JPS61173101U - - Google Patents

Info

Publication number
JPS61173101U
JPS61173101U JP5603485U JP5603485U JPS61173101U JP S61173101 U JPS61173101 U JP S61173101U JP 5603485 U JP5603485 U JP 5603485U JP 5603485 U JP5603485 U JP 5603485U JP S61173101 U JPS61173101 U JP S61173101U
Authority
JP
Japan
Prior art keywords
thin film
electrode pad
lead frame
film element
clamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5603485U
Other languages
Japanese (ja)
Other versions
JPH0314002Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5603485U priority Critical patent/JPH0314002Y2/ja
Publication of JPS61173101U publication Critical patent/JPS61173101U/ja
Application granted granted Critical
Publication of JPH0314002Y2 publication Critical patent/JPH0314002Y2/ja
Expired legal-status Critical Current

Links

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  • Details Of Resistors (AREA)
  • Thermistors And Varistors (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図〜第3図は本考案に係る電子部品の一実
施例を示し、第1図はリードフレームの正面図、
第2図は同上のリードフレームに薄膜サーミスタ
素子を固定した状態の一部拡大正面図、第3図は
同上の―線断面図、第4図は従来例の要部の
正面図、第5図は同上の―線断面図である。 1……薄膜サーミスタ素子、1d……電極パツ
ド、3……リードフレーム、3e,3e′……挾
持部。
1 to 3 show an embodiment of the electronic component according to the present invention, and FIG. 1 is a front view of a lead frame;
Fig. 2 is a partially enlarged front view of the thin film thermistor element fixed to the lead frame as above, Fig. 3 is a sectional view taken along the line - - Fig. 4 is a front view of the main parts of the conventional example, Fig. 5 is a cross-sectional view taken along the line ``--''. 1... Thin film thermistor element, 1d... Electrode pad, 3... Lead frame, 3e, 3e'... Holding portion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 一面にリード線接続用の電極パツドが形成され
た薄膜サーミスタ素子等の薄膜素子と、該薄膜素
子を挾持すると共に前記電極パツドに電気的に接
続される挾持部が先端に形成されたリードフレー
ムとより構成されてなる電子部品。
A thin film element such as a thin film thermistor element having an electrode pad for connecting a lead wire formed on one side, and a lead frame having a clamping part formed at the tip to clamp the thin film element and electrically connect to the electrode pad. Electronic components made up of
JP5603485U 1985-04-17 1985-04-17 Expired JPH0314002Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5603485U JPH0314002Y2 (en) 1985-04-17 1985-04-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5603485U JPH0314002Y2 (en) 1985-04-17 1985-04-17

Publications (2)

Publication Number Publication Date
JPS61173101U true JPS61173101U (en) 1986-10-28
JPH0314002Y2 JPH0314002Y2 (en) 1991-03-28

Family

ID=30579259

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5603485U Expired JPH0314002Y2 (en) 1985-04-17 1985-04-17

Country Status (1)

Country Link
JP (1) JPH0314002Y2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014038719A1 (en) * 2012-09-06 2014-03-13 三菱マテリアル株式会社 Temperature sensor
JP2014109503A (en) * 2012-12-03 2014-06-12 Mitsubishi Materials Corp Temperature sensor
JP2014109505A (en) * 2012-12-03 2014-06-12 Mitsubishi Materials Corp Temperature sensor

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014038719A1 (en) * 2012-09-06 2014-03-13 三菱マテリアル株式会社 Temperature sensor
JP2014052228A (en) * 2012-09-06 2014-03-20 Mitsubishi Materials Corp Temperature sensor
US9851262B2 (en) 2012-09-06 2017-12-26 Mitsubishi Materials Corporation Temperature sensor
JP2014109503A (en) * 2012-12-03 2014-06-12 Mitsubishi Materials Corp Temperature sensor
JP2014109505A (en) * 2012-12-03 2014-06-12 Mitsubishi Materials Corp Temperature sensor

Also Published As

Publication number Publication date
JPH0314002Y2 (en) 1991-03-28

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