JPS6118142A - Positioning apparatus - Google Patents

Abstract

PURPOSE:To quickly execute the positioning work for different kind and size of processing object by modifying a positioning apparatus within a short period different kind and size of processing object in accordance with change of a frame position. CONSTITUTION:For the positioning of a DIL type semiconductor device 5, an interval K is adjusted by adequately moving the chute blocks 2A, 2B in accordance with a size in the width direction of a semiconductor device X. Next, the positioning plates 3A and 3B are moved in such a direction as holding the semiconductor device 5, these are stopped at the position where the interval L becomes equal to the longitudinal length of a semiconductor device 5 indicated by Y, for the positioning in the longitudinal direction. The semiconductor device 5 positioned under such condition is held, for example, by the vacuum absorbing method, by a feed arm and is then supplied to the inspection device after the positioning plates 3A and 3B draw backward.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a positioning technique, and particularly to a positioning technique that is effective when used in the process of supplying semiconductor devices with their postures aligned in the manufacturing process of semiconductor devices.

[Background technology] Inspection equipment for conducting electrical tests on semiconductor devices is publicly known (published by Kogyo Kenkyukai, "Electronic Materials Jl January issue special edition, 1972").
Published November 10, 2015, pp. 226-230). When reusing this equipment and supplying semiconductor devices with their postures aligned,
For example, when handling semiconductor devices in dual-in-line (DIL) type packages, positioning is performed by moving two rows of leads facing downward across a chute of a predetermined width and stopping at a predetermined position with a stopper. It is possible to do this.

However, in the above-mentioned positioning device, when dealing with semiconductor devices in a DIL type pancage where the spacing between the two rows of leads is different, it is necessary to replace the chute part in order to adjust the width of the chute to the spacing between the leads. inferior in sex.

Furthermore, the present inventors have found that, for example, the present invention cannot be applied at all to a flat path cage type semiconductor device, and there are disadvantages such as the need to replace the positioning device itself.

[Object of the Invention] An object of the present invention is to provide a positioning technique that can quickly cope with the positioning work of semiconductor devices having different external shapes.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Summary of the Invention] A brief overview of typical inventions disclosed in this application is as follows.

In other words, by changing the mutual distance, the
A pair of parallel frames that position the object in the width direction, and a pair of parallel frames that are movable in a direction perpendicular to the direction of movement of the frames and position the object in the length direction. The above object is achieved by making it possible to position workpieces of different shapes by moving the workpieces appropriately depending on the shape of the workpiece.

[Embodiment 1] FIG. 1 is an external perspective view of a main part of a positioning device which is an embodiment of the present invention.

Above the base 1 is a pair of chute blocks 2A and 2.
B (first frame bodies) are provided facing each other in parallel, and the interval between them can be adjusted by moving in the opposite direction.

Furthermore, the chute blocks 2A and 2B each have sloped surfaces! , an inclined surface V, an inclined surface (2), and an inclined surface (3) are provided.

Positioning plates 3A and 3B (second frame bodies) are provided facing each other in a direction perpendicular to the moving direction of the pair of chute blocks 2A and 2B, and are moved on the chute blocks 2A and 2B in opposite directions. It has a structure.

Slide blocks 4A and 4B (third frame body) are positioned below the positioning blocks 3A and 3B,
It has a structure that allows it to move freely in opposing directions.

Furthermore, the opposing portions of the slide blocks 4A and 4B are provided with an inclined surface (2) and an inclined surface (2).

Shoot blocks 2A, 2B and positioning plate 3
A, 3B and slide block 4A.

4B is driven by, for example, a servo motor (not shown) connected via a ball screw mechanism (not shown).

Next, the operation of this embodiment will be explained.

When positioning the DIL type semiconductor device 5 shown in FIG. 2(a), first the slide blocks 4A and 4
B is retracted to a position where it does not interfere with the movement of chute blocks 2A and 2B.

Next, in accordance with the dimension in the width direction of the semiconductor device indicated by
Adjust by moving B appropriately.

At this time, the amount of movement of the chute blocks 2A and 2B is determined so that, for example, the position dividing the interval K into two in the moving direction of the chute blocks 2A and 2B coincides with a predetermined reference position on the base 1.

The semiconductor device 5 to be positioned is held on a transfer arm (not shown) by, for example, a vacuum suction method and positioned on the chute blocks 2A and 2B, and positioning in the width direction is performed by the inclined surface (1) and the inclined surface (2). .

Next, as shown in the same figure (C), positioning play 1-
'3A and 3B are moved in a direction to sandwich the semiconductor device 5, and are stopped at a position where the distance between them is equal to the length in the longitudinal direction of the semiconductor device 5, indicated by Y in FIG. Positioning is performed.

