JPS61183934A - Manufacture of network electronic component - Google Patents

Abstract

PURPOSE:To contrive to improve the mass productivity by preventing the movement of a substrate in the cavity during extrusion molding, by a method wherein a substrate is provided with supporting plats besides lead terminals, and the plates are held in a metal mold by utilizing these; after cooling and solidification of melt resin, the supporting plates are cut off from the exterior. CONSTITUTION:On a ceramic substrate 1, resistance films 2, electrodes 3, 4, and dummy terminals 8 are printed at required intervals. Resistance films are set by trimming each resistance film 2; then, a plurality of lead terminals 5 molded integrally to a metallic lead frame 6 are connected to the electrodes 3, 4 with solder, and each projection of a supporting plate 9 having the same shape as that of the lead frame 6 is connected to a dummy terminal 8 with solder. Setting these in a metal molder, a melt resin is extruded and cast into the cavity. At this time, the lead frame 6 and the supporting plate 9 including the lead terminals 5 are pressed and held between the moving mold and the fixed mold of the metal molder; therefore, the movement of the substrate 1 in the cavity under the extrusion pressure of resin does not occur. After an exterior 7 is molded by cooling and solidification, unnecessary parts are cut off, thus obtaining an SiP type network resistor.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention provides a method for integrating and compounding a plurality of electronic elements such as resistive elements and capacitor elements on a substrate, and combining them into a tG.
It relates to a method for manufacturing a network electronic component that is insulated and sealed with an exterior body made of & fat, and particularly relates to a method for manufacturing a network electronic component that is insulated and sealed with an exterior body made of oil, and particularly for the SIP type (Single -in -1ine P
The present invention relates to a method for manufacturing network electronic components called "ackage").

[Background of the invention]

Network electronic components are ICs of recent electronic circuits.
The need for electronic devices is increasing rapidly as electronic devices become smaller. For this reason, methods for mass-producing such network electronic components with high quality are being researched in various fields.

FIG. 4 is a process diagram showing an example of a conventional method for manufacturing network electronic components, in which 1 is a board, 2
3 is a resistive film, 3 is an atX pole, 4 is an electrode, 5 is a lead terminal, 6 is a lead frame, and 7 is an exterior body.

First, as shown in FIG. to a specified width.

Next, after trimming each resistor H2 and setting the resistance value, as shown in FIG. Both electrodes are connected with 3.4 VC solder, and these are set in a mold device & (not shown), and a molten resin is injected into a cavity (indicated by a broken line) formed around the substrate 1. At this time, the lead frame 6 including the lead terminals 5 is pressed and held by a movable mold and a fixed mold (none of which are shown) of the mold apparatus, and acts as a positioning river for the substrate 1 with respect to the cavity bVc.

Thereafter, the bath-molten resin is cooled and solidified in a mold apparatus, and as shown in FIG. Finally, the lead frame 6 is cut off at the connection part with the lead terminals 5 to obtain a SIP type network resistor with a plurality of lead terminals 5 arranged in a row at the lower end of the exterior body 7, as shown in FIG. .

In such a conventional example, the sealing exterior body 7 can be injection molded using a mold, and generally the injection molding method has a short processing cycle and can produce a large number of pieces.
[Suitable for production.

However, since it is an I# construction in which the board 1 is pressed and held in a predetermined position in the mold using the lead terminal 5 and lead 7 frame 6 connected to one side of the board 1, when the molten resin is injected, the The substrate 1 tends to move within the cavity due to the injection pressure of the resin, and as a result, a defect occurs in which the substrate 1 is displaced within the exterior body 7, as shown in the side view of FIG.

[Purpose of the invention]

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing network electronic components that eliminates the drawbacks of the prior art, improves product yield, and is suitable for food production.

[A essential point of the invention]

In order to achieve this objective, the present invention provides a support plate in addition to the lead terminals on the substrate, and utilizes these support plates and lead terminals to firmly hold the substrate in the mold. The present invention is characterized in that after the resin is cooled and solidified, the support plate is separated from the exterior body to manufacture a SIP type network electronic component.

[Embodiments of the invention]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a process diagram showing an embodiment of the method for manufacturing network electronic components according to the present invention, in which 8 is a dummy terminal;
9 is a support plate, and parts corresponding to those in FIG. 4 are given the same reference numerals.

First, as shown in FIG. 1 (α), the ceramic base vf
A number of resistive films 2, both electrodes 3.4 connected thereto, and double dummy terminals 8 which are not electrically connected to the resistive film 2 are printed on the resistive film 2 at predetermined intervals.

Next, after trimming each resistive film 2 and setting the resistance value, as shown in the first frame (b), the plurality of lead terminals 5 integrally formed with the metal lead frame 6 VC are connected to the Both main parts 3 and 4 are connected by soldering, and each protrusion of a support plate 90 having the same shape as the lead frame 6 is soldered to the dummy terminal 8. Thereafter, these are set in a mold device (not shown), and molten resin is injected into a cavity (indicated by a broken line) formed around the base pile. At this time, I.J.
- Since the lead frame 6 including the lead terminal 5 and the support plate 9 are pressed and held between the movable mold and the fixed mold of the mold device, the board 1
Since both sides of the plate 1 are supported within the mold apparatus, the problem that the plate 1 moves within the cavity due to the injection pressure of the resin does not occur.

The molten MffW injected and injected in this way is cooled and solidified in the mold device, and as shown in FIG. 1(e),
The outer 4 to the body 7 in which the leads 71 including the lead terminals 5 and the support plate 9 are formed protruding from opposite surfaces are l1i12.
Shape.

