JPH0271940U - - Google Patents

Info

Publication number
JPH0271940U
JPH0271940U JP15130388U JP15130388U JPH0271940U JP H0271940 U JPH0271940 U JP H0271940U JP 15130388 U JP15130388 U JP 15130388U JP 15130388 U JP15130388 U JP 15130388U JP H0271940 U JPH0271940 U JP H0271940U
Authority
JP
Japan
Prior art keywords
bimetal
thermistor element
bonded
heat
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15130388U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15130388U priority Critical patent/JPH0271940U/ja
Publication of JPH0271940U publication Critical patent/JPH0271940U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図〜第4図は本考案に係るバイメタル装置
の1実施例を示すもので、第1図は全体の概略図
、第2図はサーミスタ素子部分の概略図、第3図
は熱収縮性チユーブの概略図、第4図は組立工程
の概略図であり、第5図及び第6図は従来のバイ
メタル装置の説明図である。 1……正特性サーミスタ素子、2,3……電極
、4……バイメタル、5,6……リード線、9…
…熱収縮性チユーブ。
Figures 1 to 4 show one embodiment of the bimetal device according to the present invention, in which Figure 1 is a schematic diagram of the entire device, Figure 2 is a schematic diagram of the thermistor element portion, and Figure 3 is a heat-shrinkable FIG. 4 is a schematic diagram of the tube, and FIG. 4 is a schematic diagram of the assembly process, and FIGS. 5 and 6 are explanatory diagrams of a conventional bimetal device. 1... Positive characteristic thermistor element, 2, 3... Electrode, 4... Bimetal, 5, 6... Lead wire, 9...
...heat-shrinkable tube.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] サーミスタ素子が接合されたバイメタル装置で
あつて、前記サーミスタ素子の電極をバイメタル
との接合側には構成せず、かつ、このサーミスタ
素子が熱収縮性チユーブでバイメタルに接合され
たことを特徴とするバイメタル装置。
A bimetal device in which a thermistor element is bonded, characterized in that the electrode of the thermistor element is not configured on the side to be bonded to the bimetal, and the thermistor element is bonded to the bimetal with a heat-shrinkable tube. Bimetal device.
JP15130388U 1988-11-22 1988-11-22 Pending JPH0271940U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15130388U JPH0271940U (en) 1988-11-22 1988-11-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15130388U JPH0271940U (en) 1988-11-22 1988-11-22

Publications (1)

Publication Number Publication Date
JPH0271940U true JPH0271940U (en) 1990-05-31

Family

ID=31425225

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15130388U Pending JPH0271940U (en) 1988-11-22 1988-11-22

Country Status (1)

Country Link
JP (1) JPH0271940U (en)

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