JPS61185997A - Soldering - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to an improvement in a soldering method in which a printed wiring board on which electronic components such as ICs and connectors are mounted is immersed in a static solder bath for soldering. .

[Technical Background of the Invention] Conventionally, this type of soldering is carried out by, for example, as shown in FIG. immersed in the melted solder 5 of
For example, after a predetermined period of time has elapsed, the printed wiring board 3 is
As shown in 1-A2.81-82, Cl-C2, each lead wire 6.7 of the electronic component 1.2 is soldered by pulling it up approximately parallel to its one end. ing. In this case, the electronic component 1.2 has a directionality in which a solder short circuit (solder bridge) occurs depending on the spacing between the lead wires 6.7.
Electronic component 1 has a narrow pitch interval of approximately 1.78 mm.
As shown in the figure, since the distance between the solder lands 8 is as narrow as 0.58, the melted solder 5 increases as the printed wiring board 3 is pulled up.
The X
axially arranged. On the other hand, in the electronic component 2 where the lead wires 7 have a wide interval of about 2.54 mm, for example, the distance between the solder lands 9 is as wide as 0.9 mm, as shown in FIG. They are arranged in the Y-axis direction so that no solder tension occurs and molten solder 5 hardly accumulates, so that solder short circuits are effectively prevented from occurring.

[Problems in the Background Art] However, in the soldering method described above, when a narrow electronic component 1 with 6 full lead wires is mounted on the printed wiring board 3 in the Y-axis direction, the printed wiring board 3 cannot be pulled up due to its structure. At this time, the excess melted solder 5 between the lead wires 6 does not separate and causes a solder short circuit, so the first design condition is that the electronic components 1.2
direction had to be considered. This is a major constraint on the design of the printed wiring board 3.
This made the production process extremely complicated.

[Objective of the Invention] This invention was made in view of the above circumstances, and it is an object of the present invention to contribute to improving manufacturability by reliably preventing solder short circuits without being concerned about the orientation of mounted electronic components. The purpose of this is to provide a method for obtaining soldering.

[Summary of the Invention] That is, the present invention is capable of mounting a printed wiring board by pulling up the printed wiring board immersed in molten solder in a static solder tank at an angle of about 30 degrees with respect to one end of the printed wiring board. This achieves the intended purpose by reliably preventing solder short circuits without worrying about the orientation of electronic components.

[Embodiments of the Invention] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. That is, as shown in FIG.
First, a printed wiring board 12 having electronic components 10° 11 mounted in the axial and y-axis directions is heated to melted solder 14 in a static solder tank 13.
Using an immersion drive mechanism (not shown), the liquid is lowered, for example, in an up-and-down manner, and immersed. Next, the printed wiring board 12 has an angle of about 30'' with respect to one end thereof, and is attached to DI-02, El-F2, Fl-F2, G1-G2, H in the figure.
It is lifted up and pulled up according to the pull-up line shown at l-H2.

Therefore, each electronic component io on the printed wiring board 12,
As shown in FIG. 2, the molten solder 14 adhering to each lead wire 15, 16 is moved in the direction of the arrow 2, and the excess molten solder 14 is removed, and the lead wires 15, 161
11, good soldering without the occurrence of solder short circuits is achieved.

As described above, the soldering method is such that the printed wiring board 12 is immersed in the molten solder 14 of the static solder bath 13, and then pulled up at an angle of about 30'' with respect to one end of the printed wiring board 12. As a result, the molten solder 14 adhering to the lead wires 15 and 16 of the electronic components 10 and 11 mounted in the X-axis and Y-axis directions is transferred in the Z direction, and the excess molten solder 14 is effectively removed. Printed wiring board 1
Since there are no constraints on the directionality of the electronic components io and z in the manufacturing design of 2, this can contribute to improving the manufacturability as much as possible.In addition, according to this, solder short circuits can be reliably prevented. Therefore, soldering can effectively contribute to improving the manufacturability of the printed wiring board 12, since it can eliminate the troublesome work of removing solder short circuits later.

Furthermore, although the present invention has been described in the above embodiment in which the printed wiring board 12 is immersed in an up-and-down motion, the present invention is not limited to this, and the printed wiring board 12 is immersed in the molten solder 14 of the static solder tank 13.
It is also applicable to a method of immersion while dragging.

It goes without saying that the present invention is not limited to the above embodiments, and that various modifications can be made without departing from the spirit of the invention.

[Effects of the Invention] As detailed above, according to the present invention, it is possible to reliably prevent solder short circuits without worrying about the orientation of electronic components to be mounted, thereby contributing to improvement in manufacturability. Such soldering can provide a method.

[Brief explanation of drawings]

FIG. 1 is an operational explanatory diagram for explaining the soldering method according to an embodiment of the present invention, FIG. 2 is a detailed diagram for explaining the main part details of FIG. 1, and FIG. The figure is an operation explanatory diagram shown to explain the conventional soldering method, and Figures 4 and 5 are respectively shown to explain the directionality of solder short circuits in electronic components caused by the conventional soldering method. FIG. 10.11...Electronic components, 12...Printed wiring board,
13...Static solder bath, 14. Axial melting solder, 15.16
···Lead. Applicant's agent Patent attorney Takehiko Suzue No. 111 112

Claims (1)

[Claims] In a soldering method in which a printed wiring board on which electronic components are mounted is immersed in molten solder in a static solder tank and soldered, the printed wiring board is immersed in molten solder in the static solder tank. A soldering method characterized by pulling up at an angle of approximately 30° to one end of the soldering method.