JPS61182238A - Inspection device for residue of organic compound of resist or the like - Google Patents

Inspection device for residue of organic compound of resist or the like

Info

Publication number
JPS61182238A
JPS61182238A JP60023170A JP2317085A JPS61182238A JP S61182238 A JPS61182238 A JP S61182238A JP 60023170 A JP60023170 A JP 60023170A JP 2317085 A JP2317085 A JP 2317085A JP S61182238 A JPS61182238 A JP S61182238A
Authority
JP
Japan
Prior art keywords
organic compound
substrate
residue
resist
ultraviolet rays
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60023170A
Other languages
Japanese (ja)
Inventor
Yasunori Nishimura
西村 靖紀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP60023170A priority Critical patent/JPS61182238A/en
Publication of JPS61182238A publication Critical patent/JPS61182238A/en
Priority to US07/080,222 priority patent/US4800282A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To attempt automation and labor saving in inspection by irradiating ultraviolet rays on a substrate after removal of a resist, detecting fluorescence emitted from a residue of an organic compound on the substrate and discriminating the residue of the organic compound on the substrate. CONSTITUTION:Ultraviolet rays 3 exclusive of visible rays are irradiated on a substrate 4 to be inspected from a light source 1 through a filter 2. When a residue 5 of an organic compound of a resist and the like is made to adhere to the substrate 4, the residue 5 absorbs the ultraviolet rays 3 and emits fluorescence of visible rays. This fluorescence 6 is received by a light receiver 7 provided over the substrate 4. The light receiver 7 converts the received fluorescence into an electrical signal, which is sent to a signal processing unit 8. The processing unit 8 processes the signal sent from the light receiver 7 and discriminates the presence or absence of the residue of the organic compound of the resist and the like. This allows automation and labor saving in inspection as well as presence or absence of the residue of the organic compound to be discriminated correctly and quickly.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、半導体装置を製造する際のホトリソグラフィ
工程において、基板上のレジスト等有機化合物残渣の検
査をするレジスト等有機化合物残渣検査装置に関する。
Detailed Description of the Invention (Industrial Application Field) The present invention relates to a resist or other organic compound residue inspection device that inspects resist or other organic compound residue on a substrate during a photolithography process when manufacturing a semiconductor device. .

(従来の技術) 半導体装置を製造する際のホトリソグラフィ工程におい
て、エツチング終了とともに不必要となったレジスト等
の有機化合物は基板上から除去される。しかし、除去が
完全に行われず基板上にレジスト等の有機化合物が残存
していると、半導体装置に悪影響を及ぼすといった不都
合が生じる。
(Prior Art) In a photolithography process when manufacturing a semiconductor device, upon completion of etching, unnecessary organic compounds such as resist are removed from the substrate. However, if organic compounds such as resist remain on the substrate without being completely removed, there will be problems such as adverse effects on the semiconductor device.

そこで、基板上にレジスト等の有機化合物残渣が付着し
ているか否かを検査する必要があり、従来、その検査は
、光学顕微鏡で観察することにより行っていた。
Therefore, it is necessary to inspect whether organic compound residues such as resist are attached to the substrate, and conventionally, this inspection has been performed by observing with an optical microscope.

(発明が解決しようする問題点) 上記従来の検査方法は2人間の眼により行うものである
ため2作業効率が悪く、また見逃しも起こり易いうえ製
造ライン全体の自動化の障害ともなっている。
(Problems to be Solved by the Invention) The above-mentioned conventional inspection method is performed by the eyes of two people, so it has poor work efficiency, is prone to oversights, and is also an obstacle to automation of the entire production line.

(問題点を解決するための手段) 本発明のレジスト等有機化合物残渣検査装置は。(Means for solving problems) The present invention provides an apparatus for inspecting organic compound residues such as resist.

レジスト除去後の基板上に紫外線を照射する紫外線照射
手段と、この紫外線照射手段から照射される紫外線を受
けてレジスト等有機化合物残渣が発する螢光を検出し、
基板上のレジスト等有機化合物残渣を判別する判別手段
とを備えてなるものである。
an ultraviolet irradiation means for irradiating ultraviolet rays onto the substrate after the resist has been removed; and detecting fluorescence emitted by organic compound residues such as the resist upon receiving the ultraviolet rays irradiated from the ultraviolet irradiation means;
The apparatus is equipped with a discrimination means for discriminating organic compound residues such as resist on the substrate.

