JPS61176135A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS61176135A
JPS61176135A JP60016935A JP1693585A JPS61176135A JP S61176135 A JPS61176135 A JP S61176135A JP 60016935 A JP60016935 A JP 60016935A JP 1693585 A JP1693585 A JP 1693585A JP S61176135 A JPS61176135 A JP S61176135A
Authority
JP
Japan
Prior art keywords
fuse
well
region
floating
melting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60016935A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0573058B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Takehide Shirato
猛英 白土
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP60016935A priority Critical patent/JPS61176135A/ja
Publication of JPS61176135A publication Critical patent/JPS61176135A/ja
Publication of JPH0573058B2 publication Critical patent/JPH0573058B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP60016935A 1985-01-31 1985-01-31 半導体装置 Granted JPS61176135A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60016935A JPS61176135A (ja) 1985-01-31 1985-01-31 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60016935A JPS61176135A (ja) 1985-01-31 1985-01-31 半導体装置

Publications (2)

Publication Number Publication Date
JPS61176135A true JPS61176135A (ja) 1986-08-07
JPH0573058B2 JPH0573058B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-10-13

Family

ID=11929978

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60016935A Granted JPS61176135A (ja) 1985-01-31 1985-01-31 半導体装置

Country Status (1)

Country Link
JP (1) JPS61176135A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997001188A1 (de) * 1995-06-23 1997-01-09 Siemens Aktiengesellschaft Halbleiteranordnung mit einem fuse-link und darunter angeordneter wanne

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014154674A (ja) 2013-02-07 2014-08-25 Mitsubishi Electric Corp 太陽電池モジュールおよび太陽光発電システム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997001188A1 (de) * 1995-06-23 1997-01-09 Siemens Aktiengesellschaft Halbleiteranordnung mit einem fuse-link und darunter angeordneter wanne

Also Published As

Publication number Publication date
JPH0573058B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-10-13

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees