JPS6117394A - Production of joined material - Google Patents

Abstract

PURPOSE:To obtain a thin sheet consisting of a hard and brittle low melting alloy joined material by depositing the 2nd layer of the 2nd component which is made into a prescribed alloy compsn. when melted to the 1st layer consisting of the 1st component. CONSTITUTION:A thin sheet or foil consisting of the 1st component such as gold is prepd. and the 2nd layer of tin, etc. having such a thickness as to provide a prescribed weight ratio is plated on the surface thereof. The thin sheet of the 1st component such as gold and the plating film of the 2nd component such as tin have the laminated structure. Required weight % of the alloy compsn. is obtd. when a test piece is manufactured from such joined material and is subjected to heating and melting. The thin sheet of the hard and brittle low melting alloy material such as gold-tin alloy is thus easily obtd. by the above-mentioned method.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of manufacturing a bonding material, and more particularly to a method of manufacturing a bonding material such as solder or brazing material for connecting conductor pins in electrical interconnection devices. It is.

Conventional technologyIn the electronic industry, IC, LSI, and thick film hybrid IC have recently been introduced.
etc. are rapidly developing. Work in the electronics industry is basically based on the technology of assembling various parts, and therefore the technology of joining parts by welding, soldering, etc. is important.

The present inventors previously provided an improved electrical connection device in Japanese Patent Application No. 67-51155.

The electrical connection device according to the invention includes a connection board made of an insulating material, a guide hole drilled through the connection board into which a contact pin of an electrical device can be inserted, and a metal formed in a part of the guide hole. It comprises a reservoir, a low melting point metal housed in the metal reservoir and used for connection between contacts, and a heating element disposed near the metal reservoir for melting the low melting point metal. It is characterized by

That is, the electrical connection device of the invention penetrates the connection board and connects the connection board to the position corresponding to the contact pins, wiring patterns, etc. of the electrical device to be connected, on the connection board made of an insulating material. A pore is drilled into which a bottle can be inserted, and a metal reservoir is provided at any point inside the pore for pooling a low melting point metal (used for connections between contacts of electrical equipment). The purpose is to achieve the desired contact connection by melting and solidifying the low melting point metal pooled in this metal reservoir by operating an attached heating element.

In the electrical connection device described above, it is desirable to use washer-type solder when bonding the contact bottle, especially gold (Au)-tin (Sn) alloy for reasons such as bonding temperature and operating temperature of the electrical connection device. is preferred. The Au-8
In n alloys, Au: so weight, Sn: 2'
OMll% is the eutectic composition, which is the most common solder composition.

However, since this Au-Sn alloy is a very hard and very brittle material, it is very difficult to perform normal plastic working such as rolling to thin the alloy. This means that it is also difficult to punch out a thin plate and process it into a washer shape.

Problems to be Solved by the Invention Therefore, the present invention solves the problem of forming a thin plate using hard and brittle solder or brazing material, which is difficult to process.

That is, the present invention can be applied to hard materials such as Au-Sn alloys.
The purpose is to easily obtain thin plates of brittle low melting point alloy joining materials.

Means for solving the problem According to the present invention, the above problem is solved by adjusting the thickness of the first layer made of the first component constituting the bonding material so that it has a predetermined alloy composition when melted. The problem is solved by a method for producing a bonding material, characterized in that a second layer consisting of at least a second component is applied.

Effects According to the present invention, there is no need to manufacture an alloy of the bonding material (for example, a eutectic alloy), and at least the alloy of the bonding material is a multilayer bond in which layers of each component are stacked in multiple layers, which is easy to process. materials can be obtained. Furthermore, during melting such as soldering or brazing, a predetermined alloy component enables the same joining as in the past.

Example The present invention will be explained in detail below.

First, a thin Au plate or foil is prepared, and the weight is Au:5n=80:20 (4:1) on the A11 surface.
79n is plated using a well-known method so that the thickness becomes as follows. In this state, it has a structure in which a thin Au plate or foil and a Sn plating film are stacked in two layers.

A test scissor piece of an appropriate shape is made from the obtained two-layer bonding material and heated and melted. First, Sn having a melting point of 232° C. is melted, and then Au is melted. This melting of Au is melt #j
As the reaction progresses at the interface between Isn and solid Au, Au, which normally does not melt until the temperature reaches 1063°C, becomes 100°C.
Melts at temperatures below 0°C. When all the Au is melted, the target alloy of 80% by weight Au and 2% by weight Sn is bonded as a whole. The method according to the present invention includes, in addition to the Au-Sn alloy, 15% by weight of Au and 85% of Pb.
It is also used for weight i% alloys.

The bonding material according to the present invention can be formed into a washer shape, for example, by creating a ring with a predetermined shape and size using a technique such as chemical etching.

In the present invention, at least the second layer can be formed by sputtering or vacuum evaporation in addition to plating as described above.

Example 1 A thin Au plate with a thickness of 40 μm was prepared, and matte Sn plating with a thickness of 10 μm was applied to one side of the thin Au plate.

The Sn plating conditions were as follows.

Bath composition: Sulfuric acid bath temperature = 20 to 25°C Anode = Sn plate Current density: 200 A/m2 A thin Au plate plated with Sn was made into an outer diameter of 0.58111111 and an inner diameter of 0.4 using ordinary photoetching technology.
I made a ring of M and used it as a washer type solder.

The washer-shaped Au-Sn solder (A
(u80% by weight, 5H2O heavy metal) to join the contact pins in the electrical connection device, and 5! i1 It was confirmed that a strong bond could be stably obtained.

Example 2 As in Example 1, a 40 μm thick Au thin plate was prepared, and matte Sn plating of 5 μm was applied to both sides of the thin plate.

A ring having the same dimensions and shape as in Example 1 was made from this substrate and washer-shaped solder was formed.

A strong bond was obtained with the resulting solder.

Effects of the Invention As explained in connection with the Au-3n alloy, according to the present invention, it is possible to easily thin the bonding material, which is as hard and brittle as the Au-Sn alloy, etc., which has been difficult to process. .

Claims (1)

[Claims] 1. A second layer made of at least a second component, the thickness of which is adjusted so as to have a predetermined alloy composition when melted, on a first layer made of the first component constituting the bonding material. A method for producing a bonding material, the method comprising depositing a bonding material on the bonding material. 2. The method of claim 1, wherein the first component is gold and the second component is tin. 3. The method according to claim 1, wherein the second layer is deposited by plating, sputtering or vacuum deposition.