(作用) レジスト等の有機化合物は、紫外線が照射されるとその
紫外線を吸収して螢光を発する性質を有していることか
ら、紫外線照射手段により紫外線をレジスト除去後の基
板上に照射すると、基板上にレジスト等の有機化合物の
残渣が付着しておれば、紫外線によりその残渣が螢光を
発する。そして判別手段は、その螢光を検出し、基板上
のレジスト等有機化合物残渣を判別する。
(Function) Organic compounds such as resists have the property of absorbing ultraviolet rays and emitting fluorescence when irradiated with ultraviolet rays. Therefore, when ultraviolet rays are irradiated onto the substrate after the resist has been removed using an ultraviolet irradiation means, If the residue of an organic compound such as a resist adheres to the substrate, the residue emits fluorescence when exposed to ultraviolet rays. The discrimination means detects the fluorescent light and discriminates organic compound residues such as resist on the substrate.

(実施例) 本発明の構成を実施例について図面を参照して説明する
(Example) The configuration of the present invention will be described with reference to the drawings.

第1図は本発明のレジスト等有機化合物残渣検査装置の
概略を示し2図中1は2例えば水銀ランプ等の紫外線を
発する光源で、この光源1からフィルタ2によって可視
光を除いた紫外線3を検査すべき基板4上に照射する。
FIG. 1 shows an outline of an apparatus for inspecting organic compound residues such as resists according to the present invention. In FIG. 2, reference numeral 1 indicates a light source that emits ultraviolet rays, such as a mercury lamp. The substrate 4 to be inspected is irradiated with light.

ここで、基板4上にレジスト等の有機化合物の残渣5が
付着していると、その残渣5は上記紫外線3を吸収して
可視光の螢光6を発する。そして。
Here, if a residue 5 of an organic compound such as a resist adheres to the substrate 4, the residue 5 absorbs the ultraviolet ray 3 and emits visible fluorescence 6. and.

この螢光6は基板4の斜め上方に設けられた受光器7で
受光される。
This fluorescent light 6 is received by a light receiver 7 provided diagonally above the substrate 4.

受光器7は受光した螢光6を電気信号に変換して信号処
理部8に送る。信号処理部8は受光器7からの信号を処
理し、レジスト等の有機化合物の残渣の有無を判別する
The photoreceiver 7 converts the received fluorescent light 6 into an electrical signal and sends it to the signal processing section 8. The signal processing unit 8 processes the signal from the light receiver 7 and determines whether there is a residue of an organic compound such as a resist.

なお、有機化合物の種類によって発する螢光の波長が異
なるので、第2図に示すように、受光器7の前に適当な
フィルタ9を設けて螢光6を分光することにより基板4
上に付着している残渣5の種類を判別するようにしても
よい。
Since the wavelength of the fluorescent light emitted differs depending on the type of organic compound, as shown in FIG.
The type of residue 5 attached thereto may be determined.

(発明の効果) 本発明のレジスト等有機化合物残渣検査装置は。(Effect of the invention) The present invention provides an apparatus for inspecting organic compound residues such as resist.

基板上にレジスト等有機化合物残渣が付着しているか否
かを正確、かつ迅速に行うことができるとともに、検査
の自動化および省力化、さらには製造ライン全体の自動
化を可能にすることができる。
It is possible to accurately and quickly determine whether or not organic compound residues such as resist are attached to the substrate, and it is also possible to automate the inspection and save labor, and furthermore, to automate the entire manufacturing line.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明のレジスト等有機化合物残渣検査装置の
実施例を示す概略構成図、第2図は他の実施例を示す概
略構成図である。 1・・・光源、2・・・フィルタ、3・・・紫外線4・
・・基板、5・・・レジスト等有機化合物残渣6・・・
螢光、7・・・受光器、  8・・・信号処理部9・・
・フィルタ ほか1名 第7図
FIG. 1 is a schematic configuration diagram showing an embodiment of an organic compound residue inspection apparatus such as a resist according to the present invention, and FIG. 2 is a schematic configuration diagram showing another embodiment. 1...Light source, 2...Filter, 3...Ultraviolet light 4.
... Substrate, 5... Organic compound residue such as resist 6...
Fluorescence, 7... Light receiver, 8... Signal processing section 9...
・Filter and 1 other person Figure 7

