1984-07-05 | 1984-07-05 | Sealing method of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6119149A true JPS6119149A (en) | 1986-01-28 |
Family
ID=15249751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59139630A Pending JPS6119149A (en) | 1984-07-05 | 1984-07-05 | Sealing method of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6119149A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0895287A3 (en) * | 1997-07-31 | 2006-04-05 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device and lead frame for the same |
-
1984
- 1984-07-05 JP JP59139630A patent/JPS6119149A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0895287A3 (en) * | 1997-07-31 | 2006-04-05 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device and lead frame for the same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2002010721A3 (en) | Methods for high-precision gap and orientation sensing between a transparent template and substrate for imprint lithography | |
| JPS6119149A (en) | Sealing method of semiconductor device | |
| JPS5839494A (en) | Marking method | |
| JPS5928350A (en) | Metal mold for resin sealed type semiconductor device | |
| JPS59175751A (en) | Resin seal type semiconductor device | |
| JPS62169448A (en) | Semiconductor device | |
| US4668450A (en) | Method for the production of inscribed keys | |
| JPH0216272Y2 (en) | ||
| JPS6058627A (en) | Manufacture of resin sealed type package for electric parts | |
| JPH0422142A (en) | Mold and manufacture of photocoupler using same | |
| JPH0721301Y2 (en) | connector | |
| JPH0493008A (en) | Marking of chip type electrolytic capacitor | |
| JPH09300598A (en) | Marking device for electronic parts and marking method | |
| JPH02307248A (en) | Marking of semiconductor device | |
| JP2000183238A (en) | Semiconductor device and imprinting thereof | |
| JPH0268830A (en) | Manufacture of dial plate | |
| KR200158887Y1 (en) | Jig for probe card manufacture | |
| JPH01128451A (en) | Semiconductor device | |
| JPS5928361A (en) | Resin sealed type semiconductor device | |
| JPH0370115A (en) | Electronic parts | |
| JPH0750227A (en) | Manufacture of solid electrolytic capacitor | |
| KR960003241Y1 (en) | Reference making device for monitor | |
| JPS617635A (en) | Metal mold for resin sealing of electronic parts | |
| KR970006458Y1 (en) | Omr card | |
| KR20040079616A (en) | Molding die enabling semiconductor packages to be marked |