JPS61190145U - - Google Patents

Info

Publication number
JPS61190145U
JPS61190145U JP7429885U JP7429885U JPS61190145U JP S61190145 U JPS61190145 U JP S61190145U JP 7429885 U JP7429885 U JP 7429885U JP 7429885 U JP7429885 U JP 7429885U JP S61190145 U JPS61190145 U JP S61190145U
Authority
JP
Japan
Prior art keywords
mold part
terminal
package type
flat package
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7429885U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7429885U priority Critical patent/JPS61190145U/ja
Publication of JPS61190145U publication Critical patent/JPS61190145U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す平面図、第2
図は第1図の断面図、第3図は第1図の一部拡大
図、第4図は従来例を示す平面図である。 1……本体モールド部、2a……長い端子、2
b……短い端子、3……樹脂モールド部。
Figure 1 is a plan view showing one embodiment of the present invention;
The figure is a sectional view of FIG. 1, FIG. 3 is a partially enlarged view of FIG. 1, and FIG. 4 is a plan view showing a conventional example. 1... Body mold part, 2a... Long terminal, 2
b...Short terminal, 3...Resin mold part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] フラツトパツケージ型ICの本体モールド部と
、前記モールド部より突出した交互に長さの異な
る端子群と、前記端子群内の短い端子の長さ以上
に、長い端子に形成された樹脂モールド部とを備
えたことを特徴とするフラツトパツケージ型IC
A main body mold part of a flat package type IC, a group of terminals protruding from the mold part and having alternately different lengths, and a resin mold part formed into a long terminal longer than the length of the short terminal in the terminal group. A flat package type IC characterized by having
.
JP7429885U 1985-05-20 1985-05-20 Pending JPS61190145U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7429885U JPS61190145U (en) 1985-05-20 1985-05-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7429885U JPS61190145U (en) 1985-05-20 1985-05-20

Publications (1)

Publication Number Publication Date
JPS61190145U true JPS61190145U (en) 1986-11-27

Family

ID=30614465

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7429885U Pending JPS61190145U (en) 1985-05-20 1985-05-20

Country Status (1)

Country Link
JP (1) JPS61190145U (en)

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