JPS6118334B2 - - Google Patents

Info

Publication number
JPS6118334B2
JPS6118334B2 JP52113374A JP11337477A JPS6118334B2 JP S6118334 B2 JPS6118334 B2 JP S6118334B2 JP 52113374 A JP52113374 A JP 52113374A JP 11337477 A JP11337477 A JP 11337477A JP S6118334 B2 JPS6118334 B2 JP S6118334B2
Authority
JP
Japan
Prior art keywords
wafer
dicing
support plate
semiconductor
porous support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP52113374A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5447580A (en
Inventor
Tsutomu Mimata
Akira Kabashima
Tamio Ootani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Via Mechanics Ltd
Original Assignee
Hitachi Ltd
Hitachi Seiko Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Seiko Ltd filed Critical Hitachi Ltd
Priority to JP11337477A priority Critical patent/JPS5447580A/ja
Publication of JPS5447580A publication Critical patent/JPS5447580A/ja
Publication of JPS6118334B2 publication Critical patent/JPS6118334B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Dicing (AREA)
JP11337477A 1977-09-22 1977-09-22 Dislodging device of plate form objects Granted JPS5447580A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11337477A JPS5447580A (en) 1977-09-22 1977-09-22 Dislodging device of plate form objects

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11337477A JPS5447580A (en) 1977-09-22 1977-09-22 Dislodging device of plate form objects

Publications (2)

Publication Number Publication Date
JPS5447580A JPS5447580A (en) 1979-04-14
JPS6118334B2 true JPS6118334B2 (enrdf_load_stackoverflow) 1986-05-12

Family

ID=14610658

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11337477A Granted JPS5447580A (en) 1977-09-22 1977-09-22 Dislodging device of plate form objects

Country Status (1)

Country Link
JP (1) JPS5447580A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004131215A (ja) * 2002-10-09 2004-04-30 Ushio Inc 帯状ワークの搬送装置
JP2006032661A (ja) * 2004-07-16 2006-02-02 Disco Abrasive Syst Ltd 切削装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5435652Y2 (enrdf_load_stackoverflow) * 1971-02-20 1979-10-29

Also Published As

Publication number Publication date
JPS5447580A (en) 1979-04-14

Similar Documents

Publication Publication Date Title
US7348275B2 (en) Processing method for semiconductor wafer
US6120360A (en) Apparatus for processing a planar structure
US20060261445A1 (en) Integrated circuit device with treated perimeter edge
TW201010027A (en) Thin foil semiconductor package
CN110047802B (zh) 具有三个材料移除阶段的工件分离
CN104441276B (zh) 晶体硅锭的切割方法
US3080640A (en) Method of manufacturing semi-conductive electrode systems
PH12018050190A1 (en) Method of separating a back layer on a substrate using exposure to reduced temperature and related apparatus
US2978804A (en) Method of classifying non-magnetic elements
JPS6118334B2 (enrdf_load_stackoverflow)
JP5294087B2 (ja) 半導体ウェーハおよびその製造方法
JP2022051384A (ja) 半導体装置及びその製造方法
US20040121561A1 (en) Method of forming electronic dies wherein each die has a layer of solid diamond
JP3147455B2 (ja) 半導体ウェーハの切断方法
US6364751B1 (en) Method for singling semiconductor components and semiconductor component singling device
JPH01293613A (ja) ディスクリート素子用基板及びその製造方法
US3086281A (en) Semiconductor leads and method of attaching
JPS6021435A (ja) 観察用サンプルの製造方法
US6367467B1 (en) Holding unit for semiconductor wafer sawing
US20090298231A1 (en) Cmos process for fabrication of ultra small or non standard size or shape semiconductor die
JPS633774Y2 (enrdf_load_stackoverflow)
US4085038A (en) Methods of and apparatus for sorting parts of a separated article
KR200156152Y1 (ko) 웨이퍼 척킹장치
JPH05198671A (ja) 半導体ウェハーのダイシング方法
JP2000317806A (ja) マルチワイヤソーを用いた加工方法