Finally, as shown in FIG. 1(d), the lead frame 6
By cutting the support plate 9 at the point where it connects with the lead terminal 5 by γ;', 2 B'L, and separating the support plate 9 at the G point where it connects to the outer case 7, a lead edge is attached to the lower end of the outer case 7. Obtain a SIP type network resistor with 1 resistor 5 in a row.

In this embodiment, the substrate 1 supports &! By simply adding the step of connecting the parts 9 to 9, movement of the substrate 1 during injection molding can be prevented, and the yield of the product can be improved compared to the conventional method described above.

Further, after cutting the support plate 9, the cut end face is exposed on the exterior body 7, but since the cut face is not in contact with the resistive film 2, it does not become a live part, and it is not a live part. It can be handled in the same way as a resistor.

FIG. 2 is a process diagram showing another embodiment of the method for manufacturing network electronic components according to the present invention, in which 10 is a substrate;
1 is the first frame, 12 is the second frame, 13.1
4 is a protrusion, 15 is a chip-shaped electronic component, and parts corresponding to those in FIG. 1 are given the same reference numerals.

First, hoop-shaped metal plates prepared in advance are sequentially fed, and a substrate 10 having a predetermined shape is pressed. This substrate 10 is
As shown in FIG. 2(α), the first seven frames 11 have a plurality of protrusions 13, and the second seven frames 12 have a plurality of protrusions 14. The protrusions 13,14 are segmented except for the left pair.

Next, as shown in FIG. 2(b), a chip-shaped electronic component 15 such as a chip resistor or a chip capacitor is placed between each protrusion 13.14 of the first and second seven frames 11.12. ,
After fixing and sending these into a mold device (not shown), molten resin is injected into the cavity shown by the broken line. At this time, the first and second frames 11, 12 are pressed and held between the movable mold and the fixed mold, thereby positioning the substrate 10 and preventing deviation of the substrate 10 during injection molding.

Next, the molten resin is cooled and solidified in a mold device, and as shown in FIG. 2(C), the first seven frames 11 and the second
An exterior body 7 each having seven frames 12 is molded.

Finally, as shown in Figure 2(d), the first 7 rams 1
1 from the proximal end of the protrusion 13 to form a plurality of protrusions 13.
On the other hand, the second seven frames 12 are separated at the connection portion with the outer case 7, thereby obtaining a SIP type chip network in which the lead terminals 5 are arranged in a row at the lower end of the outer case 7.

In this embodiment, the seven beams 11 of w41 for forming lead terminals and the second seven beams 12 for supporting the substrate 10 in the mold apparatus are placed together with the protruding portions 13.14 in the 7- Since it can be formed integrally from the metal plate 711, it is suitable for mass production.

FIG. 3 is an explanatory diagram showing still another embodiment of the method for manufacturing network electronic components according to the present invention, and FIG.
Only the process corresponding to b) is shown, and the remaining process diagrams are omitted.

In this embodiment, the second frame 12 provided in the second frame embodiment is removed, and instead, support plates 16 are provided on the left and right protrusions 14 extending parallel to the first seven frames 11. are provided, and these support plates 16 and the first seven frames 1
1, the substrate 10 is held in a mold apparatus from three sides. The other configurations and processes are basically the same as those of the second embodiment, and after injection molding the exterior body 7 on the part shown by the broken line in FIG.
6 is separated at the connection part with the exterior body 7. In each of the above practical examples, resistors and capacitors were explained as examples of electronic elements mounted on the board, but other than VC
It is also possible to use electronic components such as diodes.

〔Effect of the invention〕

As explained above, according to the present invention, during creation molding,
Since the substrate can be held in the mold by the image between the lead terminal and the support plate, it is possible to prevent the substrate from moving within the cavity due to the injection pressure of the molten resin, resulting in superior JFI productivity VC compared to conventional technology. Ik for network electronic components! b-force method can be provided.

[Brief explanation of the drawing]

Figures 1 (α) to (d) are manufacturing process diagrams of network electronic components in the first practical example of the present invention, and Figures 2 (cL) to (
d) is a manufacturing process diagram of the network electronic component in the second embodiment of the present invention, FIG. 3 is a plan view of the board in the third embodiment of the present invention, and FIG. FIG. 5 is a side view of the network electronic component illustrating the defects in the conventional example. 1.10...Substrate, 2...Resistive film ( ￥
element), 3... Common a electrode, 4... Electrode, 5... Lead terminal, 6... Lead frame, 7...・Exterior body, 8... Dummy terminal, 9, 16... Support plate, 11...
・First 7 frames, 12... Second frame (
Support &), 13.14... Protrusion, 15...
...Chip-shaped electronic components. Figure 1, Figure 3, Figures 1-5.

Claims (1)

[Claims] In a method for manufacturing a network electronic component in which a plurality of electronic elements are provided on a substrate and these are insulated and sealed by injection molding, lead terminals that are electrically connected to each of the electronic elements are provided in a row protruding from the substrate. At the same time, a support plate is provided to protrude from the board at a position away from the lead terminals, and molten resin is injected into a cavity around the board while the lead terminals and the support plate are supported in a mold. Then, the molten resin is cooled and solidified to form an exterior body including the lead terminals and a support plate, and then the support plate is separated from the exterior body, and only the lead terminals are inserted into the exterior body. A method for manufacturing a network electronic component, characterized in that: