JPS61184808A - Manufacture of electronic component parts - Google Patents
Manufacture of electronic component partsInfo
- Publication number
- JPS61184808A JPS61184808A JP2541085A JP2541085A JPS61184808A JP S61184808 A JPS61184808 A JP S61184808A JP 2541085 A JP2541085 A JP 2541085A JP 2541085 A JP2541085 A JP 2541085A JP S61184808 A JPS61184808 A JP S61184808A
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- hole
- electronic component
- bent
- ferrite bead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000000853 adhesive Substances 0.000 claims abstract description 14
- 230000001070 adhesive effect Effects 0.000 claims abstract description 14
- 238000005452 bending Methods 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims abstract description 9
- 239000011324 bead Substances 0.000 abstract description 22
- 229910000859 α-Fe Inorganic materials 0.000 abstract description 19
- 230000002123 temporal effect Effects 0.000 abstract 1
- 239000007788 liquid Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 210000004209 hair Anatomy 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、筒状の電子部品素体の貫通孔にリード線を挿
通して、このリード線を電子部品素体に接着剤で固定す
る電子部品の製造方法に関する。Detailed Description of the Invention (Field of Industrial Application) The present invention involves inserting a lead wire into a through hole of a cylindrical electronic component body and fixing the lead wire to the electronic component body with an adhesive. This invention relates to a method for manufacturing electronic components.
（従来技術）
従来の電子部品、たとえば第４図に示すようなインダク
タンス素子を製造するには、まずフェライトビーズ１と
、第５図に示すような、フェライトビーズ１の貫通孔２
内径りよりも大きい屈曲幅ｄを有する屈曲部３の形成さ
れた所定の長さのリード線４を用意する。(Prior Art) To manufacture a conventional electronic component, for example an inductance element as shown in FIG. 4, first a ferrite bead 1 and a through hole 2 of the ferrite bead 1 as shown in FIG.
A lead wire 4 of a predetermined length is prepared with a bent portion 3 having a bending width d larger than the inner diameter.
次に、このリード線４の屈曲部３にディスペンサ等によ
り、所定の粘性を有する液状の接着剤（図示せず。）を
塗布した後、この屈曲部３の形成されたリード線４を、
フェライトビーズ１の貫通孔２の一端開口５から挿通し
、屈曲部３を圧入する。このようにして第４図に示すよ
うな従来のインダクタンス素子が得られる。Next, after applying a liquid adhesive (not shown) having a predetermined viscosity to the bent portion 3 of the lead wire 4 using a dispenser or the like, the lead wire 4 with the bent portion 3 formed thereon is
The ferrite bead 1 is inserted through the opening 5 at one end of the through hole 2, and the bent portion 3 is press-fitted. In this way, a conventional inductance element as shown in FIG. 4 is obtained.
ところが、このような方法になるインダクタンス素子は
、リード＠４に形成された屈曲部３をフェライトビーズ
１の貫通孔２に圧入するので、第６図に示すように、こ
の屈曲部３の両側のリード線に、フェライトビーズ１の
軸線に対して八方向にθ１の字曲りがそれぞれ生じると
いう不都合があり、別途、矯正工程を設けて、字曲りを
修正する必要のあるものである。However, in the inductance element manufactured using this method, the bent part 3 formed on the lead @4 is press-fitted into the through hole 2 of the ferrite bead 1, so as shown in FIG. There is an inconvenience that the lead wires are bent in the shape of θ1 in eight directions with respect to the axis of the ferrite bead 1, and it is necessary to provide a separate straightening process to correct the bends.
（発明の目的）
本発明は、このような点に鑑みてなされたもので、筒状
の電子部品素体の貫通孔にリード線を挿通して固定して
なる電子部品において、このり一ド線における字曲りの
発生を抑制し、矯正工程の削減を目的とするものである
。(Object of the Invention) The present invention has been made in view of the above points, and is an electronic component in which a lead wire is inserted into a through hole of a cylindrical electronic component body and fixed therein. The purpose is to suppress the occurrence of curved lines and reduce the number of straightening processes.
