JPH03124653U - - Google Patents
Info
- Publication number
- JPH03124653U JPH03124653U JP3364690U JP3364690U JPH03124653U JP H03124653 U JPH03124653 U JP H03124653U JP 3364690 U JP3364690 U JP 3364690U JP 3364690 U JP3364690 U JP 3364690U JP H03124653 U JPH03124653 U JP H03124653U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- mounting part
- element mounting
- lead frame
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 239000000565 sealant Substances 0.000 claims 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3364690U JPH03124653U (un) | 1990-03-30 | 1990-03-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3364690U JPH03124653U (un) | 1990-03-30 | 1990-03-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03124653U true JPH03124653U (un) | 1991-12-17 |
Family
ID=31537474
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3364690U Pending JPH03124653U (un) | 1990-03-30 | 1990-03-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03124653U (un) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015088731A (ja) * | 2013-09-25 | 2015-05-07 | 株式会社大真空 | リードタイプの電子部品 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63175448A (ja) * | 1987-01-16 | 1988-07-19 | Hitachi Ltd | 半導体装置 |
-
1990
- 1990-03-30 JP JP3364690U patent/JPH03124653U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63175448A (ja) * | 1987-01-16 | 1988-07-19 | Hitachi Ltd | 半導体装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015088731A (ja) * | 2013-09-25 | 2015-05-07 | 株式会社大真空 | リードタイプの電子部品 |