JPS61174748A - Socket for semiconductor - Google Patents

Abstract

PURPOSE:To facilitate the insertion of the outer terminal into a socket, by providing a recessed part in the head part of a socket pin, and providing a spring mechanism, by which the recessed part and the outer terminal of a semiconductor device are contacted. CONSTITUTION:A plurality of socket pins 7 are provided in a main body 1 of a socket. The inside of a tubular member 71 of each pin 7 is hollow. A pillar shaped member 72 is inserted in said inside part. A recessed part 74 is provided in the head part of the member 72. A spring 75 is provided in the inside of the member 71. An outer terminal 3 is contacted to a member 73 at the recessed part 74. At this time, even if the central axis of the terminal 3 is misaligned from the central axis of the pin 7, the terminal 3 is moved along the surface of the recessed part 74 during the downward moving process of the terminal 3. Therefore, the position is corrected so that the central lines are aligned. by the pressure of the spring 75, the electrical contact between the terminal 3 and the member 73 is kept excellently.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a socket for a semiconductor device, and particularly to a socket for a semiconductor device used when testing a semiconductor device forming a pin grid array package.

[Technical background of the invention]

In recent years, the number of external terminals in LSI packages has tended to increase due to higher integration and multifunctionality of LSIs, and bin grid array packages are usually used for LSI packages with many external terminals. FIG. 2 shows a socket conventionally used for testing and evaluating a semiconductor device forming such a pin grid array package. The socket body 1 is provided with a socket hole 4 for receiving an external terminal 3 of a pin grid array package 2. When the pin grid array package 2 is placed on the socket body 1 and the lever 5 is moved so that all the external terminals 3 are inserted into the socket holes 4, the external terminals 3 are inserted into the socket holes 4. It becomes electrically connected to the terminal 6. Since the socket terminal 6 is electrically connected to the wiring board, the external terminal 3 is eventually electrically connected to the wiring board, and the bin grid array package 2 is supported and fixed on the socket body 2. become.

(Problems with Background Art) As mentioned above, in the conventional socket, all of the external terminals 3 of the bin grid array package 2 must be inserted into the socket holes 4. However, the external terminals 3 of the bin grid array package 2 must be inserted perpendicularly from the bin grid array package 2. There is no problem with the external terminals, but bent external terminals cannot be inserted properly into the socket holes.Therefore, in order to properly insert each external terminal into the socket hole, conventionally it was necessary to manually adjust the insertion position. The more external terminals there are, the more time it takes to do this, and the labor involved in inserting them is a major drawback.Also, the disadvantage is that the insertion process cannot be automated. was also occurring.

[Purpose of the invention]

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a socket for a semiconductor device into which external terminals of a semiconductor device forming a bin grid array package can be easily inserted.

[Summary of the invention]

The present invention is characterized in that a socket for a semiconductor device forming a bin grid array package includes a cylindrical member for connecting to a wiring board, and a concave portion for electrically contacting an external terminal of the semiconductor device. a member, a columnar member fixed to the contact member and slidably supported in the longitudinal direction inside the cylindrical member, a spring member that applies pressure to the columnar member in a direction to bring the external terminal and the recess into contact; The socket body is provided with a plurality of socket pins having a diameter of 1.5 mm, thereby facilitating insertion of external terminals of a semiconductor device.

(Embodiments of the invention) The present invention will be explained below based on the embodiment shown in FIG.

As shown in FIG. 1(a), the socket body 1 is provided with a plurality of socket pins 7. As shown in FIG.

The external terminals 3 of the bin grid array 2 are placed on the tops of the socket pins 7 to ensure electrical contact, and the pin grid array 2 is supported by the main body 1 to the socket 1. Figure 1(b) shows socket pin 7.
A sectional view taken along a plane passing through the central axis is shown. Cylindrical member 7
1 has a hollow interior, and a columnar member 7 is installed inside the cavity.
2 is inserted. Therefore, this columnar member 72 becomes slidable in the longitudinal direction inside the cylindrical member 71. A contact member 73 is attached to the top of the columnar member 72. A concave portion 74 is provided at the top of the contact member 73 . This concave portion 74 is preferably conical. A spring 75 is provided inside the cylindrical member 71 and applies pressure upward in the figure to the columnar member 72 and the contact member 73.

The external terminal 3 contacts the contact member 73 through the recessed portion 74 .

At this time, even if the central axis of the external terminal 3 and the central axis of the socket pin 7 are misaligned, the external terminal 3 moves along the surface of the concave portion 740 in the process of moving downward, so that the central axes are aligned. automatically corrected. Moreover, due to the pressure of the spring 75, good electrical contact between the external terminal 3 and the contact member 73 is always maintained. In addition, the contact member 73 and the cylindrical member 7
1 is maintained well through the columnar member 72 and the spring 75. Therefore, when the columnar member 72 is connected to the wiring board, the external terminal 3 is electrically connected to the wiring board.

In this way, the external terminals 3 can be inserted into the socket by simply placing the bin grid array package 2 on the socket body 1 with rough alignment. External terminals with bent tips are automatically straightened as described above, so that all external terminals maintain good electrical contact with the socket pins. It is also possible to automate the insertion work, since there is no need for delicate manual alignment as in the past.

[Effects of the Invention] As described above, according to the present invention, in a socket for a semiconductor device, a concave portion is provided at the top of the socket pin, and a spring mechanism is further provided for bringing the concave portion into contact with an external terminal of the semiconductor device. Since the external terminals of the semiconductor device are provided, the external terminals of the semiconductor device can be easily inserted into the socket.

[Brief explanation of the drawing]

FIG. 1(a) is an explanatory diagram of an embodiment of a socket for a semiconductor device according to the present invention, FIG. 1(b) is a sectional view of a socket pin of the socket shown in FIG. 1(a), and FIG. FIG. 2 is a perspective view showing an example of a conventional socket for a semiconductor device. DESCRIPTION OF SYMBOLS 1...Socket body, 2...-bin grid array package, 3...External terminal, 4...Socket hole, 5
... lever, 6 ... socket terminal, 7 ... socket pin, 71 ... cylindrical member, 72 ... columnar member, 7
3... Contact member, 74... Concave portion, 75... Spring. Applicant's agent Kiyoshi Inomata Figure 2

Claims (1)

[Scope of Claims] 1. A semiconductor device socket for supporting and fixing a semiconductor device forming a pin grid array package while maintaining electrical connection to a wiring board, the socket having a cylindrical shape for connection to the wiring board. a contact member having a concave portion that electrically contacts an external terminal of the semiconductor device; and a columnar member fixed to the contact member and slidably supported in the longitudinal direction inside the cylindrical member. 1. A socket for a semiconductor device, characterized in that a socket main body includes a plurality of socket pins having: a spring member that applies pressure to the columnar member in a direction that brings the external terminal and the recess into contact with each other. 2. The socket for a semiconductor device according to claim 1, wherein the recessed portion has a conical shape.