JPS611859U - 投光用発光ダイオ−ド - Google Patents

投光用発光ダイオ−ド

Info

Publication number
JPS611859U
JPS611859U JP1984086522U JP8652284U JPS611859U JP S611859 U JPS611859 U JP S611859U JP 1984086522 U JP1984086522 U JP 1984086522U JP 8652284 U JP8652284 U JP 8652284U JP S611859 U JPS611859 U JP S611859U
Authority
JP
Japan
Prior art keywords
light
lead wire
emitting diode
light emitting
lighting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984086522U
Other languages
English (en)
Inventor
啓一 蓮仏
Original Assignee
三洋電機株式会社
鳥取三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社, 鳥取三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP1984086522U priority Critical patent/JPS611859U/ja
Publication of JPS611859U publication Critical patent/JPS611859U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Length Measuring Devices By Optical Means (AREA)
  • Measurement Of Optical Distance (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図ａ， ｂは本考案実施例の投光用発光ダイオード
の正面図ａと側面断面図ｂ１第２図ａ，はリード線の状
態を説明するリード線側面図である。 １，１′・・・・・・リード線、２，２′・・・・・・
舌片、３，３′・・・・・・突出部、４・・・・・・発
光素子、６・・・・・・透明樹脂。

Claims (1)

    【実用新案登録請求の範囲】
  1. 略平行に配置され、互いに略平行となる内側に延在した
    舌片を有するリード線と、一方のリード線の舌片の側面
    に載置され他方のリード線に配線された発光素子と、リ
    ード線の延在方向に投光面を有し発光素子及びリード線
    先端部を覆う透り樹脂とを具備した投光用発光ダイオー
    ドにおいて、配線の施こされたリード線は舌片の位置よ
    り先端に突出部を有し、透明樹脂の中心線よりずれた位
    置に配置されている事を特徴とする投光用発光ダイオー
    ド。
JP1984086522U 1984-06-11 1984-06-11 投光用発光ダイオ−ド Pending JPS611859U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984086522U JPS611859U (ja) 1984-06-11 1984-06-11 投光用発光ダイオ−ド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984086522U JPS611859U (ja) 1984-06-11 1984-06-11 投光用発光ダイオ−ド

Publications (1)

Publication Number Publication Date
JPS611859U true JPS611859U (ja) 1986-01-08

Family

ID=30637912

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984086522U Pending JPS611859U (ja) 1984-06-11 1984-06-11 投光用発光ダイオ−ド

Country Status (1)

Country Link
JP (1) JPS611859U (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5271179A (en) * 1975-12-11 1977-06-14 Toshiba Corp Semiconductor device
JPS588736B2 (ja) * 1979-02-28 1983-02-17 株式会社東芝 ガス抽出装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5271179A (en) * 1975-12-11 1977-06-14 Toshiba Corp Semiconductor device
JPS588736B2 (ja) * 1979-02-28 1983-02-17 株式会社東芝 ガス抽出装置

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