JPS61181188A - Electronic appliance - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to an electronic device, and more particularly to an electronic device having a structure in which electronic components are connected and fixed using an adhesive.

[Prior art] In recent years, as electronic devices such as electronic desktop calculators (hereinafter referred to as calculators) have become smaller, thinner, and lower in price, electronic components or mechanical parts such as keyboards have been mounted on flexible printed circuit boards (hereinafter referred to as FPCs). Structures implemented in

The configuration shown in FIG. 1(A) consists of an FPCIIA, 11B, in which a circuit pattern is printed by printing aluminum, carbon, etc. on two substrates such as polyester, and an insulating plate 16 sandwiched between them to form the circuit of the keyboard part. constitutes,
This is connected via a pressure contact portion 13 to a printed circuit board IO made of paper phenol, glass epoxy, etc., on which electronic components such as the LS 112 and the display 14 are mounted by soldering. In addition to the three-layer structure shown in Figure 1 (A), there is a
A configuration using two printed circuit boards as shown in Figure (B) is also known. This is the FPCIIB in the configuration shown in Figure 1.
FPC with I, 5112, and display unit 14 installed by extending
IIC.

The structure of Fig. 1 (A), CB) is LS112, display 14
To use soldering to fix the connection.

Paper phenol, glass epoxy (Substrate 1 in Figure 1 (A)
0) or polyimide (FPCIIG in Figure 1 (B)
), the printed circuit board had to be manufactured from materials such as ), which was disadvantageous in terms of cost and increased the number of man-hours.

In view of this point, a structure as shown in FIG. 1(C) has recently been proposed. In the structure shown in FIG. 1(C), the keyboard part is composed of an FPCIIA and LID insulating plate 16, which is made by printing a circuit pattern using aluminum, carbon, etc., on a substrate such as polyester, and the LSI12 via conductive adhesive
, for fixing the display 14 with adhesive. The upper and lower FPCs are electrically connected at the portion 13 by pressure contact or adhesion. The purpose of bonding electronic components in this way is to reduce the cost and man-hours of the board, and also because of the poor heat resistance of polyester boards, but current conductive adhesives have weak adhesive strength, and as shown in the figure. Thus, it was necessary to reinforce the chip component with the laminate member 15 formed by applying an adhesive to one side of polyester.

[Objective] The present invention has been made in view of the above-mentioned problems, and an object thereof is to provide an electronic device that does not require extra components and can reliably mount components with a small number of man-hours.

[Structure of the Invention] In order to achieve the above object, the present invention provides an electronic device having a structure in which electronic components are connected and fixed using an adhesive, and includes printed circuit boards arranged facing each other, and an electronic device on one of the printed circuit boards. We adopted a configuration in which an adhesive was used to secure the components with adhesive and insulate the circuit patterns on the opposing board.

[Example] Hereinafter, the present invention will be described in detail based on the example shown in the drawings.

FIG. 2 is an exploded perspective view schematically showing the mounting of electronic components related to the present invention.

What is indicated by the symbol 2 in FIG. 2 is an LSI,
It has a plurality of connection terminals 2a on the edge. The LSI 2 is fixed to the FPC 3 with a laminate material 1. FPC
3 forms an aluminum pattern by etching and prints carbon on it to form the terminal 2a of LSI 2.
Alternatively, circuit patterns corresponding to terminals of other components are formed. Further, on the FPC 3, an FPC 4 made of the same material is arranged.

A circuit pattern is formed on the bottom surface of the FPC 4 in the same manner, and the upper and lower FPCs 3 and 4 have a keyboard pattern as shown below in the area cut out and omitted in FIG. Form the input circuit.

FIGS. 3A to 3C show the circuit patterns formed on the FPCs 3 and 4 and the configurations of insulating spacers sandwiched between the FPCs 3 and 4, respectively. The concentric configuration on the lower side of both figures is a circuit pattern forming a key switch, and these are arranged facing each other through a circular hole 5a of an insulating spacer 5 sandwiched between FPCs 3 and 4. and upper FPC
4 is deformed through the through hole 5a and brought into contact with the pattern of the lower FPC 3, thereby performing key manual force.

As shown in FIGS. 3(A) and 3(B), the circuit pattern of most key input circuits is formed independently on the FPC3.4, but the pattern of the key input circuit of the FPC3, Since the pattern area E for LSI connection is very close to each other, the patterns to be connected on the FPC 3 are not formed continuously.
, and C and D must be connected, but it is difficult to form them continuously. Furthermore, since the FPC3 is a polyester board, soldering is not possible, so connections using jumper wires cannot be made, and connecting using jumper wires is undesirable as it increases the number of steps.Furthermore, although carbon printed FPCs are low in price, The circuit pattern has a resistance value of 70-100 Ω per square, and when a long key line is routed, the resistance value may increase to 20-25 Ω per line.
It is also a problem to route the pattern for a long time between the terminals.

