JPS61186236U - - Google Patents
Info
- Publication number
- JPS61186236U JPS61186236U JP7134985U JP7134985U JPS61186236U JP S61186236 U JPS61186236 U JP S61186236U JP 7134985 U JP7134985 U JP 7134985U JP 7134985 U JP7134985 U JP 7134985U JP S61186236 U JPS61186236 U JP S61186236U
- Authority
- JP
- Japan
- Prior art keywords
- groove
- utility
- sectional shape
- scope
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7134985U JPS61186236U (un) | 1985-05-14 | 1985-05-14 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7134985U JPS61186236U (un) | 1985-05-14 | 1985-05-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61186236U true JPS61186236U (un) | 1986-11-20 |
Family
ID=30608764
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7134985U Pending JPS61186236U (un) | 1985-05-14 | 1985-05-14 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61186236U (un) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100526837B1 (ko) * | 2000-04-27 | 2005-11-08 | 앰코 테크놀로지 코리아 주식회사 | 반도체패키지 |
JP2016213505A (ja) * | 2016-09-07 | 2016-12-15 | 日亜化学工業株式会社 | 発光装置用パッケージ成形体及びそれを用いた発光装置 |
-
1985
- 1985-05-14 JP JP7134985U patent/JPS61186236U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100526837B1 (ko) * | 2000-04-27 | 2005-11-08 | 앰코 테크놀로지 코리아 주식회사 | 반도체패키지 |
JP2016213505A (ja) * | 2016-09-07 | 2016-12-15 | 日亜化学工業株式会社 | 発光装置用パッケージ成形体及びそれを用いた発光装置 |