JPS59181487U - 発光ダイオ−ド表示器 - Google Patents

発光ダイオ−ド表示器

Info

Publication number
JPS59181487U
JPS59181487U JP7632683U JP7632683U JPS59181487U JP S59181487 U JPS59181487 U JP S59181487U JP 7632683 U JP7632683 U JP 7632683U JP 7632683 U JP7632683 U JP 7632683U JP S59181487 U JPS59181487 U JP S59181487U
Authority
JP
Japan
Prior art keywords
emitting diode
light emitting
diode display
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7632683U
Other languages
English (en)
Inventor
鷲見　明孝
Original Assignee
三洋電機株式会社
鳥取三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社, 鳥取三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP7632683U priority Critical patent/JPS59181487U/ja
Publication of JPS59181487U publication Critical patent/JPS59181487U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の表示器の断面図、第２図は本考案実施例
の発光ダイオード表示器の断面図である。 １・・・プリント基板、２．２・・・発光ダイオード、
３．６・・・載置部、４・・・スルホール、５・・・遮
光枠、６・・・固着爪。

Claims (1)

    【実用新案登録請求の範囲】
  1. 発光ダイオードの載置部と載置部の近傍のスルホールと
    を有したプリント基板と、載置部に載置固着された発光
    ダイオードと、発光ダイオードを覆うようプリント基板
    上に配置されスルホールに挿入する固着爪を有した遮光
    枠とを具備した事を特徴とする発光ダイオード表示器。
JP7632683U 1983-05-20 1983-05-20 発光ダイオ−ド表示器 Pending JPS59181487U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7632683U JPS59181487U (ja) 1983-05-20 1983-05-20 発光ダイオ−ド表示器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7632683U JPS59181487U (ja) 1983-05-20 1983-05-20 発光ダイオ−ド表示器

Publications (1)

Publication Number Publication Date
JPS59181487U true JPS59181487U (ja) 1984-12-04

Family

ID=30206373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7632683U Pending JPS59181487U (ja) 1983-05-20 1983-05-20 発光ダイオ−ド表示器

Country Status (1)

Country Link
JP (1) JPS59181487U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006190597A (ja) * 2005-01-07 2006-07-20 Rinnai Corp 点灯装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006190597A (ja) * 2005-01-07 2006-07-20 Rinnai Corp 点灯装置

Similar Documents

Publication Publication Date Title
JPS59134178U (ja) 発光素子の灯蓋
JPS59181487U (ja) 発光ダイオ−ド表示器
JPS5834301U (ja) 車輛用表示灯
JPS6016569U (ja) 発光ダイオ−ド保持機構
JPS59177952U (ja) Ｌｅｄホルダ
JPS5917486U (ja) 表示パネル
JPS5948066U (ja) Ｌｅｄホルダ−
JPS58166683U (ja) 発光ダイオ−ド表示器
JPS59114717U (ja) グロメツト
JPS59158182U (ja) 発光ダイオ−ド表示装置
JPS5893979U (ja) 発光ダイオ−ドの位置決め構造
JPS59150119U (ja) ランプ内蔵形機器
JPS59120499U (ja) 照明装置
JPS5874355U (ja) 発光ダイオ−ドの位置出し機構
JPS59121689U (ja) 電子機器の発光表示装置
JPS5936266U (ja) 発光ダイオ−ド取付用スペ−サ
JPS59145070U (ja) 発光素子取付装置
JPS6098876U (ja) 表示装置
JPS5869993U (ja) 表示素子の取付装置
JPS60165993U (ja) 表示装置
JPS58159762U (ja) 発光ダイオ−ド取付装置
JPS59166282U (ja) 表示装置
JPS60173986U (ja) プリント基板
JPS5936300U (ja) 発光ダイオ−ド取り付けブロツク
JPS58150853U (ja) 発光素子保持具