Therefore, in this embodiment, these patterns A, B and C, D are connected using patterns on the FPC 4. F.P.
C4 has patterns A' to B° as shown in Figure 3 (B).
and C' to C' are formed, and the patterns AB and CD are connected by bringing their ends into contact with the patterns A, B and C, D, respectively. Also,
The land-like patterns arranged consecutively with patterns A' to D' are for guiding the patterns on the FPCA to the terminals of the LSI. contacted at the same time.

As described above, the consecutive patterns on the FPC 3 are connected, and the circuit patterns on the FPC 4 are connected to the terminals of the LSI.

By the way, as shown in FIG. 3(B), if we look at the patterns A° to B° and C' to D' on the FPC4, they just pass over the LSI terminal pattern area E of the FPC3. There is. In other words, unless these patterns A' to B' and C' to D' are reliably separated from the pattern surface of the FPC 3, the terminals of the LSI will be short-circuited.

Therefore, in this embodiment, L
Pattern A' ~ using laminate material l for fixing SI2
B' and C° to D° are insulated from the pattern surface of the FPC 3. The laminate material 1 is made of a polyester base coated with an adhesive and formed into the shape shown in FIG. 3(D).

Using the laminate material l formed in this way, LSI2
When pasted and fixed on FPC3, Figure 2 (7) LS
The I2(7) terminal 2a and the FPC3(7) terminal pattern 3a are connected. Moreover, the laminate material 1 is as shown in Figure 3 (
Since it has a shape that covers the terminal pattern area E of A), when the insulating spacer 5 and FPC 4 are laminated and fixed later, the FPC 4 patterns A゛~B° and C''~D'
is reliably isolated from the pattern area E.

Here, FIG. 4(A) shows the laminated state of each member. In FIG. 4(A), reference numeral 3C is an aluminum pattern formed by etching on the polyester base 3b of the FPC 3. The code 3d above it is aluminum pattern 3C
This is a carbon pattern formed by printing on the above-mentioned pattern including the patterns A to D to be connected.

Further, patterns A' to B' and C' to D' are similarly formed on the FPC 4, and these jump pattern portions are insulated from the terminal pattern area of the LSI 2 by the laminate material 1.

Also, the pattern A-D part of FPC3 is pattern A'
~B' and C°~D' land portions are contacted, and patterns A, B, C, and D are reliably connected.

Here, FIG. 4(B) shows the laminate material 1. FPC3, FP
C4 shows a perspective view showing the laminated state of the insulating spacer 5.

In FIG. 4(B), the thick solid line shows the outer shape of the FPC 3, the one-dot chain line shows the outer shape of the FPC 4, the two-dot chain line shows the outer shape of the insulating spacer 5, and the thin solid line shows the outer shape of the laminate material 1. As shown with diagonal lines in Figure 4 CB), FPC4
It can be seen that the jumper wire portions of the upper patterns A' to B' (patterns C' to D' are not shown) pass over the laminate material 1 and are insulated from the patterns of the FPC 3. Furthermore, since the laminate material l is formed to cover the patterns of the FPC 3 around the LSI, it insulates the patterns of the FPC 3 around the LSI from being short-circuited by unnecessary patterns on the FPCA.

As described above, it is possible to eliminate troublesome processes such as soldering, reduce unnecessary parts such as jumper wires and insulating materials that increase costs, and provide an excellent, low-cost electronic device that can be easily assembled. The configuration of the present invention can be implemented in various electronic devices such as calculators and electronic translators.

[Effect] As is clear from the above description, according to the present invention, in an electronic device having a structure in which electronic components are connected and fixed using an adhesive, printed circuit boards disposed facing each other and one of the printed circuit boards Because the electronic components are fixed with adhesive and an adhesive is used to insulate the circuit patterns on the opposing board, the number of unnecessary components such as jumper wires and insulation sheets increases, which increases costs. It is possible to provide a simple, inexpensive, and excellent electronic device in which components can be mounted and one circuit pattern can be connected with a small number of man-hours.

[Brief explanation of drawings]

Figures 1 (A) to (C) are explanatory diagrams showing mounting methods in conventional electronic equipment, respectively; Figure 2 is an exploded perspective view showing an example of component mounting in electronic equipment adopting the present invention; and Figure 3. (A) and (B) are the upper and lower FPCs in Figure 2.
Explanatory diagrams showing the patterns of FIGS. 3(C) and (D
) is a top view showing the shape of the insulating spacer and laminate material used in the device shown in FIG. 2, FIG. 4(A) is a cross-sectional view showing the laminated state of each member in the device shown in FIG. CB) is a perspective view showing a laminated state of each member in the apparatus of FIG. 2; 1... Laminate material 3.4... FPC5...
Insulating spacers A-D, A'-D'...Circuit pattern Figure 1 (A) Figure 1 (B) (A) (C) Figure 3 (B) (D) Figure 4 (A) ( B) Procedural amendment (January 24, 1986)

Claims (1)

[Claims] In an electronic device having a structure in which electronic components are connected and fixed using an adhesive, printed circuit boards are arranged facing each other, and an adhesive is used to adhesively fix the electronic components to one of the printed circuit boards and insulates a circuit pattern on the opposing board. An electronic device characterized by being provided with.