At this time, for example, the position that divides the interval into two is base 1.
positioning play to match the predetermined reference position on)
The amount of movement of 3A and 3B is determined.

The semiconductor device 5 positioned in the state shown in FIG. 2C is held by a supply arm (not shown), for example, by vacuum suction, and after the positioning plates 3A and 3B are evacuated, an inspection device (not shown) is held. supplied to

By repeating the above series of operations, the positioning operation of DIL type semiconductor devices 5 of various sizes with different widths X and lengths Y is performed at the interval between the chute blocks 2A, 2B and the positioning block 3A.

This is performed continuously by adjusting the intervals of 3B.

[Embodiment 2] FIG. 3 shows an embodiment in which the present invention is applied to a flat package type semiconductor device.

The chute block 2 shown in FIG. 3(d) can be adjusted according to the width U and length (■) of various flat package type semiconductor devices 6 as shown in FIG. 3(a), (b), and (C).
A, 2B and slide blocks 4A, 4B are moved appropriately, and the ratio of the opposing slopes ■ and slope ■,
The distances M and N at the bottom of each of (2) are adjusted to be equal to the dimensions U and V of the semiconductor device 6, respectively.

At this time, each moving operation is performed such that, for example, the positions where M and N are each divided into two equal parts coincide with a predetermined reference position on the base surface.

As described above, by dropping the semiconductor devices 1 & 6 held by the transfer arm (not shown) from above into the recess formed by the chute blocks 2A and 2B and the slide blocks 4A and 4B, the same [(e)
Positioning is performed as shown in . In this case, since the opposing surfaces of the blocks 2A and 2B and 4A and 4B are inclined surfaces, the semiconductor device 6 can be positioned more easily by simply dropping it into the semiconductor device 6.

At this time, the positioning plates 3A and 3B are retracted so as not to interfere with the dropping operation.

The semiconductor device 6, which has been positioned at the bottom of the recess, is held by a supply arm (not shown) and placed in the inspection device (
(not shown).

When positioning semiconductor devices 6 having different widths U and lengths {circle around (2)}, it is possible to quickly respond by adjusting the distances M and N in FIG. 2(d) as appropriate in advance.

As described above, by using the positioning device of this embodiment, it is possible to quickly respond to the positioning of semiconductor devices of different types and sizes.

[Effects] (1) By changing the position of the frame, the positioning mechanism can be changed in a short time to be suitable for each workpiece of different types and sizes, making it possible to position workpieces of different types and sizes. Work can be done quickly.

(2) As a result of (1) above, when positioning workpieces of different types and sizes, there is no need to replace parts constituting the frame, and manual work is reduced.

(3) As a result of (1) and (2) above, productivity is improved.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.

For example, it is also possible to control the position of each frame by combining it with a mechanism that recognizes the type of semiconductor device using an optical method.

[Field of Application] In the above explanation, the invention made by the present inventor was mainly applied to a positioning device for a semiconductor device, which is the field of application that formed the background of the invention, but the invention is not limited to this, for example, It can also be used for positioning printed wiring boards, etc.

[Brief explanation of the drawing]

FIG. 1 is an external perspective view of a main part of a positioning device which is an embodiment of the present invention, FIG. 2(a) is an external perspective view of a DIL type semiconductor device to which the present invention can be applied, FIG. 2(b), (C) DIL according to Example 1 of the present invention
Figures 3(a), (b), and (C) are perspective views of various flat package type semiconductor devices to which the present invention can be applied; (d) and (e) are perspective views illustrating a positioning operation of a flat package type semiconductor device according to a second embodiment of the present invention. 110. Base, 2A, 2B, ... Shoot block (first frame), 3A, 3B8. , positioning plate (second frame), 4A, 4B, , slide block (
third frame), 5, 6. ,, semiconductor devices. Figure 2 (α) Figure 3

Claims (1)

[Claims] 1. A pair of parallel first frames whose mutual distance can be freely changed according to the width of the object to be processed, and a pair of parallel first frames that are movably positioned in a direction perpendicular to the first frames. a pair of parallel second frames which are positioned by changing the mutual distance according to the length of the object to be processed; and a pair of parallel second frames which are movably positioned under the second frames A positioning device comprising: a third frame body that performs positioning by forming a framework together with the frame body. 2. The positioning device according to claim 1, wherein the object to be processed is a semiconductor device. 3. The positioning device according to claim 1, wherein the opposing surface of the first frame and the opposing surface of the third frame are inclined surfaces. 4. The positioning device according to claim 1, wherein each outer surface of the first frame is an inclined surface.