（発明の概要）
筒状の電子部品素体の貫通孔内径よりも大きな幅の屈曲
して形成された係上部を有し、この係止部の両側を、電
子部品素体の貫通孔にその係止部を挿入したときに生じ
る字曲りの方向とは逆方向にあらかじめ折曲してなるリ
ード線を、前記貫通孔に圧入状に挿通するとともに、接
着剤で電子部品素体に固定することを特徴とするもので
ある。(Summary of the invention) It has a curved locking part with a width larger than the inner diameter of the through-hole of the cylindrical electronic component body, and both sides of the locking part are connected to the through-hole of the electronic component body. A lead wire that has been bent in advance in a direction opposite to the direction of the bend that occurs when the locking part is inserted is inserted into the through hole in a press-fitted manner, and is fixed to the electronic component element body with adhesive. It is characterized by:
（実施例）
以下に本発明の一実施例を図面を参照して詳細に説明す
る。(Example) An example of the present invention will be described below in detail with reference to the drawings.
本発明を第４図と同様の機能を有する電子部品に適用し
た実施例を第１図ないし第３図に示す。An embodiment in which the present invention is applied to an electronic component having the same function as that shown in FIG. 4 is shown in FIGS. 1 to 3.
まず、第２図に示すように、軸心部に径がＤの貫通孔１
２を有する長さが８の筒状の電子部品素体としてのフェ
ライトビーズ１１を用意する。First, as shown in FIG.
A ferrite bead 11 as a cylindrical electronic component element having a length of 2 and 8 is prepared.
同様に、第３図に示すように、径がｄ′のり一ド線１３
を用意する。このリード線１３には、そのほぼ中央部に
、フェライトビーズ１１の長さＢ以下の長さｂ （≦Ｂ
）にわたって、上記フェライトビーズ１１の貫通孔１２
の径りよりも大きな屈曲幅ｄを有する屈曲部１４を形成
するとともに、この屈曲部１４の両側のリード線部１５
．１６を図面のＡ′方向にα０折曲する。つまり、この
折曲角度αは、主にフェライトビーズ１１の貫通孔１２
内径りと、リード線１３の屈曲幅ｄおよびリード線１３
の物性値等に基づいて算出されたもので、リード線１３
の屈曲部１４をフェライトビーズ１１の貫通孔１２内に
圧入して仮止めした時に生じる前記リード線部１５．１
６の、Ａ′方向とは逆方向であるへ方向への字曲りによ
って、丁度ビーズコア１１の軸線方向となるような値に
設定される。また、字曲りの方向Ａおよび折曲方向Ａ′
ｙは、説明の便宜上図のような方向を示しているが、Ａ
は、電子部品を製造するに当って生じる字曲りの方向を
、Ａ′は、この字曲りを打ち消して伸線状態となるよう
にあらかじめ折曲しておく方向を示すものであり、現実
に則してそれぞれ変化するものである。Similarly, as shown in FIG.
Prepare. This lead wire 13 has a length b (≦B
), the through hole 12 of the ferrite bead 11
A bent portion 14 having a bending width d larger than the diameter of the bent portion 14 is formed, and lead wire portions 15 on both sides of this bent portion 14
．． 16 is folded at α0 in the A' direction of the drawing. In other words, this bending angle α mainly depends on the through hole 12 of the ferrite bead 11.
The inner diameter, the bending width d of the lead wire 13, and the lead wire 13
It is calculated based on the physical property values of lead wire 13.
The lead wire portion 15.1 is formed when the bent portion 14 of the ferrite bead 11 is press-fitted into the through hole 12 and temporarily fixed.
6 in the direction opposite to the A' direction, the value is set to be exactly in the axial direction of the bead core 11. In addition, the direction of bending A and the bending direction A'y are shown as shown in the figure for convenience of explanation.
A' indicates the direction of bending that occurs when manufacturing electronic components, and A' indicates the direction in which the wire is bent in advance to cancel out the bend and become a drawn wire. and each changes.
ここでは図示していないが、このようにリード線１３に
形成された屈曲部１４には、ディスペンサ等によって所
定の粘性を有する液状の接着剤が塗布される。この接着
剤の塗布量は、フェライトビーズ１１の貫通孔１２の内
壁とリード線１３との間に充填される量を越えないこと
が望ましい。Although not shown here, a liquid adhesive having a predetermined viscosity is applied to the bent portion 14 formed in the lead wire 13 using a dispenser or the like. It is desirable that the amount of adhesive applied does not exceed the amount filled between the inner wall of the through hole 12 of the ferrite bead 11 and the lead wire 13.
