JPS61182035U - - Google Patents
Info
- Publication number
- JPS61182035U JPS61182035U JP6448285U JP6448285U JPS61182035U JP S61182035 U JPS61182035 U JP S61182035U JP 6448285 U JP6448285 U JP 6448285U JP 6448285 U JP6448285 U JP 6448285U JP S61182035 U JPS61182035 U JP S61182035U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- upper electrode
- lower electrode
- insulating
- metal cylinder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims 1
- 238000009413 insulation Methods 0.000 description 1
Landscapes
- Die Bonding (AREA)
Description
第１図は本考案のスタツド形半導体装置を示す
断面図、第２図は従来のスタツド形半導体装置を
示す断面図、第３図は異なる従来のスタツド形半
導体装置の断面図である。
１……半導体素子、２……上部電極、３……下
部電極、４……金属筒、５……絶縁キヤツプ、６
……上部電極の鍔部、７……金属筒の鍔部、８…
…ばね体、９……絶縁リング、１０……座金、１
１……絶縁筒、１２……鍔付絶縁筒。
FIG. 1 is a sectional view showing a stud type semiconductor device of the present invention, FIG. 2 is a sectional view showing a conventional stud type semiconductor device, and FIG. 3 is a sectional view of a different conventional stud type semiconductor device. DESCRIPTION OF SYMBOLS 1... Semiconductor element, 2... Upper electrode, 3... Lower electrode, 4... Metal tube, 5... Insulating cap, 6
... Flange of upper electrode, 7... Flange of metal tube, 8...
... Spring body, 9 ... Insulation ring, 10 ... Washer, 1
1...Insulating tube, 12...Insulating tube with flange.
Claims (1)
の下部電極に挾まれて支持され、下部電極上に金
属筒が一端で固着されて半導体素子を取り囲み、
この金属筒の他端上に帽状の絶縁キヤツプの開口
端が接着され、この絶縁キヤツプの頂部において
上部電極が貫通して、かつ固着されることにより
半導体素子が気密封止され、金属筒と絶縁ケース
との接合部に設けられた鍔部と上部電極のヘツダ
ー間に設置されたばね体が絶縁リングを介して半
導体素子を下部電極に加圧接触させるものにおい
て、上部電極に鍔付の絶縁筒が貫通され、該絶縁
筒の鍔部を介して前記ばね体により半導体素子が
上部電極と下部電極の間に加圧接触されているこ
とを特徴とするスタツド形半導体装置。 A semiconductor element is supported by being sandwiched between a header of an upper electrode and a stud-shaped lower electrode, and a metal cylinder is fixed at one end on the lower electrode to surround the semiconductor element.
The open end of a hat-shaped insulating cap is glued onto the other end of this metal cylinder, and the upper electrode is passed through and fixed at the top of this insulating cap, thereby hermetically sealing the semiconductor element and connecting it to the metal cylinder. The spring body installed between the flange provided at the joint with the insulating case and the header of the upper electrode pressurizes the semiconductor element into contact with the lower electrode via the insulating ring. A stud-type semiconductor device, characterized in that the semiconductor element is pressed into contact between the upper electrode and the lower electrode by the spring body through the flange of the insulating cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6448285U JPH0427169Y2 (en) | 1985-04-30 | 1985-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6448285U JPH0427169Y2 (en) | 1985-04-30 | 1985-04-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61182035U true JPS61182035U (en) | 1986-11-13 |
| JPH0427169Y2 JPH0427169Y2 (en) | 1992-06-30 |
Family
ID=30595608
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6448285U Expired JPH0427169Y2 (en) | 1985-04-30 | 1985-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0427169Y2 (en) |
-
1985
- 1985-04-30 JP JP6448285U patent/JPH0427169Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0427169Y2 (en) | 1992-06-30 |