JPS61174753U - - Google Patents
Info
- Publication number
- JPS61174753U JPS61174753U JP5852885U JP5852885U JPS61174753U JP S61174753 U JPS61174753 U JP S61174753U JP 5852885 U JP5852885 U JP 5852885U JP 5852885 U JP5852885 U JP 5852885U JP S61174753 U JPS61174753 U JP S61174753U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- utility
- registration request
- scope
- device characterized
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 claims 1
- 239000002390 adhesive tape Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5852885U JPS61174753U (fr) | 1985-04-19 | 1985-04-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5852885U JPS61174753U (fr) | 1985-04-19 | 1985-04-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61174753U true JPS61174753U (fr) | 1986-10-30 |
Family
ID=30584114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5852885U Pending JPS61174753U (fr) | 1985-04-19 | 1985-04-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61174753U (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63184392A (ja) * | 1987-01-27 | 1988-07-29 | ソニー株式会社 | 混成集積回路の実装方法 |
-
1985
- 1985-04-19 JP JP5852885U patent/JPS61174753U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63184392A (ja) * | 1987-01-27 | 1988-07-29 | ソニー株式会社 | 混成集積回路の実装方法 |