JPS61182238A - Inspection device for residue of organic compound of resist or the like - Google Patents
Inspection device for residue of organic compound of resist or the likeInfo
- Publication number
- JPS61182238A JPS61182238A JP60023170A JP2317085A JPS61182238A JP S61182238 A JPS61182238 A JP S61182238A JP 60023170 A JP60023170 A JP 60023170A JP 2317085 A JP2317085 A JP 2317085A JP S61182238 A JPS61182238 A JP S61182238A
- Authority
- JP
- Japan
- Prior art keywords
- organic compound
- substrate
- residue
- resist
- ultraviolet rays
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、半導体装置を製造する際のホトリソグラフィ
工程において、基板上のレジスト等有機化合物残渣の検
査をするレジスト等有機化合物残渣検査装置に関する。Detailed Description of the Invention (Industrial Application Field) The present invention relates to a resist or other organic compound residue inspection device that inspects resist or other organic compound residue on a substrate during a photolithography process when manufacturing a semiconductor device. .
(従来の技術)
半導体装置を製造する際のホトリソグラフィ工程におい
て、エツチング終了とともに不必要となったレジスト等
の有機化合物は基板上から除去される。しかし、除去が
完全に行われず基板上にレジスト等の有機化合物が残存
していると、半導体装置に悪影響を及ぼすといった不都
合が生じる。(Prior Art) In a photolithography process when manufacturing a semiconductor device, upon completion of etching, unnecessary organic compounds such as resist are removed from the substrate. However, if organic compounds such as resist remain on the substrate without being completely removed, there will be problems such as adverse effects on the semiconductor device.
そこで、基板上にレジスト等の有機化合物残渣が付着し
ているか否かを検査する必要があり、従来、その検査は
、光学顕微鏡で観察することにより行っていた。Therefore, it is necessary to inspect whether organic compound residues such as resist are attached to the substrate, and conventionally, this inspection has been performed by observing with an optical microscope.
(発明が解決しようする問題点)
上記従来の検査方法は2人間の眼により行うものである
ため2作業効率が悪く、また見逃しも起こり易いうえ製
造ライン全体の自動化の障害ともなっている。(Problems to be Solved by the Invention) The above-mentioned conventional inspection method is performed by the eyes of two people, so it has poor work efficiency, is prone to oversights, and is also an obstacle to automation of the entire production line.
(問題点を解決するための手段) 本発明のレジスト等有機化合物残渣検査装置は。(Means for solving problems) The present invention provides an apparatus for inspecting organic compound residues such as resist.
レジスト除去後の基板上に紫外線を照射する紫外線照射
手段と、この紫外線照射手段から照射される紫外線を受
けてレジスト等有機化合物残渣が発する螢光を検出し、
基板上のレジスト等有機化合物残渣を判別する判別手段
とを備えてなるものである。an ultraviolet irradiation means for irradiating ultraviolet rays onto the substrate after the resist has been removed; and detecting fluorescence emitted by organic compound residues such as the resist upon receiving the ultraviolet rays irradiated from the ultraviolet irradiation means;
The apparatus is equipped with a discrimination means for discriminating organic compound residues such as resist on the substrate.
(作用)
レジスト等の有機化合物は、紫外線が照射されるとその
紫外線を吸収して螢光を発する性質を有していることか
ら、紫外線照射手段により紫外線をレジスト除去後の基
板上に照射すると、基板上にレジスト等の有機化合物の
残渣が付着しておれば、紫外線によりその残渣が螢光を
発する。そして判別手段は、その螢光を検出し、基板上
のレジスト等有機化合物残渣を判別する。(Function) Organic compounds such as resists have the property of absorbing ultraviolet rays and emitting fluorescence when irradiated with ultraviolet rays. Therefore, when ultraviolet rays are irradiated onto the substrate after the resist has been removed using an ultraviolet irradiation means, If the residue of an organic compound such as a resist adheres to the substrate, the residue emits fluorescence when exposed to ultraviolet rays. The discrimination means detects the fluorescent light and discriminates organic compound residues such as resist on the substrate.
