JPS61189697A - 電子部品搭載用基板およびその製造方法 - Google Patents
電子部品搭載用基板およびその製造方法Info
- Publication number
- JPS61189697A JPS61189697A JP60030803A JP3080385A JPS61189697A JP S61189697 A JPS61189697 A JP S61189697A JP 60030803 A JP60030803 A JP 60030803A JP 3080385 A JP3080385 A JP 3080385A JP S61189697 A JPS61189697 A JP S61189697A
- Authority
- JP
- Japan
- Prior art keywords
- recess
- substrate
- board
- metal plate
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims description 38
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 62
- 239000002184 metal Substances 0.000 claims description 62
- 239000011248 coating agent Substances 0.000 claims description 19
- 238000000576 coating method Methods 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 18
- 238000007747 plating Methods 0.000 claims description 12
- 239000012790 adhesive layer Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 238000007796 conventional method Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims 4
- 238000010030 laminating Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 24
- 230000017525 heat dissipation Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- -1 Sulfo- Chemical class 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60030803A JPS61189697A (ja) | 1985-02-19 | 1985-02-19 | 電子部品搭載用基板およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60030803A JPS61189697A (ja) | 1985-02-19 | 1985-02-19 | 電子部品搭載用基板およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61189697A true JPS61189697A (ja) | 1986-08-23 |
| JPH0358551B2 JPH0358551B2 (enrdf_load_stackoverflow) | 1991-09-05 |
Family
ID=12313835
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60030803A Granted JPS61189697A (ja) | 1985-02-19 | 1985-02-19 | 電子部品搭載用基板およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61189697A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61207095A (ja) * | 1985-03-11 | 1986-09-13 | イビデン株式会社 | 薄型ｉｃカ−ド用プリント配線基板 |
| JPS6218084A (ja) * | 1985-07-16 | 1987-01-27 | 新藤電子工業株式会社 | 半導体素子実装用プリント配線板の製造方法 |
| JPS6439093A (en) * | 1987-08-05 | 1989-02-09 | Matsushita Electric Works Ltd | Manufacture of electronic part mounting board |
-
1985
- 1985-02-19 JP JP60030803A patent/JPS61189697A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61207095A (ja) * | 1985-03-11 | 1986-09-13 | イビデン株式会社 | 薄型ｉｃカ−ド用プリント配線基板 |
| JPS6218084A (ja) * | 1985-07-16 | 1987-01-27 | 新藤電子工業株式会社 | 半導体素子実装用プリント配線板の製造方法 |
| JPS6439093A (en) * | 1987-08-05 | 1989-02-09 | Matsushita Electric Works Ltd | Manufacture of electronic part mounting board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0358551B2 (enrdf_load_stackoverflow) | 1991-09-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0197148B1 (en) | Printed-circuit board for mounting electronic element and method of manufacture thereof | |
| US20090268423A1 (en) | Interconnect substrate and electronic circuit mounted structure | |
| JPH0420279B2 (enrdf_load_stackoverflow) | ||
| JPS6134990A (ja) | 電子部品搭載用基板およびその製造方法 | |
| JPS61202495A (ja) | 電子部品搭載用基板およびその製造方法 | |
| JPS61189697A (ja) | 電子部品搭載用基板およびその製造方法 | |
| JPH0263141A (ja) | 電子部品搭載用基板の製造方法 | |
| JP2620611B2 (ja) | 電子部品搭載用基板 | |
| JPS61172393A (ja) | 電子部品搭載用基板およびその製造方法 | |
| JPS6134989A (ja) | 電子部品搭載用基板 | |
| JPH04142068A (ja) | 電子部品搭載用基板及びその製造方法 | |
| JP2612468B2 (ja) | 電子部品搭載用基板 | |
| JPH056714Y2 (enrdf_load_stackoverflow) | ||
| JPS6165490A (ja) | 電子部品搭載用基板の製造方法 | |
| JPS60111489A (ja) | 電子部品塔載用基板およびその製造方法 | |
| JPH05291429A (ja) | 半導体装置 | |
| JPH0823049A (ja) | 半導体パッケージ | |
| JP2596788B2 (ja) | 基板集合シートとその製造方法 | |
| JPH039341Y2 (enrdf_load_stackoverflow) | ||
| KR19980068016A (ko) | 가요성(可撓性) 회로 기판을 이용한 볼 그리드 어레이(Ball Grid Array : BGA) 반도체 패키지 및 그 제조 방법 | |
| JPH04162454A (ja) | 混成集積回路装置 | |
| JPS6334961A (ja) | 半導体搭載用基板およびその製造方法 | |
| JPS60187098A (ja) | プラグインパツケ−ジ基板 | |
| JPH0558262B2 (enrdf_load_stackoverflow) | ||
| JPH0239460A (ja) | 電子部品搭載用基板 |