Claims (1)

【特許請求の範囲】 1)レジスト除去後の基板上に紫外線を照射する紫外線
照射手段と、 この紫外線照射手段から照射される紫外線 を受けて基板上のレジスト等有機化合物残渣が発する螢
光を検出し、基板上のレジスト等有機化合物残渣を判別
する判別手段とを備えてなるレジスト等有機化合物残渣
検査装置。
[Scope of Claims] 1) Ultraviolet irradiation means for irradiating ultraviolet rays onto the substrate after resist removal, and detection of fluorescence emitted by organic compound residues such as resist on the substrate upon receiving the ultraviolet rays irradiated from the ultraviolet irradiation means. and a determination means for determining organic compound residue such as resist on a substrate.
JP60023170A 1985-02-07 1985-02-07 Inspection device for residue of organic compound of resist or the like Pending JPS61182238A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP60023170A JPS61182238A (en) 1985-02-07 1985-02-07 Inspection device for residue of organic compound of resist or the like
US07/080,222 US4800282A (en) 1985-02-07 1987-07-31 Apparatus and method for detecting residual organic compounds

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60023170A JPS61182238A (en) 1985-02-07 1985-02-07 Inspection device for residue of organic compound of resist or the like

Publications (1)

Publication Number Publication Date
JPS61182238A true JPS61182238A (en) 1986-08-14

Family

ID=12103150

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60023170A Pending JPS61182238A (en) 1985-02-07 1985-02-07 Inspection device for residue of organic compound of resist or the like

Country Status (1)

Country Link
JP (1) JPS61182238A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0187237U (en) * 1987-12-01 1989-06-08
WO1993007470A1 (en) * 1991-10-01 1993-04-15 Tadahiro Ohmi Analyzer
US5399867A (en) * 1990-01-26 1995-03-21 Canon Kabushiki Kaisha Foreign particle inspection apparatus
WO2009113478A1 (en) * 2008-03-12 2009-09-17 株式会社アルバック Surface inspection apparatus and surface inspection method
JP2011091104A (en) * 2009-10-20 2011-05-06 Canon Inc Imprint device and article manufacturing method using the same
US9481114B2 (en) 2011-04-14 2016-11-01 Canon Kabushiki Kaisha Imprint method
CN111312604A (en) * 2018-12-11 2020-06-19 上海微电子装备(集团)股份有限公司 Residual glue detection tool, manufacturing method and residual glue detection method
WO2024075598A1 (en) * 2022-10-05 2024-04-11 東京エレクトロン株式会社 Surface observation method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5683044A (en) * 1979-12-10 1981-07-07 Nippon Telegr & Teleph Corp <Ntt> Wafer inspection device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5683044A (en) * 1979-12-10 1981-07-07 Nippon Telegr & Teleph Corp <Ntt> Wafer inspection device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0187237U (en) * 1987-12-01 1989-06-08
US5399867A (en) * 1990-01-26 1995-03-21 Canon Kabushiki Kaisha Foreign particle inspection apparatus
WO1993007470A1 (en) * 1991-10-01 1993-04-15 Tadahiro Ohmi Analyzer
US5578833A (en) * 1991-10-01 1996-11-26 Tadahiro Ohmi Analyzer
WO2009113478A1 (en) * 2008-03-12 2009-09-17 株式会社アルバック Surface inspection apparatus and surface inspection method
JP2011091104A (en) * 2009-10-20 2011-05-06 Canon Inc Imprint device and article manufacturing method using the same
US9481114B2 (en) 2011-04-14 2016-11-01 Canon Kabushiki Kaisha Imprint method
CN111312604A (en) * 2018-12-11 2020-06-19 上海微电子装备(集团)股份有限公司 Residual glue detection tool, manufacturing method and residual glue detection method
CN111312604B (en) * 2018-12-11 2023-03-17 上海微电子装备(集团)股份有限公司 Residual glue detection tool, manufacturing method and residual glue detection method
WO2024075598A1 (en) * 2022-10-05 2024-04-11 東京エレクトロン株式会社 Surface observation method

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