(実施例)
本発明の構成を実施例について図面を参照して説明する
。(Example) The configuration of the present invention will be described with reference to the drawings.
第1図は本発明のレジスト等有機化合物残渣検査装置の
概略を示し2図中1は2例えば水銀ランプ等の紫外線を
発する光源で、この光源1からフィルタ2によって可視
光を除いた紫外線3を検査すべき基板4上に照射する。FIG. 1 shows an outline of an apparatus for inspecting organic compound residues such as resists according to the present invention. In FIG. 2, reference numeral 1 indicates a light source that emits ultraviolet rays, such as a mercury lamp. The substrate 4 to be inspected is irradiated with light.
ここで、基板4上にレジスト等の有機化合物の残渣5が
付着していると、その残渣5は上記紫外線3を吸収して
可視光の螢光6を発する。そして。Here, if a residue 5 of an organic compound such as a resist adheres to the substrate 4, the residue 5 absorbs the ultraviolet ray 3 and emits visible fluorescence 6. and.
この螢光6は基板4の斜め上方に設けられた受光器7で
受光される。This fluorescent light 6 is received by a light receiver 7 provided diagonally above the substrate 4.
受光器7は受光した螢光6を電気信号に変換して信号処
理部8に送る。信号処理部8は受光器7からの信号を処
理し、レジスト等の有機化合物の残渣の有無を判別する
。The photoreceiver 7 converts the received fluorescent light 6 into an electrical signal and sends it to the signal processing section 8. The signal processing unit 8 processes the signal from the light receiver 7 and determines whether there is a residue of an organic compound such as a resist.
なお、有機化合物の種類によって発する螢光の波長が異
なるので、第2図に示すように、受光器7の前に適当な
フィルタ9を設けて螢光6を分光することにより基板4
上に付着している残渣5の種類を判別するようにしても
よい。Since the wavelength of the fluorescent light emitted differs depending on the type of organic compound, as shown in FIG.
The type of residue 5 attached thereto may be determined.
(発明の効果) 本発明のレジスト等有機化合物残渣検査装置は。(Effect of the invention) The present invention provides an apparatus for inspecting organic compound residues such as resist.
基板上にレジスト等有機化合物残渣が付着しているか否
かを正確、かつ迅速に行うことができるとともに、検査
の自動化および省力化、さらには製造ライン全体の自動
化を可能にすることができる。It is possible to accurately and quickly determine whether or not organic compound residues such as resist are attached to the substrate, and it is also possible to automate the inspection and save labor, and furthermore, to automate the entire manufacturing line.
第1図は本発明のレジスト等有機化合物残渣検査装置の
実施例を示す概略構成図、第2図は他の実施例を示す概
略構成図である。
1・・・光源、2・・・フィルタ、3・・・紫外線4・
・・基板、5・・・レジスト等有機化合物残渣6・・・
螢光、7・・・受光器、 8・・・信号処理部9・・
・フィルタ
ほか1名
第7図FIG. 1 is a schematic configuration diagram showing an embodiment of an organic compound residue inspection apparatus such as a resist according to the present invention, and FIG. 2 is a schematic configuration diagram showing another embodiment. 1...Light source, 2...Filter, 3...Ultraviolet light 4.
... Substrate, 5... Organic compound residue such as resist 6...
Fluorescence, 7... Light receiver, 8... Signal processing section 9...
・Filter and 1 other person Figure 7
Claims (1)
照射手段と、 この紫外線照射手段から照射される紫外線 を受けて基板上のレジスト等有機化合物残渣が発する螢
光を検出し、基板上のレジスト等有機化合物残渣を判別
する判別手段とを備えてなるレジスト等有機化合物残渣
検査装置。[Scope of Claims] 1) Ultraviolet irradiation means for irradiating ultraviolet rays onto the substrate after resist removal, and detection of fluorescence emitted by organic compound residues such as resist on the substrate upon receiving the ultraviolet rays irradiated from the ultraviolet irradiation means. and a determination means for determining organic compound residue such as resist on a substrate.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60023170A JPS61182238A (en) | 1985-02-07 | 1985-02-07 | Inspection device for residue of organic compound of resist or the like |
US07/080,222 US4800282A (en) | 1985-02-07 | 1987-07-31 | Apparatus and method for detecting residual organic compounds |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60023170A JPS61182238A (en) | 1985-02-07 | 1985-02-07 | Inspection device for residue of organic compound of resist or the like |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61182238A true JPS61182238A (en) | 1986-08-14 |
Family
ID=12103150
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60023170A Pending JPS61182238A (en) | 1985-02-07 | 1985-02-07 | Inspection device for residue of organic compound of resist or the like |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61182238A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0187237U (en) * | 1987-12-01 | 1989-06-08 | ||
WO1993007470A1 (en) * | 1991-10-01 | 1993-04-15 | Tadahiro Ohmi | Analyzer |
US5399867A (en) * | 1990-01-26 | 1995-03-21 | Canon Kabushiki Kaisha | Foreign particle inspection apparatus |
WO2009113478A1 (en) * | 2008-03-12 | 2009-09-17 | 株式会社アルバック | Surface inspection apparatus and surface inspection method |
JP2011091104A (en) * | 2009-10-20 | 2011-05-06 | Canon Inc | Imprint device and article manufacturing method using the same |
US9481114B2 (en) | 2011-04-14 | 2016-11-01 | Canon Kabushiki Kaisha | Imprint method |
CN111312604A (en) * | 2018-12-11 | 2020-06-19 | 上海微电子装备(集团)股份有限公司 | Residual glue detection tool, manufacturing method and residual glue detection method |
WO2024075598A1 (en) * | 2022-10-05 | 2024-04-11 | 東京エレクトロン株式会社 | Surface observation method |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5683044A (en) * | 1979-12-10 | 1981-07-07 | Nippon Telegr & Teleph Corp <Ntt> | Wafer inspection device |
-
1985
- 1985-02-07 JP JP60023170A patent/JPS61182238A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5683044A (en) * | 1979-12-10 | 1981-07-07 | Nippon Telegr & Teleph Corp <Ntt> | Wafer inspection device |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0187237U (en) * | 1987-12-01 | 1989-06-08 | ||
US5399867A (en) * | 1990-01-26 | 1995-03-21 | Canon Kabushiki Kaisha | Foreign particle inspection apparatus |
WO1993007470A1 (en) * | 1991-10-01 | 1993-04-15 | Tadahiro Ohmi | Analyzer |
US5578833A (en) * | 1991-10-01 | 1996-11-26 | Tadahiro Ohmi | Analyzer |
WO2009113478A1 (en) * | 2008-03-12 | 2009-09-17 | 株式会社アルバック | Surface inspection apparatus and surface inspection method |
JP2011091104A (en) * | 2009-10-20 | 2011-05-06 | Canon Inc | Imprint device and article manufacturing method using the same |
US9481114B2 (en) | 2011-04-14 | 2016-11-01 | Canon Kabushiki Kaisha | Imprint method |
CN111312604A (en) * | 2018-12-11 | 2020-06-19 | 上海微电子装备(集团)股份有限公司 | Residual glue detection tool, manufacturing method and residual glue detection method |
CN111312604B (en) * | 2018-12-11 | 2023-03-17 | 上海微电子装备(集团)股份有限公司 | Residual glue detection tool, manufacturing method and residual glue detection method |
WO2024075598A1 (en) * | 2022-10-05 | 2024-04-11 | 東京エレクトロン株式会社 | Surface observation method |
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