JPS61188214U - - Google Patents
Info
- Publication number
- JPS61188214U JPS61188214U JP7186685U JP7186685U JPS61188214U JP S61188214 U JPS61188214 U JP S61188214U JP 7186685 U JP7186685 U JP 7186685U JP 7186685 U JP7186685 U JP 7186685U JP S61188214 U JPS61188214 U JP S61188214U
- Authority
- JP
- Japan
- Prior art keywords
- lead wires
- flexible
- insulated
- protected
- facing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
- Insulated Conductors (AREA)
- Communication Cables (AREA)
Description
第1図は本考案の一実施例を示す平面図、第2
図は第1図のA―A線断面図、第3図は本考案の
他の実施例を示す断面図である。第4図は従来の
フレキシブル基板の平面図、第5図は第4図のB
―B線拡大断面図である。
7……フレキシブル基板、9……リード線、1
0……絶縁被膜、11……シールド被膜、12…
…フレキシブル基板、13……リード線、14…
…絶縁被膜、15……シールド被膜。
Figure 1 is a plan view showing one embodiment of the present invention;
The figure is a sectional view taken along the line AA in FIG. 1, and FIG. 3 is a sectional view showing another embodiment of the present invention. Figure 4 is a plan view of a conventional flexible board, and Figure 5 is B of Figure 4.
- It is an enlarged cross-sectional view along line B. 7...Flexible board, 9...Lead wire, 1
0...Insulating coating, 11...Shield coating, 12...
...Flexible board, 13...Lead wire, 14...
...Insulating coating, 15...Shield coating.
Claims (1)
リード線を、フレキシブルな絶縁被膜で絶縁保護
したものに、前記リード線の配列面に対向して上
下方向から、リード線間を高周波シールドするフ
レキシブルなシールド被膜を被着形成したことを
特徴とする配線用フレキシブル基板。 Multiple flexible lead wires arranged on the same plane are insulated and protected with a flexible insulating coating, and a flexible shield that shields high frequency between the lead wires from above and below, facing the arrangement surface of the lead wires. A flexible substrate for wiring characterized by having a coating formed thereon.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7186685U JPS61188214U (en) | 1985-05-15 | 1985-05-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7186685U JPS61188214U (en) | 1985-05-15 | 1985-05-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61188214U true JPS61188214U (en) | 1986-11-22 |
Family
ID=30609741
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7186685U Pending JPS61188214U (en) | 1985-05-15 | 1985-05-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61188214U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004342394A (en) * | 2003-05-14 | 2004-12-02 | Hitachi Chem Co Ltd | Wiring member for transport airplane and its manufacturing method |
-
1985
- 1985-05-15 JP JP7186685U patent/JPS61188214U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004342394A (en) * | 2003-05-14 | 2004-12-02 | Hitachi Chem Co Ltd | Wiring member for transport airplane and its manufacturing method |
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