以上のようにして屈曲部１４に接着剤が塗布されたリー
ド線１３を、フェライトビーズ１１の貫通孔１２に、そ
の一端開口１７より挿通し、この屈曲部１４を圧入して
仮止めを行うと、この時にリード線１３に生じるへ方向
への字曲りによって、第１図に示すように、あらかじめ
Ａ′方向へ所定の角度αだけ折曲されていたリード線部
１５．１６は丁度、ビーズコア１１の軸線方向となり、
字曲りのないインダクタンス素子を得る。The lead wire 13, whose bent portion 14 is coated with adhesive as described above, is inserted into the through hole 12 of the ferrite bead 11 through the opening 17 at one end, and the bent portion 14 is press-fitted to temporarily secure the lead wire 13. At this time, due to the bending of the lead wire 13 in the direction to the left, the lead wire portions 15 and 16, which had been bent in advance by a predetermined angle α in the A' direction, are bent exactly at the bead core 11, as shown in FIG. The axis direction is
To obtain an inductance element without bending.
ところで、フェライトビーズ１１の貫通孔１２の径りと
リード線１３の径ｄ′の比率は、フェライトビーズ１１
の貫通孔１２の内壁とリード＄１１３との間に形成され
る貫通孔１２の一端開口１７から他端開口１８に通じる
毛細間隙にて、少なくとも液状の接着剤が毛細管現象を
起こすような値とすることが望ましい。By the way, the ratio between the diameter of the through hole 12 of the ferrite bead 11 and the diameter d' of the lead wire 13 is
The value is such that at least the liquid adhesive causes a capillary phenomenon in the capillary gap leading from the opening 17 at one end of the through hole 12 to the opening 18 at the other end, which is formed between the inner wall of the through hole 12 and the lead 113. It is desirable to do so.
この毛細管現象を利用して短時間で接着剤が貫通孔１２
内に完全充填した後、この接着剤を硬化させれば、フェ
ライトビーズ１１はリード線１３の屈曲部１４に固定さ
れる。Utilizing this capillary phenomenon, the adhesive can be applied to the through hole 12 in a short time.
After the adhesive is completely filled, the ferrite bead 11 is fixed to the bent portion 14 of the lead wire 13 by curing the adhesive.
なお、本発明の電子部品の製造方法は、上記実施例のも
のに限定されるものではなく、要旨を変更しない範囲で
適宜変更しうることはいうまでもない。It goes without saying that the method of manufacturing an electronic component according to the present invention is not limited to that of the above-mentioned embodiments, and can be modified as appropriate without changing the gist.
たとえば、リード線１３に形成される係止部の形状は、
上記実施例のような屈曲部のものに限定するものではな
く、らせん形等の他の形状のものであってもよい。また
、上記実施例のような屈曲部のものを用いる場合には、
上記実施例においては、山の数が３つのものを用いてい
るが、これに限定するものではなく、それ以上のもので
あればいくつでもよい。For example, the shape of the locking part formed on the lead wire 13 is
It is not limited to the bent part as in the above embodiment, but may have other shapes such as a spiral shape. In addition, when using a bent part as in the above embodiment,
In the above embodiment, the number of peaks is three, but the number of peaks is not limited to three, and any number of peaks may be used as long as the number is more than three.
接着剤は、フェライトビーズ１１の貫通孔１２内にリー
ド線１３の屈曲部１４を圧入した後、フェライトご一ズ
１１の一端開口１７から前記毛１ＢＩＩＩ隙に注入する
ようにしてもよい。The adhesive may be injected into the gap between the hairs 1BIII through the opening 17 at one end of the ferrite bead 11 after the bent portion 14 of the lead wire 13 is press-fitted into the through hole 12 of the ferrite bead 11.
本発明は、電子部品素体にリード線を接着剤で固定する
タイプの電子部品に広く適用できる。The present invention can be widely applied to electronic components of the type in which lead wires are fixed to an electronic component body with an adhesive.
（発明の効果）
本発明の電子部品の製造方法は、以上説明したように、
筒状の電子部品素体の貫通孔に挿通されるリード線に、
この貫通孔内径よりも大きな幅を有する係上部を形成す
るとともに、その両側をあらかじめ折曲するようにした
もので、リード線を圧入状に挿通した後における足囲り
の発生を抑制し、矯正工程を削減する等の効果を奏する
。(Effects of the Invention) As explained above, the method for manufacturing an electronic component of the present invention includes the following steps:
The lead wire is inserted into the through hole of the cylindrical electronic component body.
In addition to forming a locking part with a width larger than the inner diameter of this through hole, both sides of the locking part are bent in advance to suppress the formation of a foot ring after the lead wire is inserted in a press-fit shape, and to correct the problem. This has the effect of reducing the number of processes.
