JPS61183541U - - Google Patents
Info
- Publication number
- JPS61183541U JPS61183541U JP6705385U JP6705385U JPS61183541U JP S61183541 U JPS61183541 U JP S61183541U JP 6705385 U JP6705385 U JP 6705385U JP 6705385 U JP6705385 U JP 6705385U JP S61183541 U JPS61183541 U JP S61183541U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- circuit board
- circuit pattern
- sealing structure
- seal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 4
- 238000001721 transfer moulding Methods 0.000 claims 1
- 239000003566 sealing material Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6705385U JPS61183541U (ko) | 1985-05-07 | 1985-05-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6705385U JPS61183541U (ko) | 1985-05-07 | 1985-05-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61183541U true JPS61183541U (ko) | 1986-11-15 |
Family
ID=30600515
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6705385U Pending JPS61183541U (ko) | 1985-05-07 | 1985-05-07 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61183541U (ko) |
-
1985
- 1985-05-07 JP JP6705385U patent/JPS61183541U/ja active Pending