JPS6063962U - 自動挿入用発光ダイオ−ドランプ - Google Patents

自動挿入用発光ダイオ−ドランプ

Info

Publication number
JPS6063962U
JPS6063962U JP15569083U JP15569083U JPS6063962U JP S6063962 U JPS6063962 U JP S6063962U JP 15569083 U JP15569083 U JP 15569083U JP 15569083 U JP15569083 U JP 15569083U JP S6063962 U JPS6063962 U JP S6063962U
Authority
JP
Japan
Prior art keywords
emitting diode
diode lamp
light emitting
automatic insertion
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15569083U
Other languages
English (en)
Inventor
隆 山岡
梅崎　昌昭
上橋　幸春
Original Assignee
三洋電機株式会社
鳥取三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社, 鳥取三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP15569083U priority Critical patent/JPS6063962U/ja
Publication of JPS6063962U publication Critical patent/JPS6063962U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図ａは従来の部品の平面図、ｂは従来技術を発光ダ
イオードランプに適用した時の平面図、第２図は本考案
実施例の自動挿入用の発光ダイオードランプの平面図、
第３図は本考案に適用される発光ダイオードランプの例
の平面図である。 １．１・・・・・・発光ダイオードランプ、２，２・・
・・・・リード線、３，３・・・・・・発光ダイオード
、４，４・・・・・・表示用モールド、５，６・・・・
・・テープ、７，７・・・・・・送り穴。

Claims (1)

    【実用新案登録請求の範囲】
  1. リード線の略先端部に表示用モールドを有する発光ダイ
    オードランプと、その発光ダイオードランプの表示面か
    ら所定位置離れたリード線を挾持するテープとを具備し
    た事を特徴とする自動挿入用発光ダイオードランプ。
JP15569083U 1983-10-06 1983-10-06 自動挿入用発光ダイオ−ドランプ Pending JPS6063962U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15569083U JPS6063962U (ja) 1983-10-06 1983-10-06 自動挿入用発光ダイオ−ドランプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15569083U JPS6063962U (ja) 1983-10-06 1983-10-06 自動挿入用発光ダイオ−ドランプ

Publications (1)

Publication Number Publication Date
JPS6063962U true JPS6063962U (ja) 1985-05-07

Family

ID=30343778

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15569083U Pending JPS6063962U (ja) 1983-10-06 1983-10-06 自動挿入用発光ダイオ−ドランプ

Country Status (1)

Country Link
JP (1) JPS6063962U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6212969U (ja) * 1985-07-08 1987-01-26

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6212969U (ja) * 1985-07-08 1987-01-26

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