第１図、第２図および第３図は、夫々本発明に係る電子
部品の製造方法の説明図、第４図、第５図および第６図
は、従来の電子部品の製造方法の説明図である。
１１−フェライトビーズ、１２−貫通孔、１３−リード
線、１４−屈曲部、１５．１６−リード線部、１７一一
端開口、１８−他端開口。1, 2, and 3 are explanatory diagrams of a method for manufacturing an electronic component according to the present invention, and FIG. 4, FIG. 5, and FIG. 6 are explanatory diagrams of a conventional method for manufacturing an electronic component. It is. 11-ferrite bead, 12-through hole, 13-lead wire, 14-bent portion, 15.16-lead wire portion, 17 one end opening, 18-other end opening.
Claims (1)
してなる電子部品の製造方法であって、（ａ）、リード
線の、電子部品素体の貫通孔内に位置する部分に、その
貫通孔内径よりも大きな幅を有する屈曲してなる係止部
を形成し、この係止部の両側を所定の角度で折曲する工
程。 （ｂ）、係止部が形成され、その両側が折曲されたリー
ド線を、電子部品素体の貫通孔内に圧入状に挿通する工
程。 （ｃ）、リード線の挿通された電子部品素体の貫通孔内
に接着剤を充填する工程。 を含んでなる、電子部品の製造方法。[Scope of Claims] A method for manufacturing an electronic component in which a lead wire is inserted and fixed into a through hole of a cylindrical electronic component body, comprising: (a) passing the lead wire through the electronic component body; A step of forming a bent locking portion having a width larger than the inner diameter of the through hole in a portion located inside the hole, and bending both sides of the locking portion at a predetermined angle. (b) A step of inserting the lead wire with the locking portion formed and bent on both sides into the through hole of the electronic component body in a press-fitting manner. (c) Filling the through hole of the electronic component body into which the lead wire is inserted with adhesive. A method of manufacturing an electronic component, comprising:
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2541085A JPS61184808A (en) | 1985-02-12 | 1985-02-12 | Manufacture of electronic component parts |
| US06/762,963 US4803777A (en) | 1984-08-07 | 1985-08-06 | Method of manufacturing an electric component with a lead wire secured in a through hole |
| DE19853528381 DE3528381A1 (en) | 1984-08-07 | 1985-08-07 | ELECTRICAL COMPONENT WITH CONNECTING WIRE AND METHOD FOR THE PRODUCTION THEREOF |
| US07/206,114 US4823103A (en) | 1984-08-07 | 1988-06-13 | Electrical component having a lead wire secured in a through hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2541085A JPS61184808A (en) | 1985-02-12 | 1985-02-12 | Manufacture of electronic component parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61184808A true JPS61184808A (en) | 1986-08-18 |
| JPH0438128B2 JPH0438128B2 (en) | 1992-06-23 |
Family
ID=12165149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2541085A Granted JPS61184808A (en) | 1984-08-07 | 1985-02-12 | Manufacture of electronic component parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61184808A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6082103A (en) * | 1997-08-06 | 2000-07-04 | Toyota Jidosha Kabushiki Kaisha | Exhaust manifold, for internal combustion engine, for improving durability of oxygen sensor at merging portion of exhaust manifold |
| JP2010153587A (en) * | 2008-12-25 | 2010-07-08 | Toshiba Corp | Inductance element, switching power supply employing the same, and manufacturing method of the same |
| US8844673B2 (en) | 2010-02-01 | 2014-09-30 | Futaba Industrial Co., Ltd. | Muffler for internal combustion engine |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57181110A (en) * | 1981-04-30 | 1982-11-08 | Murata Mfg Co Ltd | Bead inductor and its manufacture |
| JPS59125816U (en) * | 1983-02-10 | 1984-08-24 | 東北金属工業株式会社 | inductance element |
-
1985
- 1985-02-12 JP JP2541085A patent/JPS61184808A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57181110A (en) * | 1981-04-30 | 1982-11-08 | Murata Mfg Co Ltd | Bead inductor and its manufacture |
| JPS59125816U (en) * | 1983-02-10 | 1984-08-24 | 東北金属工業株式会社 | inductance element |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6082103A (en) * | 1997-08-06 | 2000-07-04 | Toyota Jidosha Kabushiki Kaisha | Exhaust manifold, for internal combustion engine, for improving durability of oxygen sensor at merging portion of exhaust manifold |
| JP2010153587A (en) * | 2008-12-25 | 2010-07-08 | Toshiba Corp | Inductance element, switching power supply employing the same, and manufacturing method of the same |
| US8844673B2 (en) | 2010-02-01 | 2014-09-30 | Futaba Industrial Co., Ltd. | Muffler for internal combustion engine |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0438128B2 (en) | 1992-06-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |